Optimizing mechanics and the process of fixing sensor PCB card to optics after active alignment

This report describes the development of a new fixing process when attaching a sensor PCB card to a camera assembly. The thesis focused on cameras which requires calibration to find the optimal position of the sensor PCB card, a process called active alignment. The development process applied for this thesis was derived from the Generic Development Process by Ulrich and Eppinger. Interviewees with project members and experts within Axis Communications AB were the main source of information. From the interviewees’ statements, an interpretation into customer needs was performed. Some of the more important identified needs were to simplify production and minimize the sources of error present with the current solutions. The challenges with the process of fixing the sensor PCB card were broken down to a simpler version, i.e. fixing two arbitrary components. The customer needs were used to evaluate different fixing methods and the most promising methods were selected. A concept generation process was initiated to find possible solutions within each fixing method. The most basic concepts were quickly evaluated through discussion and then later on through a concept scoring, to identify the most promising ideas. Further evaluation of these concepts included more information gathering of the fixing methods and discussions about their implementation into production. Then, the most promising concept was selected. With this concept, the details of the solution were further optimized. Through further testing, new demands of the concept were found and solved, arriving at the final specifications of the concept. The final design solution was validated through more thorough testing. The result is a new general process, which uses UV light curable adhesives. By adding a transparent silicone gasket, control over the adhesive is obtained and results in a simplified as well as significantly improved production chain

Mechanisms of urban change: Regeneration companies or development corporations?

This article is an early assessment of the role and performance of URCs, benchmarked against the UDC model. It identified weaknesses and vulnerability of URCs in relation to control over land

Digital wood craft

In 1995, Robin Evans points out in his book The Projective Cast how the development of techniques changed architecture and the space inhabited in times of Gothic and early Renaissance. We see a parallel phenomenon today, where the interplay of technology and tool gives shape to new design (Kolarevic 2005). Yet in opposition to the interwoven fields of design and craft of the late Gothic, todayis building sector is enormously diversified, and a growing complexity in the building process and number of used materials can be observed. This gives an opposite point of departure into a more integrated field of design and innovation in architectural design and building industry

CAPRG: Sequence Assembling Pipeline for Next Generation Sequencing of Non-Model Organisms

Our goal is to introduce and describe the utility of a new pipeline “Contigs Assembly Pipeline using Reference Genome” (CAPRG), which has been developed to assemble “long sequence reads” for non-model organisms by leveraging a reference genome of a closely related phylogenetic relative. To facilitate this effort, we utilized two avian transcriptomic datasets generated using ROCHE/454 technology as test cases for CAPRG assembly. We compared the results of CAPRG assembly using a reference genome with the results of existing methods that utilize de novo strategies such as VELVET, PAVE, and MIRA by employing parameter space comparisons (intra-assembling comparison). CAPRG performed as well or better than the existing assembly methods based on various benchmarks for “gene-hunting.” Further, CAPRG completed the assemblies in a fraction of the time required by the existing assembly algorithms. Additional advantages of CAPRG included reduced contig inflation resulting in lower computational resources for annotation, and functional identification for contigs that may be categorized as “unknowns” by de novo methods. In addition to providing evaluation of CAPRG performance, we observed that the different assembly (inter-assembly) results could be integrated to enhance the putative gene coverage for any transcriptomics study

Integration sequencing in complex manufacturing systems

The integration and test phase of complex manufacturing machines, like an ASML lithographic machine, are expensive and time consuming. The tests that can be performed at a certain point within the integration phase depend on the modules that are integrated. Therefore, the test sequence depends on the integration sequence. Thus, by optimizing the integration sequence of these modules, more tests can be done in parallel and valuable integration and test time can be reduced. In this paper, we introduce a mathematical model to describe an integration sequencing problem and we propose an algorithm to solve this problem optimally. Furthermore, we propose two heuristics to solve large industrial problems in limited computation time. Also, we show with a case study within the development of a lithographic machine that the described method can be used to solve real-life problems. TANGRAM, test strategy, test sequencing, manufacturing machines, semiconductor industry, integration sequencing