Delay Measurements and Self Characterisation on FPGAs

This thesis examines new timing measurement methods for self delay characterisation of Field-Programmable Gate Arrays (FPGAs) components and delay measurement of complex circuits on FPGAs. Two novel measurement techniques based on analysis of a circuit's output failure rate and transition probability is proposed for accurate, precise and efficient measurement of propagation delays. The transition probability based method is especially attractive, since it requires no modifications in the circuit-under-test and requires little hardware resources, making it an ideal method for physical delay analysis of FPGA circuits. The relentless advancements in process technology has led to smaller and denser transistors in integrated circuits. While FPGA users benefit from this in terms of increased hardware resources for more complex designs, the actual productivity with FPGA in terms of timing performance (operating frequency, latency and throughput) has lagged behind the potential improvements from the improved technology due to delay variability in FPGA components and the inaccuracy of timing models used in FPGA timing analysis. The ability to measure delay of any arbitrary circuit on FPGA offers many opportunities for on-chip characterisation and physical timing analysis, allowing delay variability to be accurately tracked and variation-aware optimisations to be developed, reducing the productivity gap observed in today's FPGA designs. The measurement techniques are developed into complete self measurement and characterisation platforms in this thesis, demonstrating their practical uses in actual FPGA hardware for cross-chip delay characterisation and accurate delay measurement of both complex combinatorial and sequential circuits, further reinforcing their positions in solving the delay variability problem in FPGAs

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

inSense: A Variation and Fault Tolerant Architecture for Nanoscale Devices

Transistor technology scaling has been the driving force in improving the size, speed, and power consumption of digital systems. As devices approach atomic size, however, their reliability and performance are increasingly compromised due to reduced noise margins, difficulties in fabrication, and emergent nano-scale phenomena. Scaled CMOS devices, in particular, suffer from process variations such as random dopant fluctuation (RDF) and line edge roughness (LER), transistor degradation mechanisms such as negative-bias temperature instability (NBTI) and hot-carrier injection (HCI), and increased sensitivity to single event upsets (SEUs). Consequently, future devices may exhibit reduced performance, diminished lifetimes, and poor reliability. This research proposes a variation and fault tolerant architecture, the inSense architecture, as a circuit-level solution to the problems induced by the aforementioned phenomena. The inSense architecture entails augmenting circuits with introspective and sensory capabilities which are able to dynamically detect and compensate for process variations, transistor degradation, and soft errors. This approach creates ``smart\u27\u27 circuits able to function despite the use of unreliable devices and is applicable to current CMOS technology as well as next-generation devices using new materials and structures. Furthermore, this work presents an automated prototype implementation of the inSense architecture targeted to CMOS devices and is evaluated via implementation in ISCAS \u2785 benchmark circuits. The automated prototype implementation is functionally verified and characterized: it is found that error detection capability (with error windows from $\approx$30-400ps) can be added for less than 2\% area overhead for circuits of non-trivial complexity. Single event transient (SET) detection capability (configurable with target set-points) is found to be functional, although it generally tracks the standard DMR implementation with respect to overheads

Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

FPGA ARCHITECTURE AND VERIFICATION OF BUILT IN SELF-TEST (BIST) FOR 32-BIT ADDER/SUBTRACTER USING DE0-NANO FPGA AND ANALOG DISCOVERY 2 HARDWARE

The integrated circuit (IC) is an integral part of everyday modern technology, and its application is very attractive to hardware and software design engineers because of its versatility, integration, power consumption, cost, and board area reduction. IC is available in various types such as Field Programming Gate Array (FPGA), Application Specific Integrated Circuit (ASIC), System on Chip (SoC) architecture, Digital Signal Processing (DSP), microcontrollers (μC), and many more. With technology demand focused on faster, low power consumption, efficient IC application, design engineers are facing tremendous challenges in developing and testing integrated circuits that guaranty functionality, high fault coverage, and reliability as the transistor technology is shrinking to the point where manufacturing defects of ICs are affecting yield which associates with the increased cost of the part. The competitive IC market is pressuring manufactures of ICs to develop and market IC in a relatively quick turnaround which in return requires design and verification engineers to develop an integrated self-test structure that would ensure fault-free and the quality product is delivered on the market. 70-80% of IC design is spent on verification and testing to ensure high quality and reliability for the enduser. To test complex and sophisticated IC designs, the verification engineers must produce laborious and costly test fixtures which affect the cost of the part on the competitive market. To avoid increasing the part cost due to yield and test time to the end-user and to keep up with the competitive market many IC design engineers are deviating from complex external test fixture approach and are focusing on integrating Built-in Self-Test (BIST) or Design for Test (DFT) techniques onto IC’s which would reduce time to market but still guarantee high coverage for the product. Understanding the BIST, the architecture, as well as the application of IC, must be understood before developing IC. The architecture of FPGA is elaborated in this paper followed by several BIST techniques and applications of those BIST relative to FPGA, SoC, analog to digital (ADC), or digital to analog converters (DAC) that are integrated on IC. Paper is concluded with verification of BIST for the 32-bit adder/subtracter designed in Quartus II software using the Analog Discovery 2 module as stimulus and DE0-NANO FPGA board for verification

A novel high-speed trellis-coded modulation encoder/decoder ASIC design

Trellis-coded Modulation (TCM) is used in bandlimited communication systems. TCM efficiency improves coding gain by combining modulation and forward error correction coding in one process. In TCM, the bandwidth expansion is not required because it uses the same symbol rate and power spectrum; the differences are the introduction of a redundancy bit and the use of a constellation with double points. In this thesis, a novel TCM encoder/decoder ASIC chip implementation is presented. This ASIC codec not only increases decoding speed but also reduces hardware complexity. The algorithm and technique are presented for a 16-state convolutional code which is used in standard 256-QAM wireless systems. In the decoder, a Hamming distance is used as a cost function to determine output in the maximum likelihood Viterbi decoder. Using the relationship between the delay states and the path state in the Trellis tree of the code, a pre-calculated Hamming distances are stored in a look-up table. In addition, an output look-up-table is generated to determine the decoder output. This table is established by the two relative delay states in the code. The thesis provides details of the algorithm and the structure of TCM codec chip. Besides using parallel processing, the ASIC implementation also uses pipelining to further increase decoding speed. The codec was implemented in ASIC using standard 0.18ƒÝm CMOS technology; the ASIC core occupied a silicon area of 1.1mm2. All register transfer level code of the codec was simulated and synthesized. The chip layout was generated and the final chip was fabricated by Taiwan Semiconductor Manufacturing Company through the Canadian Microelectronics Corporation. The functional testing of the fabricated codec was performed partially successful; the timing testing has not been fully accomplished because the chip was not always stable

Design for testability of a latch-based design

Abstract. The purpose of this thesis was to decrease the area of digital logic in a power management integrated circuit (PMIC), by replacing selected flip-flops with latches. The thesis consists of a theory part, that provides background theory for the thesis, and a practical part, that presents a latch register design and design for testability (DFT) method for achieving an acceptable level of manufacturing fault coverage for it. The total area was decreased by replacing flip-flops of read-write and one-time programmable registers with latches. One set of negative level active primary latches were shared with all the positive level active latch registers in the same register bank. Clock gating was used to select which latch register the write data was loaded to from the primary latches. The latches were made transparent during the shift operation of partial scan testing. The observability of the latch register clock gating logic was improved by leaving the first bit of each latch register as a flip-flop. The controllability was improved by inserting control points. The latch register design, developed in this thesis, resulted in a total area decrease of 5% and a register bank area decrease of 15% compared to a flip-flop-based reference design. The latch register design manages to maintain the same stuck-at fault coverage as the reference design.Salpaperäisen piirin testattavuuden suunnittelu. Tiivistelmä. Tämän opinnäytetyön tarkoituksena oli pienentää digitaalisen logiikan pinta-alaa integroidussa tehonhallintapiirissä, korvaamalla valitut kiikut salpapiireillä. Opinnäytetyö koostuu teoriaosasta, joka antaa taustatietoa opinnäytetyölle, ja käytännön osuudesta, jossa esitellään salparekisteripiiri ja testattavuussuunnittelun menetelmä, jolla saavutettiin riittävän hyvä virhekattavuus salparekisteripiirille. Kokonaispinta-alaa pienennettiin korvaamalla luku-kirjoitusrekistereiden ja kerran ohjelmoitavien rekistereiden kiikut salpapiireillä. Yhdet negatiivisella tasolla aktiiviset isäntä-salpapiirit jaettiin kaikkien samassa rekisteripankissa olevien positiivisella tasolla aktiivisten salparekistereiden kanssa. Kellon portittamisella valittiin mihin salparekisteriin kirjoitusdata ladattiin yhteisistä isäntä-salpapireistä. Osittaisessa testipolkuihin perustuvassa testauksessa salpapiirit tehtiin läpinäkyviksi siirtooperaation aikana. Salparekisterin kellon portituslogiikan havaittavuutta parannettiin jättämällä jokaisen salparekisterin ensimmäinen bitti kiikuksi. Ohjattavuutta parannettiin lisäämällä ohjauspisteitä. Salparekisteripiiri, joka suunniteltiin tässä diplomityössä, pienensi kokonaispinta-alaa 5 % ja rekisteripankin pinta-alaa 15 % verrattuna kiikkuperäiseen vertailupiiriin. Salparekisteripiiri onnistuu pitämään saman juuttumisvikamallin virhekattavuuden kuin vertailupiiri

Scalable Energy-Recovery Architectures.

Energy efficiency is a critical challenge for today's integrated circuits, especially for high-end digital signal processing and communications that require both high throughput and low energy dissipation for extended battery life. Charge-recovery logic recovers and reuses charge using inductive elements and has the potential to achieve order-of-magnitude improvement in energy efficiency while maintaining high performance. However, the lack of large-scale high-speed silicon demonstrations and inductor area overheads are two major concerns. This dissertation focuses on scalable charge-recovery designs. We present a semi-automated design flow to enable the design of large-scale charge-recovery chips. We also present a new architecture that uses in-package inductors, eliminating the area overheads caused by the use of integrated inductors in high-performance charge-recovery chips. To demonstrate our semi-automated flow, which uses custom-designed standard-cell-like dynamic cells, we have designed a 576-bit charge-recovery low-density parity-check (LDPC) decoder chip. Functioning correctly at clock speeds above 1 GHz, this prototype is the first-ever demonstration of a GHz-speed charge-recovery chip of significant complexity. In terms of energy consumption, this chip improves over recent state-of-the-art LDPCs by at least 1.3 times with comparable or better area efficiency. To demonstrate our architecture for eliminating inductor overheads, we have designed a charge-recovery LDPC decoder chip with in-package inductors. This test-chip has been fabricated in a 65nm CMOS flip-chip process. A custom 6-layer FC-BGA package substrate has been designed with 16 inductors embedded in the fifth layer of the package substrate, yielding higher Q and significantly improving area efficiency and energy efficiency compared to their on-chip counterparts. From measurements, this chip achieves at least 2.3 times lower energy consumption with better area efficiency over state-of-the-art published designs.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/116653/1/terryou_1.pd

Degradation in FPGAs: Monitoring, Modeling and Mitigation

This dissertation targets the transistor aging degradation as well as the associated thermal challenges in FPGAs (since there is an exponential relation between aging and chip temperature). The main objectives are to perform experimentation, analysis and device-level model abstraction for modeling the degradation in FPGAs, then to monitor the FPGA to keep track of aging rates and ultimately to propose an aging-aware FPGA design flow to mitigate the aging