Analysis and Design of Low-Cost Waveguide Filters for Wireless Communications

The area of research of this thesis is built around advanced waveguide filter structures. Waveguide filters and the waveguide technology in general are renowned for high power capacity, low losses and excellent electromagnetic shielding. Waveguide filters are important components in fixed wireless communications as well as in satellite and radar systems. Furthermore, their advantages and utilization become even greater with increase in frequency, which is a trend in modern communication systems because upper frequency bands offer larger channel capacities. However, waveguide filters are relatively bulky and expensive. To comply with more and more demanding miniaturization and cost-cutting requirements, compactness and economical design represent some of the main contemporary focuses of interest. Approaches that are used to achieve this include use of planar inserts to build waveguide discontinuities, additive manufacturing and substrate integration. At the same time, waveguide filters still need to satisfy opposed stringent requirements like small insertion loss, high selectivity and multiband operation. Another difficulty that metal waveguide components face is integration with other circuitry, especially important when solid-state active devices are included. Thus, improvements of interconnections between waveguide and other transmission interfaces are addressed too. The thesis elaborates the following aspects of work: Further analysis and improved explanations regarding advanced waveguide filters with E-plane inserts developed by the Wireless Communications Research Group, using both cross coupled resonators and extracted pole sections (Experiments with higher filter orders, use of tuning screws, degrees of freedom in design, etc. Thorough performance comparison with competing filter technologies) - Proposing novel E-plane filter sections with I-shaped insets - Extension of the E-plane filtering structures with metal fins to new compact dual band filters with high frequency selectivity and miniaturized diplexers. - Introduction of easy-to-build waveguide filters with polymer insert frames and high-performance low-profile cavity filters, taking advantage of enhanced fabrication capabilities when using additive manufacturing - Developing new substrate integrated filters, as well as circuits used to transfer signals between different interfaces Namely, these are substrate integrated waveguide to metal waveguide planar transitions that do not require any modifications of the metal waveguides. Such novel transitions have been designed both for single and orthogonal signal polarizations

Review of Ultrasonic Ranging Methods and Their Current Challenges

Ultrasonic ranging has been widely used in automobiles, unmanned aerial vehicles (UAVs), robots and other fields. With the appearance of micromachined ultrasonic transducers (MUTs), the application of ultrasonic ranging technology presents a more extensive trend. This review focuses on ultrasonic ranging technology and its development history and future trend. Going through the state-of-the-art ultrasonic ranging methods, this paper covers the principles of each method, the signal processing methodologies, the overall system performance as well as key ultrasonic transducer parameters. Moreover, the error sources and compensation methods of ultrasonic ranging systems are discussed. This review aims to give an overview of the ultrasonic ranging technology including its current development and challenges

Developments of thick-metal inductors and applications to reactive lumped-element low-pass filter circuits

Strong demands for smaller, cheaper, and multifunction wireless systems have put very stringent requirements on passive devices, such as inductors and capacitors. This is especially true considering the size and weight of most radio frequency (RF) transceivers are mainly due to passives. RF micro-electro-mechanical-systems (MEMS) passives are addressing this issue by offering lower power consumption and losses, higher linearity and quality (Q)-factors, potential for integration and miniaturization, and batch fabrication. These advantages position RF MEMS passives as good candidates to replace conventional passives. Further, they also open an opportunity for using the passives as building blocks for lumped element-based RF circuits (e.g. Flters, couplers, etc.) which could replace the more-bulky distributed-element circuits. This thesis presents the design, simulation, fabrication using the deep X-ray lithography process, and testing of thick-metal RF inductors and their applications to lumped-element low-pass Filter (LPF) circuits. The 70-um tall single-turn loop inductors are structurally compatible to a pre-existing RF MEMS capacitor concept and allow the two device types to be fabricated together. This compatibility issue is crucial if they would be used to construct more complex RF circuits. At a 50-Ohm inductive reactance point, test results show Q-factors of 17- 55, self-resonant frequencies (SRF) exceeding 11 GHz, and nominal inductances of 0.4- 3 nH for 1-loop inductors and Q-factors of 11- 42, SRFs of 4- 22 GHz, and inductances of 0.8- 5.5 nH for 2-loop inductors. Further, test results reveal that high conductivity metals improve the Q-factors, and that low dielectric-constant substrates increase the SRFs. In terms of LPFs, measurements show that they demonstrate the expected third-order Chebyshev response. Two nickel Filters on a quartz glass substrate show a 0.6-dB ripple with 3-dB frequencies (f-3dB) of 6.1 GHz and 11.9 GHz respectively. On an alumina substrate, they exhibit a 1.4-dB ripple with f-3dB of 5.4 GHz and 10.6 GHz respectively. The filters are 203- 285 um tall and feature 6- 6.5 um wide capacitance air gaps. These dimensions are different than the original designs and the filter performances were shown to be somewhat sensitive to these discrepancies. Compared to a distributed approach, the lumped-element implementations led to an area reduction of up to 95%

Measuring Level of Degradation in Power Semiconductor Devices using Emerging Techniques

Title from PDF of title page viewed May 24, 2021Dissertation advisor: Faisal KhanVitaIncludes bibliographical references (page 124-154)Thesis (Ph.D.)--School of Computing and Engineering and Department of Mathematics and Statistics, University of Missouri--Kansas City, 2021High thermal and electrical stress, over a period of time tends to deteriorate the health of power electronic switches. Being a key element in any high-power converter systems, power switches such as insulated-gate bipolar junction transistors (IGBTs) and metal-oxide semiconductor field-effect transistors (MOSFETs) are constantly monitored to predict when and how they might fail. A huge fraction of research efforts involves the study of power electronic device reliability and development of novel techniques with higher accuracy in health estimation of such devices. Until today, no other existing techniques can determine the number of lifted bond wires and their locations in a live IGBT module, although this information is extremely helpful to understand the overall state of health (SOH) of an IGBT power module. Through this research work, two emerging methods for online condition monitoring of power IGBTs and MOSFETs have been proposed. First method is based on reflectometry, more specifically, spread spectrum time domain reflectometry (SSTDR) and second method is based on ultrasound based non-destructive evaluation (NDE). Unlike traditional methods, the proposed methods do not require measuring any electrical parameters (such as voltage or current), therefore, minimizes the measurement error. In addition, both of these methods are independent of the operating points of the converter which makes the application of these methods more feasible for any field application. As part of the research, the RL-equivalent circuit to represent the bond wires of an IGBT module has been developed for the device under test. In addition, an analytical model of ultrasound interaction with the bond wires has been derived in order to efficiently detect the bond wire lift offs within the IGBT power module. Both of these methods are equally applicable to the wide band gap (WBG) power devices and power converters. The successful implementation of these methods creates a provision for condition monitoring (CM) hardware embedded gate driver module which will significantly reduce the overall health monitoring cost.Introduction -- Failure mechanisms of modern power electronic devices -- Existing degradation detection & lifetime prediction techniques -- Accelerated aging methods -- SSTDR based degradation detection -- Ultrasound based degradation -- Degradation detection of wide band gap power devices -- Conclusions and future researc

Radar Technology

In this book “Radar Technology”, the chapters are divided into four main topic areas: Topic area 1: “Radar Systems” consists of chapters which treat whole radar systems, environment and target functional chain. Topic area 2: “Radar Applications” shows various applications of radar systems, including meteorological radars, ground penetrating radars and glaciology. Topic area 3: “Radar Functional Chain and Signal Processing” describes several aspects of the radar signal processing. From parameter extraction, target detection over tracking and classification technologies. Topic area 4: “Radar Subsystems and Components” consists of design technology of radar subsystem components like antenna design or waveform design

Single-Chip Scanning Probe Microscopes

Scanning probe microscopes (SPMs) are the highest resolution imaging instruments available today and are among the most important tools in nanoscience. Conventional SPMs suffer from several drawbacks owing to their large and bulky construction and to the use of piezoelectric materials. Large scanners have low resonant frequencies that limit their achievable imaging bandwidth and render them susceptible to disturbance from ambient vibrations. Array approaches have been used to alleviate the bandwidth bottleneck; however as arrays are scaled upwards, the scanning speed must decline to accommodate larger payloads. In addition, the long mechanical path from the tip to the sample contributes thermal drift. Furthermore, intrinsic properties of piezoelectric materials result in creep and hysteresis, which contribute to image distortion. The tip-sample interaction signals are often measured with optical configurations that require large free-space paths, are cumbersome to align, and add to the high cost of state-of-the-art SPM systems. These shortcomings have stifled the widespread adoption of SPMs by the nanometrology community. Tiny, inexpensive, fast, stable and independent SPMs that do not incur bandwidth penalties upon array scaling would therefore be most welcome. The present research demonstrates, for the first time, that all of the mechanical and electrical components that are required for the SPM to capture an image can be scaled and integrated onto a single CMOS chip. Principles of microsystem design are applied to produce single-chip instruments that acquire images of underlying samples on their own, without the need for off-chip scanners or sensors. Furthermore, it is shown that the instruments enjoy a multitude of performance benefits that stem from CMOS-MEMS integration and volumetric scaling of scanners by a factor of 1 million. This dissertation details the design, fabrication and imaging results of the first single-chip contact-mode AFMs, with integrated piezoresistive strain sensing cantilevers and scanning in three degrees-of-freedom (DOFs). Static AFMs and quasi-static AFMs are both reported. This work also includes the development, fabrication and imaging results of the first single-chip dynamic AFMs, with integrated flexural resonant cantilevers and 3 DOF scanning. Single-chip Amplitude Modulation AFMs (AM-AFMs) and Frequency Modulation AFMs (FM-AFMs) are both shown to be capable of imaging samples without the need for any off-chip sensors or actuators. A method to increase the quality factor (Q-factor) of flexural resonators is introduced. The method relies on an internal energy pumping mechanism that is based on the interplay between electrical, mechanical, and thermal effects. To the best of the author’s knowledge, the devices that are designed to harness these effects possess the highest electromechanical Qs reported for flexural resonators operating in air; electrically measured Q is enhanced from ~50 to ~50,000 in one exemplary device. A physical explanation for the underlying mechanism is proposed. The design, fabrication, imaging, and tip-based lithographic patterning with the first single-chip Scanning Thermal Microscopes (SThMs) are also presented. In addition to 3 DOF scanning, these devices possess integrated, thermally isolated temperature sensors to detect heat transfer in the tip-sample region. Imaging is reported with thermocouple-based devices and patterning is reported with resistive heater/sensors. An “isothermal electrothermal scanner” is designed and fabricated, and a method to operate it is detailed. The mechanism, based on electrothermal actuation, maintains a constant temperature in a central location while positioning a payload over a range of >35μm, thereby suppressing the deleterious thermal crosstalk effects that have thus far plagued thermally actuated devices with integrated sensors. In the thesis, models are developed to guide the design of single-chip SPMs and to provide an interpretation of experimental results. The modelling efforts include lumped element model development for each component of single-chip SPMs in the electrical, thermal and mechanical domains. In addition, noise models are developed for various components of the instruments, including temperature-based position sensors, piezoresistive cantilevers, and digitally controlled positioning devices

ΔE-Effect Magnetic Field Sensors

Many conceivable biomedical and diagnostic applications require the detection of small-amplitude and low-frequency magnetic fields. Against this background, a magnetometer concept is investigated in this work based on the magnetoelastic ΔE effect. The ΔE effect causes the resonance frequency of a magnetoelastic resonator to detune in the presence of a magnetic field, which can be read-out electrically with an additional piezoelectric phase. Various microelectromechanical resonators are experimentally analyzed in terms of the ΔE effect and signal-and-noise response. This response is highly complex because of the anisotropic and nonlinear coupled magnetic, mechanical, and electrical properties. Models are developed and extended where necessary to gain insights into the potentials and limits accompanying sensor design and operating parameters. Beyond the material and geometry parameters, we analyze the effect of different resonance modes, spatial property variations, and operating frequencies on sensitivity. Although a large ΔE effect is confirmed in the shear modulus, the sensitivity of classical cantilever resonators does not benefit from this effect. An approach utilizing surface acoustic shear-waves provides a solution and can detect small signals over a large bandwidth. Comprehensive analyses of the quality factor and piezoelectric material parameters indicate methods to increase sensitivity and signal-to-noise ratio significantly. First exchange-biased ΔE-effect sensors pave the way for compact setups and arrays with a large number of sensor elements. With an extended signal-and-noise model, specific requirements are identified that could improve the signal-to-noise ratio. The insights gained lead to a new concept that can circumvent previous limitations. With the results and models, important contributions are made to the understanding and development of ΔE-effect sensors with prospects for improvements in the future

Язык и мировая культура: взгляд молодых исследователей. Ч. 1

В сборнике представлены материалы выступлений участников XV Всероссийской научно-практической конференции «Язык и мировая культура: взгляд молодых исследователей», проведённой 24-27 апреля 2015 года кафедрой иностранных языков Энергетического института Национального исследовательского Томского политехнического университета. Настоящий сборник объединяет исследовательские проекты аспирантов и преподавателей языковых кафедр и содержит материалы, представляющие широкий круг научно учебных интересов в парадигме современных гуманитарных знаний, и включает, в основном, вопросы теории и практики преподавания иностранных языков. Сборник адресован аспирантам и преподавателям, а также всем, кого интересует теория и методика профессионального образования, методика обучения иностранным языкам, изучение языков в их взаимосвязи с философией, литературой, историей и культурой