Fast algorithms for retiming large digital circuits

The increasing complexity of VLSI systems and shrinking time to market requirements demand good optimization tools capable of handling large circuits. Retiming is a powerful transformation that preserves functionality, and can be used to optimize sequential circuits for a wide range of objective functions by judiciously relocating the memory elements. Leiserson and Saxe, who introduced the concept, presented algorithms for period optimization (minperiod retiming) and area optimization (minarea retiming). The ASTRA algorithm proposed an alternative view of retiming using the equivalence between retiming and clock skew optimization;The first part of this thesis defines the relationship between the Leiserson-Saxe and the ASTRA approaches and utilizes it for efficient minarea retiming of large circuits. The new algorithm, Minaret, uses the same linear program formulation as the Leiserson-Saxe approach. The underlying philosophy of the ASTRA approach is incorporated to reduce the number of variables and constraints in this linear program. This allows minarea retiming of circuits with over 56,000 gates in under fifteen minutes;The movement of flip-flops in control logic changes the state encoding of finite state machines, requiring the preservation of initial (reset) states. In the next part of this work the problem of minimizing the number of flip-flops in control logic subject to a specified clock period and with the guarantee of an equivalent initial state, is formulated as a mixed integer linear program. Bounds on the retiming variables are used to guarantee an equivalent initial state in the retimed circuit. These bounds lead to a simple method for calculating an equivalent initial state for the retimed circuit;The transparent nature of level sensitive latches enables level-clocked circuits to operate faster and require less area. However, this transparency makes the operation of level-clocked circuits very complex, and optimization of level-clocked circuits is a difficult task. This thesis also presents efficient algorithms for retiming large level-clocked circuits. The relationship between retiming and clock skew optimization for level-clocked circuits is defined and utilized to develop efficient retiming algorithms for period and area optimization. Using these algorithms a circuit with 56,000 gates could be retimed for minimum period in under twenty seconds and for minimum area in under 1.5 hours

暗号ハードウェアの形式的設計に関する研究

Tohoku University青木孝文課

High Level Synthesis for Packet Processing Pipelines

Packet processing is an essential function of state-of-the-art network routers and switches. Implementing packet processors in pipelined architectures is a well-known, established technique, albeit different approaches have been proposed. The design of packet processing pipelines is a delicate trade-off between the desire for abstract specifications, short development time, and design maintainability on one hand and very aggressive performance requirements on the other. This thesis proposes a coherent design flow for packet processing pipelines. Like the design process itself, I start by introducing a novel domain-specific language that provides a high-level specification of the pipeline. Next, I address synthesizing this model and calculating its worst-case throughput. Finally, I address some specific circuit optimization issues. I claim, based on experimental results, that my proposed technique can dramatically improve the design process of these pipelines, while the resulting performance matches the expectations of hand-crafted design. The considered pipelines exhibit a pseudo-linear topology, which can be too restrictive in the general case. However, especially due to its high performance, such an architecture may be suitable for applications outside packet processing, in which case some of my proposed techniques could be easily adapted. Since I ran my experiments on FPGAs, this work has an inherent bias towards that technology; however, most results are technology-independent

High-Performance Hardware and Software Implementations of the Cyclic Redundancy Check Computation

The Cyclic Redundancy Check (CRC) is an error detection code used in many digital transmission and storage systems. The two major research areas surrounding CRCs concern developing computation approaches and studying error detection properties. This thesis aims to explore the various aspects of the CRC computation, with the primary objective being to propose novel computation approaches which outperform the existing ones. The work begins with a thorough examination of the formulations found throughout the literature. Then, their subsequent realizations as hardware architectures and software algorithms are investigated. During this investigation, some improvements are presented including optimizations of the state-space trans­ formed and primitive architectures. Afterward, novel formulations are derived and the most significant contribution consists of a matrix decomposition that gives rise to a high-performance software algorithm. Simulation and implementation results are gathered for both hardware and software deployments of the investigated computa­ tion approaches. The theoretical results obtained by simulations are validated with implementation experiments. The proposed algorithm is shown to outperform the existing comparable low-memory algorithm in terms of time complexity

Doctor of Philosophy

dissertationThis dissertation explores three key facets of software algorithms for custom hardware ray tracing: primitive intersection, shading, and acceleration structure construction. For the first, primitive intersection, we show how nearly all of the existing direct three-dimensional (3D) ray-triangle intersection tests are mathematically equivalent. Based on this, a genetic algorithm can automatically tune a ray-triangle intersection test for maximum speed on a particular architecture. We also analyze the components of the intersection test to determine how much floating point precision is required and design a numerically robust intersection algorithm. Next, for shading, we deconstruct Perlin noise into its basic parts and show how these can be modified to produce a gradient noise algorithm that improves the visual appearance. This improved algorithm serves as the basis for a hardware noise unit. Lastly, we show how an existing bounding volume hierarchy can be postprocessed using tree rotations to further reduce the expected cost to traverse a ray through it. This postprocessing also serves as the basis for an efficient update algorithm for animated geometry. Together, these contributions should improve the efficiency of both software- and hardware-based ray tracers

A built-in self-test technique for high speed analog-to-digital converters

Fundação para a Ciência e a Tecnologia (FCT) - PhD grant (SFRH/BD/62568/2009

Applications in Electronics Pervading Industry, Environment and Society

This book features the manuscripts accepted for the Special Issue “Applications in Electronics Pervading Industry, Environment and Society—Sensing Systems and Pervasive Intelligence” of the MDPI journal Sensors. Most of the papers come from a selection of the best papers of the 2019 edition of the “Applications in Electronics Pervading Industry, Environment and Society” (APPLEPIES) Conference, which was held in November 2019. All these papers have been significantly enhanced with novel experimental results. The papers give an overview of the trends in research and development activities concerning the pervasive application of electronics in industry, the environment, and society. The focus of these papers is on cyber physical systems (CPS), with research proposals for new sensor acquisition and ADC (analog to digital converter) methods, high-speed communication systems, cybersecurity, big data management, and data processing including emerging machine learning techniques. Physical implementation aspects are discussed as well as the trade-off found between functional performance and hardware/system costs

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Formal Analysis of Arithmetic Circuits using Computer Algebra - Verification, Abstraction and Reverse Engineering

Despite a considerable progress in verification and abstraction of random and control logic, advances in formal verification of arithmetic designs have been lagging. This can be attributed mostly to the difficulty in an efficient modeling of arithmetic circuits and datapaths without resorting to computationally expensive Boolean methods, such as Binary Decision Diagrams (BDDs) and Boolean Satisfiability (SAT), that require “bit blasting”, i.e., flattening the design to a bit-level netlist. Approaches that rely on computer algebra and Satisfiability Modulo Theories (SMT) methods are either too abstract to handle the bit-level nature of arithmetic designs or require solving computationally expensive decision or satisfiability problems. The work proposed in this thesis aims at overcoming the limitations of analyzing arithmetic circuits, specifically at the post-synthesized phase. It addresses the verification, abstraction and reverse engineering problems of arithmetic circuits at an algebraic level, treating an arithmetic circuit and its specification as a properly constructed algebraic system. The proposed technique solves these problems by function extraction, i.e., by deriving arithmetic function computed by the circuit from its low-level circuit implementation using computer algebraic rewriting technique. The proposed techniques work on large integer arithmetic circuits and finite field arithmetic circuits, up to 512-bit wide containing millions of logic gates

Cross-Layer Pathfinding for Off-Chip Interconnects

Off-chip interconnects for integrated circuits (ICs) today induce a diverse design space, spanning many different applications that require transmission of data at various bandwidths, latencies and link lengths. Off-chip interconnect design solutions are also variously sensitive to system performance, power and cost metrics, while also having a strong impact on these metrics. The costs associated with off-chip interconnects include die area, package (PKG) and printed circuit board (PCB) area, technology and bill of materials (BOM). Choices made regarding off-chip interconnects are fundamental to product definition, architecture, design implementation and technology enablement. Given their cross-layer impact, it is imperative that a cross-layer approach be employed to architect and analyze off-chip interconnects up front, so that a top-down design flow can comprehend the cross-layer impacts and correctly assess the system performance, power and cost tradeoffs for off-chip interconnects. Chip architects are not exposed to all the tradeoffs at the physical and circuit implementation or technology layers, and often lack the tools to accurately assess off-chip interconnects. Furthermore, the collaterals needed for a detailed analysis are often lacking when the chip is architected; these include circuit design and layout, PKG and PCB layout, and physical floorplan and implementation. To address the need for a framework that enables architects to assess the system-level impact of off-chip interconnects, this thesis presents power-area-timing (PAT) models for off-chip interconnects, optimization and planning tools with the appropriate abstraction using these PAT models, and die/PKG/PCB co-design methods that help expose the off-chip interconnect cross-layer metrics to the die/PKG/PCB design flows. Together, these models, tools and methods enable cross-layer optimization that allows for a top-down definition and exploration of the design space and helps converge on the correct off-chip interconnect implementation and technology choice. The tools presented cover off-chip memory interfaces for mobile and server products, silicon photonic interfaces, 2.5D silicon interposers and 3D through-silicon vias (TSVs). The goal of the cross-layer framework is to assess the key metrics of the interconnect (such as timing, latency, active/idle/sleep power, and area/cost) at an appropriate level of abstraction by being able to do this across layers of the design flow. In additional to signal interconnect, this thesis also explores the need for such cross-layer pathfinding for power distribution networks (PDN), where the system-on-chip (SoC) floorplan and pinmap must be optimized before the collateral layouts for PDN analysis are ready. Altogether, the developed cross-layer pathfinding methodology for off-chip interconnects enables more rapid and thorough exploration of a vast design space of off-chip parallel and serial links, inter-die and inter-chiplet links and silicon photonics. Such exploration will pave the way for off-chip interconnect technology enablement that is optimized for system needs. The basis of the framework can be extended to cover other interconnect technology as well, since it fundamentally relates to system-level metrics that are common to all off-chip interconnects