Power constrained test scheduling in system-on-chip design

With the development of VLSI technologies, especially with the coming of deep sub-micron semiconductor process technologies, power dissipation becomes a critical factor that cannot be ignored either in normal operation or in test mode of digital systems. Test scheduling has to take into consideration of both test concurrency and power dissipation constraints. For satisfying high fault coverage goals with minimum test application time under certain power dissipation constraints, the testing of all components on the system should be performed in parallel as much as possible. The main objective of this thesis is to address the test-scheduling problem faced by SOC designers at system level. Through the analysis of several existing scheduling approaches, we enlarge the basis that current approaches based on to minimize test application time and propose an efficient and integrated technique for the test scheduling of SOCs under power-constraint. The proposed merging approach is based on a tree growing technique and can be used to overlay the block-test sessions in order to reduce further test application time. A number of experiments, based on academic benchmarks and industrial designs, have been carried out to demonstrate the usefulness and efficiency of the proposed approaches

OPTIMIZATION OF TEST/DIAGNOSIS/REWORK LOCATION(S) AND CHARACTERISTICS IN ELECTRONIC SYSTEMS ASSEMBLY

ABSTRACT Title of Dissertation: OPTIMIZATION OF TEST/DIAGNOSIS/REWORK LOCATION(S) AND CHARACTERISTICS IN ELECTRONIC SYSTEMS ASSEMBLY Zhen Shi, Doctor of Philosophy, 2004 Dissertation directed by: Associate Professor Peter A. Sandborn Department of Mechanical Engineering For electronic systems it is not uncommon for 60% or more of the recurring cost to be associated with testing. Performing tradeoffs associated with where in a process to test and what level of test, diagnosis and rework to perform are key to optimizing the cost and yield of an electronic system's assembly. In this dissertation, a methodology that uses a real-coded genetic algorithm has been developed to minimize the yielded cost of electronic products by optimizing the locations of test, diagnosis and rework operations and their characteristics. This dissertation presents a test, diagnosis, and rework analysis model for use in electronic systems assembly. The approach includes a model of functional test operations characterized by fault coverage, false positives, and defects introduced in test; in addition, rework and diagnosis operations (diagnostic test) have variable success rates and their own defect introduction mechanisms. The model accommodates multiple rework attempts on a product instance. For use in practical assembly processes, the model has been extended by defining a general form of the relationship between test cost and fault coverage. The model is applied within a framework for optimizing the location(s) and characteristics (fault coverage/test cost and rework attempts) of Test/Diagnosis/Rework (TDR) operations in a general assembly process. A new search algorithm called Waiting Sequence Search (WSS) is applied to traverse a general process flow to perform the cumulative calculation of a yielded cost objective function. Real-Coded Genetic Algorithms (RCGAs) are used to perform a multi-variable optimization that minimizes yielded cost. Several simple cases are analyzed for validation and general complex process flows are used to demonstrate the applicability of the algorithm. A real multichip module (MCM) manufacturing and assembly process is used to demonstrate that the optimization methodology developed in this dissertation can find test and rework solutions that have lower yielded cost than solutions calculated by manually choosing the test strategies and characteristics. The optimization methodology with Monte Carlo methods included for the process flow under uncertain inputs is also addressed in this dissertation. It is anticipated that this research will improve the ability of manufacturing engineers to place TDR operations in a process flow. The ability to optimize the TDR operations can also be used as a feedback to a Design for Test (DFT) analysis of the electronic systems showing which portion of the system should be redesigned to accommodate testing for a higher level of fault coverage, and where there is less need for test

Materials for high-density electronic packaging and interconnection

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production

Cost modelling and concurrent engineering for testable design

This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system. This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems. The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented

Development and Packaging of Microsystems Using Foundry Services

Micro-electro-mechanical systems (MEMS) are a new and rapidly growing field of research. Several advances to the MEMS state of the art were achieved through design and characterization of novel devices. Empirical and theoretical model of polysilicon thermal actuators were developed to understand their behavior. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10(exp -3)/K. The sheet resistance of the MUMPs polysilicon layers was found to be dependent on linewidth due to presence or absence of lateral phosphorus diffusion. The functional integration of MEMS with CMOS was demonstrated through the design of automated positioning and assembly systems, and a new power averaging scheme was devised. Packaging of MEMS using foundry multichip modules (MCMs) was shown to be a feasible approach to physical integration of MEMS with microelectronics. MEMS test die were packaged using Micro Module Systems MCM-D and General Electric High Density Intercounect and Chip-on-Flex MCM foundries. Xenon difluoride (XeF2) was found to be an excellent post-packaging etchant for bulk micromachined MEMS. For surface micromachining, hydrofluoric acid (HF) can be used

A Very High Level Logic Synthesis

The evolution of Computer Aided Design (CAD) calls for the incorporation of design specifications into a microelectronics system development cycle. This expansion requires the establishment of a new generation of CAD procedures, defined as Very High Level Logic Synthesis (VHLLS). The fundamental characteristics of open-ended VHLLS are: (1) front-end graphical interface; (2) time encapsulation; and (3) automatic translation into a behavioral description. Consequently, the VHLLS paradigm represents an advanced category of CAD-based microelectronics system design, built on a deep usage of expert systems and intelligent methods. Artificial Intelligence (AI) formalisms such as Knowledge Representation System (KRS) are necessary to model properties related to the very high level of specification such as: dealing with ambiguities and inconsistencies, reasoning, computing high-level specification, etc. A prototype VHLLS design suite, called Specification Procedure for Electronic Circuits in Automation Language (SPECIAL), is defined, compared with today\u27s commercial tools and verified using numerous design examples. As a result, a new family of formal and accelerated development methodologies has become feasible with a better understanding of formalized knowledge driving these design processes

Block-level test scheduling under power dissipation constraints

As dcvicc technologies such as VLSI and Multichip Module (MCM) become mature, and larger and denser memory ICs arc implemented for high-performancc digital systems, power dissipation becomes a critical factor and can no longer be ignored cither in normal operation of the system or under test conditions. One of the major considerations in test scheduling is the fact that heat dissipated during test application is significantly higher than during normal operation (sometimes 100 - 200% higher). Therefore, this is one of the recent major considerations in test scheduling. Test scheduling is strongly related to test concurrency. Test concurrency is a design property which strongly impacts testability and power dissipation. To satisfy high fault coverage goals with reduced test application time under certain power dissipation constraints, the testing of all components on the system should be performed m parallel to the greatest extent possible. Some theoretical analysis of this problem has been carried out, but only at IC level. The problem was basically described as a compatible test clustering, where the compatibility among tests was given by test resource and power dissipation conflicts at the same time. From an implementation point of view this problem was identified as an Non-Polynomial (NP) complete problem In this thesis, an efficient scheme for overlaying the block-tcsts, called the extended tree growing technique, is proposed together with classical scheduling algorithms to search for power-constrained blocktest scheduling (PTS) profiles m a polynomial time Classical algorithms like listbased scheduling and distribution-graph based scheduling arc employed to tackle at high level the PTS problem. This approach exploits test parallelism under power constraints. This is achieved by overlaying the block-tcst intervals of compatible subcircuits to test as many of them as possible concurrently so that the maximum accumulated power dissipation is balanced and does not exceed the given limit. The test scheduling discipline assumed here is the partitioned testing with run to completion. A constant additive model is employed for power dissipation analysis and estimation throughout the algorithm

Constraint-driven RF test stimulus generation and built-in test

With the explosive growth in wireless applications, the last decade witnessed an ever-increasing test challenge for radio frequency (RF) circuits. While the design community has pushed the envelope far into the future, by expanding CMOS process to be used with high-frequency wireless devices, test methodology has not advanced at the same pace. Consequently, testing such devices has become a major bottleneck in high-volume production, further driven by the growing need for tighter quality control. RF devices undergo testing during the prototype phase and during high-volume manufacturing (HVM). The benchtop test equipment used throughout prototyping is very precise yet specialized for a subset of functionalities. HVM calls for a different kind of test paradigm that emphasizes throughput and sufficiency, during which the projected performance parameters are measured one by one for each device by automated test equipment (ATE) and compared against defined limits called specifications. The set of tests required for each product differs greatly in terms of the equipment required and the time taken to test individual devices. Together with signal integrity, precision, and repeatability concerns, the initial cost of RF ATE is prohibitively high. As more functionality and protocols are integrated into a single RF device, the required number of specifications to be tested also increases, adding to the overall cost of testing, both in terms of the initial and recurring operating costs. In addition to the cost problem, RF testing proposes another challenge when these components are integrated into package-level system solutions. In systems-on-packages (SOP), the test problems resulting from signal integrity, input/output bandwidth (IO), and limited controllability and observability have initiated a paradigm shift in high-speed analog testing, favoring alternative approaches such as built-in tests (BIT) where the test functionality is brought into the package. This scheme can make use of a low-cost external tester connected through a low-bandwidth link in order to perform demanding response evaluations, as well as make use of the analog-to-digital converters and the digital signal processors available in the package to facilitate testing. Although research on analog built-in test has demonstrated hardware solutions for single specifications, the paradigm shift calls for a rather general approach in which a single methodology can be applied across different devices, and multiple specifications can be verified through a single test hardware unit, minimizing the area overhead. Specification-based alternate test methodology provides a suitable and flexible platform for handling the challenges addressed above. In this thesis, a framework that integrates ATE and system constraints into test stimulus generation and test response extraction is presented for the efficient production testing of high-performance RF devices using specification-based alternate tests. The main components of the presented framework are as follows: Constraint-driven RF alternate test stimulus generation: An automated test stimulus generation algorithm for RF devices that are evaluated by a specification-based alternate test solution is developed. The high-level models of the test signal path define constraints in the search space of the optimized test stimulus. These models are generated in enough detail such that they inherently define limitations of the low-cost ATE and the I/O restrictions of the device under test (DUT), yet they are simple enough that the non-linear optimization problem can be solved empirically in a reasonable amount of time. Feature extractors for BIT: A methodology for the built-in testing of RF devices integrated into SOPs is developed using additional hardware components. These hardware components correlate the high-bandwidth test response to low bandwidth signatures while extracting the test-critical features of the DUT. Supervised learning is used to map these extracted features, which otherwise are too complicated to decipher by plain mathematical analysis, into the specifications under test. Defect-based alternate testing of RF circuits: A methodology for the efficient testing of RF devices with low-cost defect-based alternate tests is developed. The signature of the DUT is probabilistically compared with a class of defect-free device signatures to explore possible corners under acceptable levels of process parameter variations. Such a defect filter applies discrimination rules generated by a supervised classifier and eliminates the need for a library of possible catastrophic defects.Ph.D.Committee Chair: Chatterjee, Abhijit; Committee Member: Durgin, Greg; Committee Member: Keezer, David; Committee Member: Milor, Linda; Committee Member: Sitaraman, Sures