Conductive lithographic films

This paper reports progress in the development of a novel fabrication technique for printing circuit board designs directly onto suitable substrates. Circuit tracks can be formed on organic or synthetic substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. The application of this work is in substitutes for conventional (copper-clad resin/laminate) circuit boards where, for low complexity circuits, directly printed substrates offer cost advantages and environmental benefits. The paper is a resume of work and results, including; ink formulation, environmental test, circuit modelling and life cycle analysis. Conductive lithographic films have now been successfully demonstrated in a telephone handset developed in conjunction with Nortel, microprocessor and microwave stripline applications. Whilst developed primarily as a low cost, low environmental impact alternative to subtractive PCB manufacture, other potential advantages such as flexibility and environmental robustness are apparent

Greening Consumer Electronics: Moving Away From Bromine and Chlorine

Presents case studies of seven electronics companies that have engineered environmental solutions that eliminate the use of most brominated and chlorinated chemicals that generate toxic materials. Discusses global standards and regulations

Manufacturing process applications team (MATeam)

Activities of the manufacturing applications team (MATeam) in effecting widespread transfer of NASA technology to aid in the solution of manufacturing problems in the industrial sector are described. During the program's first year of operation, 450 companies, industry associations, and government agencies were contacted, 150 manufacturing problems were documented, and 20 potential technology transfers were identified. Although none of the technology transfers has been commercialized and put in use, several are in the applications engineering phase, and others are in the early stages of implementation. The technology transfer process is described and guidelines used for the preparation of problems statements are included

Expanding Rapid Prototyping for Electronic Systems Integration of Arbitrary Form

An innovative method for rapid prototyping (RP) of electronic circuits with components characteristic of typical electronics applications was demonstrated using an enhanced version of a previously developed hybrid stereolithography (SL) and direct write (DW) system, where an existing SL machine was integrated with a three-axis DW fluid dispensing system for combined arbitrary form electronic systems manufacturing. This paper presents initial efforts at embedding functional electronic circuits using the hybrid SL/DW system. A simple temperature-sensitive circuit was selected, which oscillated an LED at a frequency proportional to the temperature sensed by the thermistor. The circuit was designed to incorporate all the required electronic components within a 2.5” x 2” x 0.5” SL part. Electrical interconnects between electronic components were deposited on the SL part with a DW system using silver conductive ink lines. Several inks were deposited, cured, and tested on a variety of SL resin substrates, and the E 1660 ink (Ercon Inc, Wareham, MA) was selected due to its measured lowest average resistivity on the SL substrates. The finished circuit was compared with Printed Circuit Board (PCB) technology for functionality. The electronic components used here include a low voltage battery, LM 555 timer chip, resistors, a thermistor, capacitors, and Light Emitting Diodes (LEDs). This circuit was selected because it (1) represented a simple circuit combining many typically used electronic components and thus provided a useful demonstration for integrated electronic systems manufacturing applicable to a wide variety of devices, and (2) provided an indication of the parasitic resistances and capacitances introduced by the fabrication process due to its sensitivity to manufacturing variation. The hybrid technology can help achieve significant size reductions, enable systems integration in atypical forms, a natural resistance to reverse engineering and possibly increase maximum operating temperatures of electronic circuits as compared to the traditional PCB process. This research demonstrates the ability of the hybrid SL/DW technology for fabricating combined electronic systems for unique electronics applications in which arbitrary form is a requirement and traditional PCB technology cannot be used.Mechanical Engineerin

Electrical and electronic devices and components: A compilation

Components and techniques which may be useful in the electronics industry are described. Topics discussed include transducer technology, printed-circuit technology, solid state devices, MOS transistors, Gunn device, microwave antennas, and position indicators

Lithographic technology for microwave integrated circuits

Conductive lithographic films (CLFs) have been developed primarily as substitutes for resin/laminate boards, which share properties with the metallisation patterns used in planar microwave integrated circuits (MICs). The authors examine the microwave properties of the films and show that, although the losses are greater, they have potential as an alternative to the traditional manufacturing process of MICs

Aerospace Manufacturing Industry: A Simulation-Based Decision Support Framework for the Scheduling of Complex Hoist Lines

The hoist scheduling problem is a critical issue in the design and control of Automated Manufacturing Systems. To deal with the major complexities appearing in such problem, this work introduces an advanced simulation model to represent the short-term scheduling of complex hoist lines. The aim is to find the best jobs schedule that minimizing the makespan while maximizing throughput with no defective outputs. Several hard constraints are considered in the model: single shared hoist, heterogeneous recipes, eventual recycles flows, and no buffers between workstations. Different heuristic-based strategies are incorporated into the computer model in order to improve the solutions generated over time. The alternative solutions can be quickly evaluated by using a graphical user interface developed together with the simulation model.Fil: Basán, Natalia Paola. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Santa Fe. Instituto de Desarrollo Tecnológico para la Industria Química. Universidad Nacional del Litoral. Instituto de Desarrollo Tecnológico para la Industria Química; ArgentinaFil: Pulido, Raul. Universidad Politécnica de Madrid; EspañaFil: Coccola, Mariana Evangelina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Santa Fe. Instituto de Desarrollo Tecnológico para la Industria Química. Universidad Nacional del Litoral. Instituto de Desarrollo Tecnológico para la Industria Química; ArgentinaFil: Mendez, Carlos Alberto. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Santa Fe. Instituto de Desarrollo Tecnológico para la Industria Química. Universidad Nacional del Litoral. Instituto de Desarrollo Tecnológico para la Industria Química; Argentin

Correlator computer interface and module implementation: Mark 3 processor

Two hardware aspects of the Mark 3 correlator are briefly described. The first area concerns the choice of interface to the controlling minicomputer and the second area concerns the implementation of the correlator module. Multiple computer automated measurement and control (CAMAC) modules and a single large CAMAC module were considered as possible packaging forms for the correlator. The large CAMAC module approach was chosen because of the difficulty in partitioning the correlator with minimum interconnections, the fabrication economy of a single large planar assembly, and the desire to minimize the number of modules