5,530 research outputs found

    Information limits of imaging through highly diffusive materials using spatiotemporal measurements of diffuse photons

    Get PDF
    Conventional medical imaging instruments are bulky, expensive, and use harmful ionising radiation. Combining ultrafast single-photon detectors and pulsed laser sources at optical wavelengths has the potential to offer inexpensive, safe, and potentially wearable alternatives. However, photons at optical wavelengths are strongly scattered by biological tissue, which corrupts direct imaging information about regions of absorbing interactions below the tissue surface. The work in this thesis studies the potential of measuring indirect imaging information by resolving diffuse photon measurements in space and time. The practical limits of imaging through highly diffusive material, e.g., biological tissue, is explored and validated with experimental measurements. The ill-posed problem of using the information in diffuse photon measurements to reconstruct images at the limits of the highly diffusive regime is tackled using probabilistic machine learning, demonstrating the potential of migrating diffuse optical imaging techniques beyond the currently accepted limits and underlining the importance of uncertainty quantification in reconstructions. The thesis is concluded with a challenging biomedical optics experiment to transmit photons diametrically through an adult human head. This problem was tackled experimentally and numerically using an anatomically accurate Monte Carlo simulation which uncovered key practical considerations when detecting photons at the extreme limits of the highly diffusive regime. Although the experimental measurements were inconclusive, comparisons with the numerical results were promising. More in-depth numerical simulations indicated that light could be guided in regions of low scattering and absorption to reach deep areas inside the head, and photons can, in principle, be transmitted through the entire diameter of the head. The collective evidence presented in this thesis reveals the potential of diffuse optical imaging to extend beyond the currently accepted limits to non-invasively image deep regions of the human body and brain using optical wavelengths

    A Decision Support System for Economic Viability and Environmental Impact Assessment of Vertical Farms

    Get PDF
    Vertical farming (VF) is the practice of growing crops or animals using the vertical dimension via multi-tier racks or vertically inclined surfaces. In this thesis, I focus on the emerging industry of plant-specific VF. Vertical plant farming (VPF) is a promising and relatively novel practice that can be conducted in buildings with environmental control and artificial lighting. However, the nascent sector has experienced challenges in economic viability, standardisation, and environmental sustainability. Practitioners and academics call for a comprehensive financial analysis of VPF, but efforts are stifled by a lack of valid and available data. A review of economic estimation and horticultural software identifies a need for a decision support system (DSS) that facilitates risk-empowered business planning for vertical farmers. This thesis proposes an open-source DSS framework to evaluate business sustainability through financial risk and environmental impact assessments. Data from the literature, alongside lessons learned from industry practitioners, would be centralised in the proposed DSS using imprecise data techniques. These techniques have been applied in engineering but are seldom used in financial forecasting. This could benefit complex sectors which only have scarce data to predict business viability. To begin the execution of the DSS framework, VPF practitioners were interviewed using a mixed-methods approach. Learnings from over 19 shuttered and operational VPF projects provide insights into the barriers inhibiting scalability and identifying risks to form a risk taxonomy. Labour was the most commonly reported top challenge. Therefore, research was conducted to explore lean principles to improve productivity. A probabilistic model representing a spectrum of variables and their associated uncertainty was built according to the DSS framework to evaluate the financial risk for VF projects. This enabled flexible computation without precise production or financial data to improve economic estimation accuracy. The model assessed two VPF cases (one in the UK and another in Japan), demonstrating the first risk and uncertainty quantification of VPF business models in the literature. The results highlighted measures to improve economic viability and the viability of the UK and Japan case. The environmental impact assessment model was developed, allowing VPF operators to evaluate their carbon footprint compared to traditional agriculture using life-cycle assessment. I explore strategies for net-zero carbon production through sensitivity analysis. Renewable energies, especially solar, geothermal, and tidal power, show promise for reducing the carbon emissions of indoor VPF. Results show that renewably-powered VPF can reduce carbon emissions compared to field-based agriculture when considering the land-use change. The drivers for DSS adoption have been researched, showing a pathway of compliance and design thinking to overcome the ‘problem of implementation’ and enable commercialisation. Further work is suggested to standardise VF equipment, collect benchmarking data, and characterise risks. This work will reduce risk and uncertainty and accelerate the sector’s emergence

    An aluminum optical clock setup and its evaluation using Ca+

    Get PDF
    This thesis reports about the progress of the aluminum ion clock that is set up at the German National Metrological Institute, Physikalisch-Technische Bundesanstalt (PTB) in Braunschweig. All known relevant systematic frequency shifts are discussed. The systematic shifts were measured on the co-trapped logic ion 40Ca+, which is advantageous due to its higher sensitivity to external fields compared to 27Al+. The observation of the clock transition of 27Al+ and an analysis of the detection error is described.DFG/DQ-mat/Project-ID 274200144 – SFB 1227/E

    Special Topics in Information Technology

    Get PDF
    This open access book presents thirteen outstanding doctoral dissertations in Information Technology from the Department of Electronics, Information and Bioengineering, Politecnico di Milano, Italy. Information Technology has always been highly interdisciplinary, as many aspects have to be considered in IT systems. The doctoral studies program in IT at Politecnico di Milano emphasizes this interdisciplinary nature, which is becoming more and more important in recent technological advances, in collaborative projects, and in the education of young researchers. Accordingly, the focus of advanced research is on pursuing a rigorous approach to specific research topics starting from a broad background in various areas of Information Technology, especially Computer Science and Engineering, Electronics, Systems and Control, and Telecommunications. Each year, more than 50 PhDs graduate from the program. This book gathers the outcomes of the thirteen best theses defended in 2020-21 and selected for the IT PhD Award. Each of the authors provides a chapter summarizing his/her findings, including an introduction, description of methods, main achievements and future work on the topic. Hence, the book provides a cutting-edge overview of the latest research trends in Information Technology at Politecnico di Milano, presented in an easy-to-read format that will also appeal to non-specialists

    CITIES: Energetic Efficiency, Sustainability; Infrastructures, Energy and the Environment; Mobility and IoT; Governance and Citizenship

    Get PDF
    This book collects important contributions on smart cities. This book was created in collaboration with the ICSC-CITIES2020, held in San José (Costa Rica) in 2020. This book collects articles on: energetic efficiency and sustainability; infrastructures, energy and the environment; mobility and IoT; governance and citizenship

    Modeling, Simulation and Data Processing for Additive Manufacturing

    Get PDF
    Additive manufacturing (AM) or, more commonly, 3D printing is one of the fundamental elements of Industry 4.0. and the fourth industrial revolution. It has shown its potential example in the medical, automotive, aerospace, and spare part sectors. Personal manufacturing, complex and optimized parts, short series manufacturing and local on-demand manufacturing are some of the current benefits. Businesses based on AM have experienced double-digit growth in recent years. Accordingly, we have witnessed considerable efforts in developing processes and materials in terms of speed, costs, and availability. These open up new applications and business case possibilities all the time, which were not previously in existence. Most research has focused on material and AM process development or effort to utilize existing materials and processes for industrial applications. However, improving the understanding and simulation of materials and AM process and understanding the effect of different steps in the AM workflow can increase the performance even more. The best way of benefit of AM is to understand all the steps related to that—from the design and simulation to additive manufacturing and post-processing ending the actual application.The objective of this Special Issue was to provide a forum for researchers and practitioners to exchange their latest achievements and identify critical issues and challenges for future investigations on “Modeling, Simulation and Data Processing for Additive Manufacturing”. The Special Issue consists of 10 original full-length articles on the topic

    Technologies and Applications for Big Data Value

    Get PDF
    This open access book explores cutting-edge solutions and best practices for big data and data-driven AI applications for the data-driven economy. It provides the reader with a basis for understanding how technical issues can be overcome to offer real-world solutions to major industrial areas. The book starts with an introductory chapter that provides an overview of the book by positioning the following chapters in terms of their contributions to technology frameworks which are key elements of the Big Data Value Public-Private Partnership and the upcoming Partnership on AI, Data and Robotics. The remainder of the book is then arranged in two parts. The first part “Technologies and Methods” contains horizontal contributions of technologies and methods that enable data value chains to be applied in any sector. The second part “Processes and Applications” details experience reports and lessons from using big data and data-driven approaches in processes and applications. Its chapters are co-authored with industry experts and cover domains including health, law, finance, retail, manufacturing, mobility, and smart cities. Contributions emanate from the Big Data Value Public-Private Partnership and the Big Data Value Association, which have acted as the European data community's nucleus to bring together businesses with leading researchers to harness the value of data to benefit society, business, science, and industry. The book is of interest to two primary audiences, first, undergraduate and postgraduate students and researchers in various fields, including big data, data science, data engineering, and machine learning and AI. Second, practitioners and industry experts engaged in data-driven systems, software design and deployment projects who are interested in employing these advanced methods to address real-world problems

    Cost-effective non-destructive testing of biomedical components fabricated using additive manufacturing

    Get PDF
    Biocompatible titanium-alloys can be used to fabricate patient-specific medical components using additive manufacturing (AM). These novel components have the potential to improve clinical outcomes in various medical scenarios. However, AM introduces stability and repeatability concerns, which are potential roadblocks for its widespread use in the medical sector. Micro-CT imaging for non-destructive testing (NDT) is an effective solution for post-manufacturing quality control of these components. Unfortunately, current micro-CT NDT scanners require expensive infrastructure and hardware, which translates into prohibitively expensive routine NDT. Furthermore, the limited dynamic-range of these scanners can cause severe image artifacts that may compromise the diagnostic value of the non-destructive test. Finally, the cone-beam geometry of these scanners makes them susceptible to the adverse effects of scattered radiation, which is another source of artifacts in micro-CT imaging. In this work, we describe the design, fabrication, and implementation of a dedicated, cost-effective micro-CT scanner for NDT of AM-fabricated biomedical components. Our scanner reduces the limitations of costly image-based NDT by optimizing the scanner\u27s geometry and the image acquisition hardware (i.e., X-ray source and detector). Additionally, we describe two novel techniques to reduce image artifacts caused by photon-starvation and scatter radiation in cone-beam micro-CT imaging. Our cost-effective scanner was designed to match the image requirements of medium-size titanium-alloy medical components. We optimized the image acquisition hardware by using an 80 kVp low-cost portable X-ray unit and developing a low-cost lens-coupled X-ray detector. Image artifacts caused by photon-starvation were reduced by implementing dual-exposure high-dynamic-range radiography. For scatter mitigation, we describe the design, manufacturing, and testing of a large-area, highly-focused, two-dimensional, anti-scatter grid. Our results demonstrate that cost-effective NDT using low-cost equipment is feasible for medium-sized, titanium-alloy, AM-fabricated medical components. Our proposed high-dynamic-range strategy improved by 37% the penetration capabilities of an 80 kVp micro-CT imaging system for a total x-ray path length of 19.8 mm. Finally, our novel anti-scatter grid provided a 65% improvement in CT number accuracy and a 48% improvement in low-contrast visualization. Our proposed cost-effective scanner and artifact reduction strategies have the potential to improve patient care by accelerating the widespread use of patient-specific, bio-compatible, AM-manufactured, medical components

    FiabilitĂ© de l’underfill et estimation de la durĂ©e de vie d’assemblages microĂ©lectroniques

    Get PDF
    Abstract : In order to protect the interconnections in flip-chip packages, an underfill material layer is used to fill the volumes and provide mechanical support between the silicon chip and the substrate. Due to the chip corner geometry and the mismatch of coefficient of thermal expansion (CTE), the underfill suffers from a stress concentration at the chip corners when the temperature is lower than the curing temperature. This stress concentration leads to subsequent mechanical failures in flip-chip packages, such as chip-underfill interfacial delamination and underfill cracking. Local stresses and strains are the most important parameters for understanding the mechanism of underfill failures. As a result, the industry currently relies on the finite element method (FEM) to calculate the stress components, but the FEM may not be accurate enough compared to the actual stresses in underfill. FEM simulations require a careful consideration of important geometrical details and material properties. This thesis proposes a modeling approach that can accurately estimate the underfill delamination areas and crack trajectories, with the following three objectives. The first objective was to develop an experimental technique capable of measuring underfill deformations around the chip corner region. This technique combined confocal microscopy and the digital image correlation (DIC) method to enable tri-dimensional strain measurements at different temperatures, and was named the confocal-DIC technique. This techique was first validated by a theoretical analysis on thermal strains. In a test component similar to a flip-chip package, the strain distribution obtained by the FEM model was in good agreement with the results measured by the confocal-DIC technique, with relative errors less than 20% at chip corners. Then, the second objective was to measure the strain near a crack in underfills. Artificial cracks with lengths of 160 ÎŒm and 640 ÎŒm were fabricated from the chip corner along the 45° diagonal direction. The confocal-DIC-measured maximum hoop strains and first principal strains were located at the crack front area for both the 160 ÎŒm and 640 ÎŒm cracks. A crack model was developed using the extended finite element method (XFEM), and the strain distribution in the simulation had the same trend as the experimental results. The distribution of hoop strains were in good agreement with the measured values, when the model element size was smaller than 22 ÎŒm to capture the strong strain gradient near the crack tip. The third objective was to propose a modeling approach for underfill delamination and cracking with the effects of manufacturing variables. A deep thermal cycling test was performed on 13 test cells to obtain the reference chip-underfill delamination areas and crack profiles. An artificial neural network (ANN) was trained to relate the effects of manufacturing variables and the number of cycles to first delamination of each cell. The predicted numbers of cycles for all 6 cells in the test dataset were located in the intervals of experimental observations. The growth of delamination was carried out on FEM by evaluating the strain energy amplitude at the interface elements between the chip and underfill. For 5 out of 6 cells in validation, the delamination growth model was consistent with the experimental observations. The cracks in bulk underfill were modelled by XFEM without predefined paths. The directions of edge cracks were in good agreement with the experimental observations, with an error of less than 2.5°. This approach met the goal of the thesis of estimating the underfill initial delamination, areas of delamination and crack paths in actual industrial flip-chip assemblies.Afin de protĂ©ger les interconnexions dans les assemblages, une couche de matĂ©riau d’underfill est utilisĂ©e pour remplir le volume et fournir un support mĂ©canique entre la puce de silicium et le substrat. En raison de la gĂ©omĂ©trie du coin de puce et de l’écart du coefficient de dilatation thermique (CTE), l’underfill souffre d’une concentration de contraintes dans les coins lorsque la tempĂ©rature est infĂ©rieure Ă  la tempĂ©rature de cuisson. Cette concentration de contraintes conduit Ă  des dĂ©faillances mĂ©caniques dans les encapsulations de flip-chip, telles que la dĂ©lamination interfaciale puce-underfill et la fissuration d’underfill. Les contraintes et dĂ©formations locales sont les paramĂštres les plus importants pour comprendre le mĂ©canisme des ruptures de l’underfill. En consĂ©quent, l’industrie utilise actuellement la mĂ©thode des Ă©lĂ©ments finis (EF) pour calculer les composantes de la contrainte, qui ne sont pas assez prĂ©cises par rapport aux contraintes actuelles dans l’underfill. Ces simulations nĂ©cessitent un examen minutieux de dĂ©tails gĂ©omĂ©triques importants et des propriĂ©tĂ©s des matĂ©riaux. Cette thĂšse vise Ă  proposer une approche de modĂ©lisation permettant d’estimer avec prĂ©cision les zones de dĂ©lamination et les trajectoires des fissures dans l’underfill, avec les trois objectifs suivants. Le premier objectif est de mettre au point une technique expĂ©rimentale capable de mesurer la dĂ©formation de l’underfill dans la rĂ©gion du coin de puce. Cette technique, combine la microscopie confocale et la mĂ©thode de corrĂ©lation des images numĂ©riques (DIC) pour permettre des mesures tridimensionnelles des dĂ©formations Ă  diffĂ©rentes tempĂ©ratures, et a Ă©tĂ© nommĂ©e le technique confocale-DIC. Cette technique a d’abord Ă©tĂ© validĂ©e par une analyse thĂ©orique en dĂ©formation thermique. Dans un Ă©chantillon similaire Ă  un flip-chip, la distribution de la dĂ©formation obtenues par le modĂšle EF Ă©tait en bon accord avec les rĂ©sultats de la technique confocal-DIC, avec des erreurs relatives infĂ©rieures Ă  20% au coin de puce. Ensuite, le second objectif est de mesurer la dĂ©formation autour d’une fissure dans l’underfill. Des fissures artificielles d’une longueuer de 160 ÎŒm et 640 ÎŒm ont Ă©tĂ© fabriquĂ©es dans l’underfill vers la direction diagonale de 45°. Les dĂ©formations circonfĂ©rentielles maximales et principale maximale Ă©taient situĂ©es aux pointes des fissures correspondantes. Un modĂšle de fissure a Ă©tĂ© dĂ©veloppĂ© en utilisant la mĂ©thode des Ă©lĂ©ments finis Ă©tendue (XFEM), et la distribution des contraintes dans la simuation a montrĂ© la mĂȘme tendance que les rĂ©sultats expĂ©rimentaux. La distribution des dĂ©formations circonfĂ©rentielles maximales Ă©tait en bon accord avec les valeurs mesurĂ©es lorsque la taille des Ă©lĂ©ments Ă©tait plus petite que 22 ÎŒm, assez petit pour capturer le grand gradient de dĂ©formation prĂšs de la pointe de fissure. Le troisiĂšme objectif Ă©tait d’apporter une approche de modĂ©lisation de la dĂ©lamination et de la fissuration de l’underfill avec les effets des variables de fabrication. Un test de cyclage thermique a d’abord Ă©tĂ© effectuĂ© sur 13 cellules pour obtenir les zones dĂ©laminĂ©es entre la puce et l’underfill, et les profils de fissures dans l’underfill, comme rĂ©fĂ©rence. Un rĂ©seau neuronal artificiel (ANN) a Ă©tĂ© formĂ© pour Ă©tablir une liaison entre les effets des variables de fabrication et le nombre de cycles Ă  la dĂ©lamination pour chaque cellule. Les nombres de cycles prĂ©dits pour les 6 cellules de l’ensemble de test Ă©taient situĂ©s dans les intervalles d’observations expĂ©rimentaux. La croissance de la dĂ©lamination a Ă©tĂ© rĂ©alisĂ©e par l’EF en Ă©valuant l’énergie de la dĂ©formation au niveau des Ă©lĂ©ments interfaciaux entre la puce et l’underfill. Pour 5 des 6 cellules de la validation, le modĂšle de croissance du dĂ©laminage Ă©tait conforme aux observations expĂ©rimentales. Les fissures dans l’underfill ont Ă©tĂ© modĂ©lisĂ©es par XFEM sans chemins prĂ©dĂ©finis. Les directions des fissures de bord Ă©taient en bon accord avec les observations expĂ©rimentales, avec une erreur infĂ©rieure Ă  2,5°. Cette approche a rĂ©pondu Ă  la problĂ©matique qui consiste Ă  estimer l’initiation des dĂ©lamination, les zones de dĂ©lamination et les trajectoires de fissures dans l’underfill pour des flip-chips industriels
    • 

    corecore