Automation of Determination of Optimal Intra-Compute Node Parallelism

Maximizing the productivity of modern multicore and manycore chips requires optimizing parallelism at the compute node level. This is, however, a complex multi-step process. It is an iterative method requiring determining optimal degrees of parallel scalability and optimizing memory access behavior. Further, there are multiple cases to be considered, programs which use only MPI or OpenMP and hybrid (MPI +OpenMP) programs. This paper presents a set of three coordinated workflows for determining the optimal parallelism at the program level for MPI programs and at the loop level for hybrid (MPI+OpenMP) cases. The paper also details mostly automated implementations of these workflows using the PerfExpert infrastructure. Finally the paper presents case studies demonstrating both the applicability and the effectiveness of optimizing parallelism at the compute node level. The results shown in the paper will provide valuable information to further advance in the full automation of the workflows. The software implementing the parallelism scalability optimization is open source and available for download.Texas Advanced Computing Center (TACC)Computer Science

Measurement of retinal vessel widths from fundus images based on 2-D modeling

Changes in retinal vessel diameter are an important sign of diseases such as hypertension, arteriosclerosis and diabetes mellitus. Obtaining precise measurements of vascular widths is a critical and demanding process in automated retinal image analysis as the typical vessel is only a few pixels wide. This paper presents an algorithm to measure the vessel diameter to subpixel accuracy. The diameter measurement is based on a two-dimensional difference of Gaussian model, which is optimized to fit a two-dimensional intensity vessel segment. The performance of the method is evaluated against Brinchmann-Hansen's half height, Gregson's rectangular profile and Zhou's Gaussian model. Results from 100 sample profiles show that the presented algorithm is over 30% more precise than the compared techniques and is accurate to a third of a pixel

Index to 1981 NASA Tech Briefs, volume 6, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1981 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Optimized Surface Code Communication in Superconducting Quantum Computers

Quantum computing (QC) is at the cusp of a revolution. Machines with 100 quantum bits (qubits) are anticipated to be operational by 2020 [googlemachine,gambetta2015building], and several-hundred-qubit machines are around the corner. Machines of this scale have the capacity to demonstrate quantum supremacy, the tipping point where QC is faster than the fastest classical alternative for a particular problem. Because error correction techniques will be central to QC and will be the most expensive component of quantum computation, choosing the lowest-overhead error correction scheme is critical to overall QC success. This paper evaluates two established quantum error correction codes---planar and double-defect surface codes---using a set of compilation, scheduling and network simulation tools. In considering scalable methods for optimizing both codes, we do so in the context of a full microarchitectural and compiler analysis. Contrary to previous predictions, we find that the simpler planar codes are sometimes more favorable for implementation on superconducting quantum computers, especially under conditions of high communication congestion.Comment: 14 pages, 9 figures, The 50th Annual IEEE/ACM International Symposium on Microarchitectur