Multiport VNA Measurements

This article presents some of the most recent multiport VNA measurement methodologies used to characterize these highspeed digital networks for signal integrity. There will be a discussion of the trends and measurement challenges of high-speed digital systems, followed by a presentation of the multiport VNA measurement system details, calibration, and measurement techniques, as well as some examples of interconnect device measurements. The intent here is to present some general concepts and trends for multiport VNA measurements as applied to computer system board-level interconnect structures, and not to promote any particular brand or produc

2X-Thru, 1X-Reflection, and Thru-Line de-embedding: Theory, sensitivity analysis, and error corrections

Due to the simplicity of design and measurement, as well as the accuracy of results, the 2X-Thru de-embedding (2XTD), 1X-Reflection de-embedding (1XRD), and Thru-Line de-embedding (TLD) have been replaced the traditional de-embedding algorithms, such as TRL and SOLT. In this dissertation, theory of 2n-port 2XTD, 1XRD, and TLD are completely derived first. The self-error reduction schemes is introduced to mitigate the de-embedding errors due to non-ideal manufacturing effects of non-zero mode conversion terms, as well as the asymmetric, and manufacturing variations. The validations are performed on both theory and self-error reduction through simulation and measurements cases. The 2X-Thru de-embedding (2XTD) is discussed in details. The prevailing 2X-Thru de-embedding (2XTD) requires much less calibration standards, yet still maintain the high accuracy of de-embedded results. Nevertheless every de-embedding method is based on the rigorous mathematical derivations, the manufacturing variations are inevitable. IEEE P370 committee provided the manufactured test coupons with golden standard to test the accuracy of different de-embedding methods when considering the manufacturing variations. Such manufacturing variations are propagated to the de-embedded results through the sensitivity of the test fixtures. The error reductions scheme in this section mitigates the de-embedded errors by correcting some of the manufacturing variations in the algorithm. This section will focus on the three kinds of manufacturing variations: 1) test fixture asymmetry; 2) the perturbations of the test fixtures in the calibration structure of 2X-Thru and de-embedding structure of Total; 3) the mode conversion terms due to the manufacturing variations --Abstract, page iv

De-embedding method comparisons and physics based circuit model for high frequency D-probe

In section 1, the procedures of 1X-Reflect smart fixture de-embedding (SFD), 1-port auto fixture removal (AFR), and 2X-Thru SFD are compared from various perspectives: test fixture design, the de-embedding procedure, and de-embedded results. The accuracy of fixture characterization and the de-embedded result is the key figure of merit (FOM) in each de-embedding method. Full wave models are built to evaluate the FOM of the three methods, by comparing the scattering parameters (S-parameters) and time domain reflectometer (TDR). A test coupon for measuring USB-C cables is adopted to serve as a manufactured validation purpose. In section 2, a physics-based circuit model for a novel differential probe without a nearby ground pin is built up to 20GHz. First, the SFD method is used to obtain the S-parameter of a differential probe in a full wave model to validate the effectiveness of this method. Second, real measurements are made to obtain the S-parameter of a differential probe. Furthermore, the one-to-one corresponding circuit model has been built to understand the physics of probes. A layout for the advance interconnect test tool (AITT) demo board is then designed to test probe characteristics and AITT software. Finally, the SFD method is applied to de-embed the test fixtures, and material information is extracted based on the de-embedded results --Abstract, page iii

The Deformable Mirror Demonstration Mission (DeMi) CubeSat: optomechanical design validation and laboratory calibration

Coronagraphs on future space telescopes will require precise wavefront correction to detect Earth-like exoplanets near their host stars. High-actuator count microelectromechanical system (MEMS) deformable mirrors provide wavefront control with low size, weight, and power. The Deformable Mirror Demonstration Mission (DeMi) payload will demonstrate a 140 actuator MEMS deformable mirror (DM) with \SI{5.5}{\micro\meter} maximum stroke. We present the flight optomechanical design, lab tests of the flight wavefront sensor and wavefront reconstructor, and simulations of closed-loop control of wavefront aberrations. We also present the compact flight DM controller, capable of driving up to 192 actuator channels at 0-250V with 14-bit resolution. Two embedded Raspberry Pi 3 compute modules are used for task management and wavefront reconstruction. The spacecraft is a 6U CubeSat (30 cm x 20 cm x 10 cm) and launch is planned for 2019.Comment: 15 pages, 10 figues. Presented at SPIE Astronomical Telescopes + Instrumentation, Austin, Texas, US

Wideband characterization of printed circuit board materials up to 50 GHz

A traveling-wave technique developed a few years ago in the Missouri S&T EMC Laboratory has been employed until now for characterization of PCB materials over a broad frequency range up to 30 GHz. This technique includes measuring S-parameters of the specially designed PCB test vehicles. An extension of the frequency range of printed circuit board laminate dielectric and copper foil characterization is an important problem. In this work, a new PCB test vehicle design for operating up to 50 GHz has been proposed. As the frequency range of measurements increases, the analysis of errors and uncertainties in measuring dielectric properties becomes increasingly important. Formulas for quantification of two major groups of errors, repeatability (manufacturing variability) and reproducibility (systematic) errors, in extracting dielectric constant (DK) and dissipation factor (DK) have been derived, and computations for a number of cases are presented. Conductor (copper foil) surface roughness of PCB interconnects is an important factor, which affects accuracy of DK and DF measurements. This work describes a new algorithm for semi-automatic characterization of copper foil profiles on optical or scanning electron microscopy (SEM) pictures of signal traces. The collected statistics of numerous copper foil roughness profiles allows for introducing a new metric for roughness characterization of PCB interconnects. This is an important step to refining the measured DK and DF parameters from roughness contributions. The collected foil profile data and its analysis allow for developing design curves , which could be used by SI engineers and electronics developers in their designs --Abstract, page iii

Wideband characterization of printed circuit board materials up to 50 GHz

A traveling-wave technique developed a few years ago in the Missouri S&T EMC Laboratory has been employed until now for characterization of PCB materials over a broad frequency range up to 30 GHz. This technique includes measuring S-parameters of the specially designed PCB test vehicles. An extension of the frequency range of printed circuit board laminate dielectric and copper foil characterization is an important problem. In this work, a new PCB test vehicle design for operating up to 50 GHz has been proposed. As the frequency range of measurements increases, the analysis of errors and uncertainties in measuring dielectric properties becomes increasingly important. Formulas for quantification of two major groups of errors, repeatability (manufacturing variability) and reproducibility (systematic) errors, in extracting dielectric constant (DK) and dissipation factor (DK) have been derived, and computations for a number of cases are presented. Conductor (copper foil) surface roughness of PCB interconnects is an important factor, which affects accuracy of DK and DF measurements. This work describes a new algorithm for semi-automatic characterization of copper foil profiles on optical or scanning electron microscopy (SEM) pictures of signal traces. The collected statistics of numerous copper foil roughness profiles allows for introducing a new metric for roughness characterization of PCB interconnects. This is an important step to refining the measured DK and DF parameters from roughness contributions. The collected foil profile data and its analysis allow for developing design curves , which could be used by SI engineers and electronics developers in their designs --Abstract, page iii

High-frequency characterization of embedded components in printed circuit boards

The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the faster the signal transmission can occur. Different high-frequency aspects of chip embedding are investigated within this dissertation: interconnections to the embedded chip, crosstalk between signals on the chip and on the board, and interconnections running on top of or underneath embedded components. The high-frequency behavior of tracks running near embedded components is described using a broadband model for multilayer microstrip transmission lines. The proposed model can be used to predict the characteristic impedance and the loss of the lines. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The per-unit-length shunt impedance parameters are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of a frequency-dependent effective height that can be used to determine the per-unit-length resistance and inductance. A deliberate choice was made for a simple but accurate model that could easily be implemented in current high-frequency circuit simulators. Next to quasi-static electromagnetic simulations, a dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model. The verification of the model using simulation and measurements shows that the proposed model slightly overestimates the loss of the measured multilayer microstrips, but is more accurate than the simulations in predicting the characteristic impedance

FIRI - a Far-Infrared Interferometer

Half of the energy ever emitted by stars and accreting objects comes to us in the FIR waveband and has yet to be properly explored. We propose a powerful Far-InfraRed Interferometer mission, FIRI, to carry out high-resolution imaging spectroscopy in the FIR. This key observational capability is essential to reveal how gas and dust evolve into stars and planets, how the first luminous objects in the Universe ignited, how galaxies formed, and when super-massive black holes grew. FIRI will disentangle the cosmic histories of star formation and accretion onto black holes and will trace the assembly and evolution of quiescent galaxies like our Milky Way. Perhaps most importantly, FIRI will observe all stages of planetary system formation and recognise Earth-like planets that may harbour life, via its ability to image the dust structures in planetary systems. It will thus address directly questions fundamental to our understanding of how the Universe has developed and evolved - the very questions posed by ESA's Cosmic Vision.Comment: Proposal developed by a large team of astronomers from Europe, USA and Canada and submitted to the European Space Agency as part of "Cosmic Vision 2015-2025