Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Automatic synthesis and optimization of chip multiprocessors

The microprocessor technology has experienced an enormous growth during the last decades. Rapid downscale of the CMOS technology has led to higher operating frequencies and performance densities, facing the fundamental issue of power dissipation. Chip Multiprocessors (CMPs) have become the latest paradigm to improve the power-performance efficiency of computing systems by exploiting the parallelism inherent in applications. Industrial and prototype implementations have already demonstrated the benefits achieved by CMPs with hundreds of cores.CMP architects are challenged to take many complex design decisions. Only a few of them are:- What should be the ratio between the core and cache areas on a chip?- Which core architectures to select?- How many cache levels should the memory subsystem have?- Which interconnect topologies provide efficient on-chip communication?These and many other aspects create a complex multidimensional space for architectural exploration. Design Automation tools become essential to make the architectural exploration feasible under the hard time-to-market constraints. The exploration methods have to be efficient and scalable to handle future generation on-chip architectures with hundreds or thousands of cores.Furthermore, once a CMP has been fabricated, the need for efficient deployment of the many-core processor arises. Intelligent techniques for task mapping and scheduling onto CMPs are necessary to guarantee the full usage of the benefits brought by the many-core technology. These techniques have to consider the peculiarities of the modern architectures, such as availability of enhanced power saving techniques and presence of complex memory hierarchies.This thesis has several objectives. The first objective is to elaborate the methods for efficient analytical modeling and architectural design space exploration of CMPs. The efficiency is achieved by using analytical models instead of simulation, and replacing the exhaustive exploration with an intelligent search strategy. Additionally, these methods incorporate high-level models for physical planning. The related contributions are described in Chapters 3, 4 and 5 of the document.The second objective of this work is to propose a scalable task mapping algorithm onto general-purpose CMPs with power management techniques, for efficient deployment of many-core systems. This contribution is explained in Chapter 6 of this document.Finally, the third objective of this thesis is to address the issues of the on-chip interconnect design and exploration, by developing a model for simultaneous topology customization and deadlock-free routing in Networks-on-Chip. The developed methodology can be applied to various classes of the on-chip systems, ranging from general-purpose chip multiprocessors to application-specific solutions. Chapter 7 describes the proposed model.The presented methods have been thoroughly tested experimentally and the results are described in this dissertation. At the end of the document several possible directions for the future research are proposed

Skybridge: A New Nanoscale 3-D Computing Framework for Future Integrated Circuits

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, continuing the traditional way of scaling to sub-20nm technologies is proving to be very difficult as MOSFETs are reaching their fundamental performance limits [1] and interconnection bottleneck is dominating IC operational power and performance [2]. Migrating to 3-D, as a way to advance scaling, has been elusive due to inherent customization and manufacturing requirements in CMOS architecture that are incompatible with 3-D organization. Partial attempts with die-die [3] and layer-layer [4] stacking have their own limitations [5]. We propose a new 3-D IC fabric technology, Skybridge [6], which offers paradigm shift in technology scaling as well as design. We co-architect Skybridge’s core aspects, from device to circuit style, connectivity, thermal management, and manufacturing pathway in a 3-D fabric-centric manner, building on a uniform 3-D template. Our extensive bottom-up simulations, accounting for detailed material system structures, manufacturing process, device, and circuit parasitics, carried through for several designs including a designed microprocessor, reveal a 30-60x density, 3.5x performance/watt benefits, and 10x reduction in interconnect lengths vs. scaled 16-nm CMOS [6]. Fabric-level heat extraction features are found to be effective in managing IC thermal profiles in 3-D. This 3-D integrated fabric proposal overcomes the current impasse of CMOS in a manner that can be immediately adopted, and offers unique solution to continue technology scaling in the 21st century

Skybridge: 3-D Integrated Circuit Technology Alternative to CMOS

Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are reaching their fundamental limits and interconnection bottleneck is dominating IC operational power and performance. Migrating to 3-D, as a way to advance scaling, has eluded us due to inherent customization and manufacturing requirements in CMOS that are incompatible with 3-D organization. Partial attempts with die-die and layer-layer stacking have their own limitations. We propose a 3-D IC fabric technology, Skybridge[TM], which offers paradigm shift in technology scaling as well as design. We co-architect Skybridge's core aspects, from device to circuit style, connectivity, thermal management, and manufacturing pathway in a 3-D fabric-centric manner, building on a uniform 3-D template. Our extensive bottom-up simulations, accounting for detailed material system structures, manufacturing process, device, and circuit parasitics, carried through for several designs including a designed microprocessor, reveal a 30-60x density, 3.5x performance per watt benefits, and 10X reduction in interconnect lengths vs. scaled 16-nm CMOS. Fabric-level heat extraction features are shown to successfully manage IC thermal profiles in 3-D. Skybridge can provide continuous scaling of integrated circuits beyond CMOS in the 21st century.Comment: 53 Page

Effects of Communication Protocol Stack Offload on Parallel Performance in Clusters

The primary research objective of this dissertation is to demonstrate that the effects of communication protocol stack offload (CPSO) on application execution time can be attributed to the following two complementary sources. First, the application-specific computation may be executed concurrently with the asynchronous communication performed by the communication protocol stack offload engine. Second, the protocol stack processing can be accelerated or decelerated by the offload engine. These two types of performance effects can be quantified with the use of the degree of overlapping Do and degree of acceleration Daccs. The composite communication speedup metrics S_comm(Do, Daccs) can be used in order to quantify the combined effects of the protocol stack offload. This dissertation thesis is validated empirically. The degree of overlapping Do, the degree of acceleration Daccs, and the communication speedup Scomm characteristic of the system configurations under test are derived in the course of experiments performed for the system configurations of interest. It is shown that the proposed metrics adequately describe the effects of the protocol stack offload on the application execution time. Additionally, a set of analytical models of the networking subsystem of a PC-based cluster node is developed. As a result of the modeling, the metrics Do, Daccs, and Scomm are obtained. The models are evaluated as to their complexity and precision by comparing the modeling results with the measured values of Do, Daccs, and Scomm. The primary contributions of this dissertation research are as follows. First, the metric Daccs and Scomm are introduced in order to complement the Do metric in its use for evaluation of the effects of optimizations in the networking subsystem on parallel performance in clusters. The metrics are shown to adequately describe CPSO performance effects. Second, a method for assessing performance effects of CPSO scenarios on application performance is developed and presented. Third, a set of analytical models of cluster node networking subsystems with CPSO capability is developed and characterised as to their complexity and precision of the prediction of the Do and Daccs metrics

Predictive Reliability and Fault Management in Exascale Systems: State of the Art and Perspectives

© ACM, 2020. This is the author's version of the work. It is posted here by permission of ACM for your personal use. Not for redistribution. The definitive version was published in ACM Computing Surveys, Vol. 53, No. 5, Article 95. Publication date: September 2020. https://doi.org/10.1145/3403956[EN] Performance and power constraints come together with Complementary Metal Oxide Semiconductor technology scaling in future Exascale systems. Technology scaling makes each individual transistor more prone to faults and, due to the exponential increase in the number of devices per chip, to higher system fault rates. Consequently, High-performance Computing (HPC) systems need to integrate prediction, detection, and recovery mechanisms to cope with faults efficiently. This article reviews fault detection, fault prediction, and recovery techniques in HPC systems, from electronics to system level. We analyze their strengths and limitations. Finally, we identify the promising paths to meet the reliability levels of Exascale systems.This work has received funding from the European Union's Horizon 2020 (H2020) research and innovation program under the FET-HPC Grant Agreement No. 801137 (RECIPE). Jaume Abella was also partially supported by the Ministry of Economy and Competitiveness of Spain under Contract No. TIN2015-65316-P and under Ramon y Cajal Postdoctoral Fellowship No. RYC-2013-14717, as well as by the HiPEAC Network of Excellence. Ramon Canal is partially supported by the Generalitat de Catalunya under Contract No. 2017SGR0962.Canal, R.; Hernández Luz, C.; Tornero-Gavilá, R.; Cilardo, A.; Massari, G.; Reghenzani, F.; Fornaciari, W.... (2020). Predictive Reliability and Fault Management in Exascale Systems: State of the Art and Perspectives. ACM Computing Surveys. 53(5):1-32. https://doi.org/10.1145/3403956S132535Abella, J., Hernandez, C., Quinones, E., Cazorla, F. J., Conmy, P. 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