Power Droop Reduction In Logic BIST By Scan Chain Reordering

Significant peak power (PP), thus power droop (PD), during test is a serious concern for modern, complex ICs. In fact, the PD originated during the application of test vectors may produce a delay effect on the circuit under test signal transitions. This event may be erroneously recognized as presence of a delay fault, with consequent generation of an erroneous test fail, thus increasing yield loss. Several solutions have been proposed in the literature to reduce the PD during test of combinational ICs, while fewer approaches exist for sequential ICs. In this paper, we propose a novel approach to reduce peak power/power droop during test of sequential circuits with scan-based Logic BIST. In particular, our approach reduces the switching activity of the scan chains between following capture cycles. This is achieved by an original generation and arrangement of test vectors. The proposed approach presents a very low impact on fault coverage and test time

Design of an Efficient Design for Test (DFT) Architecture and it\u27s Verification Using Universal Verification Methodology

The complexity of the circuit design has been significantly increased from 1980’s till date, and until 80’s, due to less complexity and technology node being down to 180nm, the need for Design for Test (DFT) equipment was not as important. The few System on Chips (SoC) were tested using test patterns sent from the external test equipment. As the technology node shrunk further, the devices became faster and the complexity of S0C’s increased as the chip could accommodate more transistors. The SoC’s have become more vulnerable to physical defects. Quality factor became a major issue, which pushed the industry standard of the test coverage very high i.e. between 98% to 100%. To achieve such a high test coverage, testing the SoC’s by external test equipment demands high test time and test cost. Due to this reason, the DFT architectures within the chip have become popular demand in the industry. With the DFT architectures like Memory-Built In Self Test (MBIST) and Logic- Built In Self Test (LBIST), the memories and core logic embedded in the chip will undergo self test at the speed of functional clock and hence saving test time and test cost. Introducing DFT into the chip implies increase in area due to overhead and increase in power consumption due to additional pins. So, the DFT architectures need to be efficient. This project paper discusses about designing an efficient DFT architecture on SoC by integrating MBIST and LBIST with Joint Test Action Group-Test Access Port (JTAG-TAP) Controller and verifying using SysteVerilog (SV) and Universal Verification Methodologies (UVM) libraries. Detailed discussion of the design architecture and verification plan is included in the upcoming sections

An Efficient Implementation of Built in Self Diagnosis for Low Power Test Pattern Generator

A New architecture of Built-In Self-Diagnosis is presented in this project. The logic Built-In-Self-Test architecture method is extreme response compaction architecture. This architecture first time enables an autonomous on-chip evaluation of test responses with negligible hardware overhead. Architecture advantage is all data, which is relevant for a subsequent diagnosis, is gathered during just one test session. Due to some reasons, the existing method Built-In Self-Test is less often applied to random logic than to embedded memories.  The generation of deterministic test patterns can become prohibitively high due to hardware overhead. The diagnostic resolution of compacted test responses is in many cases poor and the overhead required for an acceptable resolution may become too high.  Modifications in Linear Feedback Shift Register to generate test pattern with security for modified Built-In-Self-Test applications with reduced power requirement. The modified Built-In-Self-Test circuit incorporates a fault syndrome compression scheme and improves the circuit speed with reduction of time

REDUCING POWER DURING MANUFACTURING TEST USING DIFFERENT ARCHITECTURES

Power during manufacturing test can be several times higher than power consumption in functional mode. Excessive power during test can cause IR drop, over-heating, and early aging of the chips. In this dissertation, three different architectures have been introduced to reduce test power in general cases as well as in certain scenarios, including field test. In the first architecture, scan chains are divided into several segments. Every segment needs a control bit to enable capture in a segment when new faults are detectable on that segment for that pattern. Otherwise, the segment should be disabled to reduce capture power. We group the control bits together into one or more control chains. To address the extra pin(s) required to shift data into the control chain(s) and significant post processing in the first architecture, we explored a second architecture. The second architecture stitches the control bits into the chains they control as EECBs (embedded enable capture bits) in between the segments. This allows an ATPG software tool to automatically generate the appropriate EECB values for each pattern to maintain the fault coverage. This also works in the presence of an on-chip decompressor. The last architecture focuses primarily on the self-test of a device in a 3D stacked IC when an existing FPGA in the stack can be programmed as a tester. We show that the energy expended during test is significantly less than would be required using low power patterns fed by an on-chip decompressor for the same very short scan chains

Testing for delay defects utilizing test data compression techniques

textAs technology shrinks new types of defects are being discovered and new fault models are being created for those defects. Transition delay and path delay fault models are two such models that have been created, but they still fall short in that they are unable to obtain a high test coverage of smaller delay defects; these defects can cause functional behavior to fail and also indicate potential reliability issues. The first part of this dissertation addresses these problems by presenting an enhanced timing-based delay fault testing technique that incorporates the use of standard delay ATPG, along with timing information gathered from standard static timing analysis. Utilizing delay fault patterns typically increases the test data volume by 3-5X when compared to stuck-at patterns. Combined with the increase in test data volume associated with the increase in gate count that typically accompanies the miniaturization of technology, this adds up to a very large increase in test data volume that directly affect test time and thus the manufacturing cost. The second part of this dissertation presents a technique for improving test compression and reducing test data volume by using multiple expansion ratios while determining the configuration of the scan chains for each of the expansion ratios using a dependency analysis procedure that accounts for structural dependencies as well as free variable dependencies to improve the probability of detecting faults. Finally, this dissertation addresses the problem of unknown values (X’s) in the output response data corrupting the data and degrading the performance of the output response compactor and thus the overall amount of test compression. Four techniques are presented that focus on handling response data with large percentages of X’s. The first uses X-canceling MISR architecture that is based on deterministically observing scan cells, and the second is a hybrid approach that combines a simple X-masking scheme with the X-canceling MISR for further gains in test compression. The third and fourth techniques revolve around reiterative LFSR X-masking, which take advantage of LFSR-encoded masks that can be reused for multiple scan slices in novel ways.Electrical and Computer Engineerin

Self-Test Mechanisms for Automotive Multi-Processor System-on-Chips

L'abstract è presente nell'allegato / the abstract is in the attachmen

DART: Dependable VLSI Test Architecture and Its Implementation

Although many electronic safety-related systems require very high reliability, it is becoming harder and harder to achieve it because of delay-related failures, which are caused by decreased noise margin. This paper describes a technology named DART and its implementation. The DART repeatedly measures the maximum delay of a circuit and the amount of degradation in field, in consequence, confirms the marginality of the circuit. The system employing the DART will be informed the significant reduction of delay margin in advance of a failure and be able to repair it at an appropriate time. The DART also equips a technique to improve the test coverage using the rotating test and a technique to consider the test environment such as temperature or voltage using novel ring-oscillator-based monitors. The authors applied the proposed technology to an industrial design and confirmed its effectiveness and availability with reasonable resources.2012 IEEE International Test Conference, 5-8 November 2012, Anaheim, CA, US

A Flexible Scan-in Power Control Method in Logic BIST and Its Evaluation with TEG Chips

High power dissipation in scan-based logic built-in self-test (LBIST) is a crucial issue that can cause over-testing, reliability degradation, chip damage, and so on. While many sophisticated approaches to low-power testing have been proposed in the past, it remains a serious problem to control the test power of LBIST to a predetermined appropriate level that matches the power requirements of the circuit-under-test. This paper proposes a novel power-control method for LBIST that can control the scan-shift power to an arbitrary level. The proposed method modifies pseudo-random patterns generated by an embedded test pattern generator (TPG) so that the modified patterns have the specific toggle rate without sacrificing fault coverage and test time. In order to evaluate the effectiveness of the proposed method, this paper shows not only simulation-based experimental results but also measurement results on test element group (TEG) chips