Phase 1 of the automated array assembly task of the low cost silicon solar array project

The state of technology readiness for the automated production of solar cells and modules is reviewed. Individual process steps and process sequences for making solar cells and modules were evaluated both technically and economically. High efficiency with a suggested cell goal of 15% was stressed. It is concluded that the technology exists to manufacture solar cells which will meet program goals

High and low threshold P-channel metal oxide semiconductor process and description of microelectronics facility

The fabrication techniques and detail procedures for creating P-channel Metal-Oxide-Semiconductor (P-MOS) integrated circuits at George C. Marshall Space Flight Center (MSFC) are described. Examples of P-MOS integrated circuits fabricated at MSFC together with functional descriptions of each are given. Typical electrical characteristics of high and low threshold P-MOS discrete devices under given conditions are provided. A general description of MSFC design, mask making, packaging, and testing procedures is included. The capabilities described in this report are being utilized in: (1) research and development of new technology, (2) education of individuals in the various disciplines and technologies of the field of microelectronics, and (3) fabrication of many types of specially designed integrated circuits which are not commercially feasible in small quantities for in-house research and development programs

The bolometric focal plane array of the Polarbear CMB experiment

The Polarbear Cosmic Microwave Background (CMB) polarization experiment is currently observing from the Atacama Desert in Northern Chile. It will characterize the expected B-mode polarization due to gravitational lensing of the CMB, and search for the possible B-mode signature of inflationary gravitational waves. Its 250 mK focal plane detector array consists of 1,274 polarization-sensitive antenna-coupled bolometers, each with an associated lithographed band-defining filter. Each detector's planar antenna structure is coupled to the telescope's optical system through a contacting dielectric lenslet, an architecture unique in current CMB experiments. We present the initial characterization of this focal plane

Auto Defect Classification (ADC) Value for Patterned Wafer Inspection Systems in PLY Within a High Volume Wafer Manufacturing Fabrication Facility

The purpose of this investigation is to demonstrate value for Auto Defect Classification (ADC) for patterned wafer inspection systems within a high volume manufacturing fabrication in the Process Limited Yield (PLY) defect area. Process excursions in all functional Unit Process (UP) areas, examples are of etch, litho, diffusion, are monitored by PLY. Troubleshooting of process excursions using added defect density count with a small percentage (random or largest 50 examples) of and inline Scanning Electron Microscope (SEM) data classification review does not give a clear indication of the full wafer data. Statistical Process Control (SPC) trigging on total counts or defect density is not as powerful as making excursion decisions on classified data from ADC (Fisher, 2002). The ADC data gives classification of the entire wafer rather than a smaller sample making signature analysis to be an additional troubleshooting tool. The inline ADC data does not have near the resolution of the SEM but can be used to help make important decisions to what is occurring in the manufacturing line. The interest is to gain a full understanding of the current capabilities and limitation of ADC and to apply the learning to enable faster reaction and visibility into process and tool excursions within a high volume manufacturing fabrication. The Technical Learning Vehicle (TLV), high running product layer at the leading design rule, there were approximately 10,000 wafers a week with 1000 wafer die (chips) per wafer. A sustained improvement in yield of 1% across the entire manufacturing line would equate to almost 1 million dollars a month of saving. With the ability to tightly control multiple etch process tools, the resulting yield improvement was 3% across 15% of the line. With the baseline yield improvement along with ability to react quickly to process excursions, the combined improvement resulted in excessive of 5 million dollar a year of reoccurring savings

Developing the knowledge-based human resources that support the implementation of the National Dual Training System (NDTS): evaluation of TVET teacher's competency at MARA Training Institutions

Development in the world of technical and vocational education and training (TVET) on an ongoing basis is a challenge to the profession of the TVET-teachers to maintain their performance. The ability of teachers to identify the competencies required by their profession is very critical to enable them to make improvements in teaching and learning. For a broader perspective the competency needs of the labour market have to be matched by those developed within the vocational learning processes. Consequently, this study has focused on developing and validating the new empirical based TVET-teacher competency profile and evaluating teacher’s competency. This study combines both quantitative and qualitative research methodology that was designed to answer all the research questions. The new empirical based competency profile development and TVET-teacher evaluation was based upon an instructional design model. In addition, a modified Delphi technique has also been adopted throughout the process. Initially, 98 elements of competencies were listed by expert panel and rated by TVET institutions as important. Then, analysis using manual and statistical procedure found that 112 elements of competencies have emerged from seventeen (17) clusters of competencies. Prior to that, using the preliminary TVET-teacher competency profile, the level of TVETteacher competencies was found to be Proficient and the finding of 112 elements of competencies with 17 clusters was finally used to develop the new empirical based competency profile for MARA TVET-teacher. Mean score analysis of teacher competencies found that there were gaps in teacher competencies between MARA institutions (IKM) and other TVET institutions, where MARA-teacher was significantly better than other TVET teacher. ANOVA and t-test analysis showed that there were significant differences between teacher competencies among all TVET institutions in Malaysia. On the other hand, the study showed that teacher’s age, grade and year of experience are not significant predictors for TVET-teacher competency. In the context of mastering the competency, the study also found that three competencies are classified as most difficult or challenging, twelve competencies are classified as should be improved, and eight competencies are classified as needed to be trained. Lastly, to make NDTS implementation a reality for MARA the new empirical based competency profile and the framework for career development and training pathway were established. This Framework would serve as a significant tool to develop the knowledge based human resources needed. This will ensure that TVET-teachers at MARA are trained to be knowledgeable, competent, and professional and become a pedagogical leader on an ongoing basis towards a world class TVET-education system

Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors.

New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizing the fabrication procedures for these devices so that large-scale industrial translation is realistic. This article presents an unconventional approach for facile microfabrication and processing of adhesive-peeled (AP) flexible sensors. By assembling AP sensors on a weakly-adhering substrate in an inverted fashion, we demonstrate a procedure with 50% reduced end-to-end processing time that achieves greater levels of fabrication yield. The methodology is used to demonstrate the fabrication of electrical and mechanical flexible and stretchable AP sensors that are peeled-off their carrier substrates by consumer adhesives. In using this approach, we outline the manner by which adhesion is maintained and buckling is reduced for gold film processing on polydimethylsiloxane substrates. In addition, we demonstrate the compatibility of our methodology with large-scale post-processing using a roll-to-roll approach