A Low-power CMOS 2-PPM Demodulator for Energy Detection IR-UWB Receivers

This paper presents an integrated 2-PPM CMOS demodulator for non-coherent energy detection receivers which inherently provides analog-to-digital conversion. The device, called Bi-phase integrator, employs an open loop Gm - C integrator loaded with a switched capacitor network. The circuit has been simulated in a mixed-mode UMC 0.18mum technology and its performance figures are obtained through a mixed-signal simulation environment developed with the aid of ADVanceMS (ADMS, mentor graphics). Bit-error-rate simulations show that the circuit performance is about the same of an ideal energy detection receiver employing infinite quantization resolution. In addition, the simulations show that the circuit provides a complete offset rejection. Thanks to its low power consumption (1 mW during demodulation), its application is appealing for portable devices which aim at very low-power consumption

Simulation of intrinsic parameter fluctuations in decananometer and nanometer-scale MOSFETs

Intrinsic parameter fluctuations introduced by discreteness of charge and matter will play an increasingly important role when semiconductor devices are scaled to decananometer and nanometer dimensions in next-generation integrated circuits and systems. In this paper, we review the analytical and the numerical simulation techniques used to study and predict such intrinsic parameters fluctuations. We consider random discrete dopants, trapped charges, atomic-scale interface roughness, and line edge roughness as sources of intrinsic parameter fluctuations. The presented theoretical approach based on Green's functions is restricted to the case of random discrete charges. The numerical simulation approaches based on the drift diffusion approximation with density gradient quantum corrections covers all of the listed sources of fluctuations. The results show that the intrinsic fluctuations in conventional MOSFETs, and later in double gate architectures, will reach levels that will affect the yield and the functionality of the next generation analog and digital circuits unless appropriate changes to the design are made. The future challenges that have to be addressed in order to improve the accuracy and the predictive power of the intrinsic fluctuation simulations are also discussed

Systematic Comparison of HF CMOS Transconductors

Transconductors are commonly used as active elements in high-frequency (HF) filters, amplifiers, mixers, and oscillators. This paper reviews transconductor design by focusing on the V-I kernel that determines the key transconductor properties. Based on bandwidth considerations, simple V-I kernels with few or no internal nodes are preferred. In a systematic way, virtually all simple kernels published in literature are generated. This is done in two steps: 1) basic 3-terminal transconductors are covered and 2) then five different techniques to combine two of them in a composite V-I kernel. In order to compare transconductors in a fair way, a normalized signal-to-noise ratio (NSNR) is defined. The basic V-I kernels and the five classes of composite V-I kernels are then compared, leading to insight in the key mechanisms that affect NSNR. Symbolic equations are derived to estimate NSNR, while simulations with more advanced MOSFET models verify the results. The results show a strong tradeoff between NSNR and transconductance tuning range. Resistively generated MOSFETs render the best NSNR results and are robust for future technology developments

MOSFET zero-temperature-coefficient (ZTC) effect modeling anda analysis for low thermal sensitivity analog applications

Continuing scaling of Complementary Metal-Oxide-Semiconductor (CMOS) technologies brings more integration and consequently temperature variation has become more aggressive into a single die. Besides, depending on the application, room ambient temperature may also vary. Therefore, procedures to decrease thermal dependencies of eletronic circuit performances become an important issue to include in both digital and analog Integrated Circuits (IC) design flow. The main purpose of this thesis is to present a design methodology for a typical CMOS Analog design flow to make circuits as insensitivity as possible to temperature variation. MOSFET Zero Temperature Coefficient (ZTC) and Transconductance Zero Temperature Coefficient (GZTC) bias points are modeled to support it. These are used as reference to deliver a set of equations that explains to analog designers how temperature will change transistor operation and hence the analog circuit behavior. The special bias conditions are analyzed using a MOSFET model that is continuous from weak to strong inversion, and both are proven to occur always from moderate to strong inversion operation in any CMOS fabrication process. Some circuits are designed using proposed methodology: two new ZTC-based current references, two new ZTC-based voltage references and four classical Gm-C circuits biased at GZTC bias point (or defined here as GZTC-C filters). The first current reference is a Self-biased CMOS Current Reference (ZSBCR), which generates a current reference of 5 A. It is designed in an 180 nm process, operating with a supply voltage from 1.4V to 1.8 V and occupying around 0:010mm2 of silicon area. From circuit simulations the reference shows an effective temperature coefficient (TCeff ) of 15 ppm/oC from 45 to +85oC, and a fabrication process sensitivity of = = 4:5%, including average process and local mismatch. Simulated power supply sensitivity is estimated around 1%/V. The second proposed current reference is a Resistorless Self-Biased ZTC Switched Capacitor Current Reference (ZSCCR). It is also designed in an 180 nm process, resulting a reference current of 5.88 A under a supply voltage of 1.8 V, and occupying a silicon area around 0:010mm2. Results from circuit simulation show an TCeff of 60 ppm/oC from -45 to +85 oC and a power consumption of 63 W. The first proposed voltage reference is an EMI Resisting MOSFET-Only Voltage Reference (EMIVR), which generates a voltage reference of 395 mV. The circuit is designed in a 130 nm process, occupying around 0.0075 mm2 of silicon area while consuming just 10.3 W. Post-layout simulations present a TCeff of 146 ppm/oC, for a temperature range from 55 to +125oC. An EMI source of 4 dBm (1 Vpp amplitude) injected into the power supply of circuit, according to Direct Power Injection (DPI) specification results in a maximum DC Shift and Peak-to-Peak ripple of -1.7 % and 35.8m Vpp, respectively. The second proposed voltage reference is a 0.5V Schottky-based Voltage Reference (SBVR). It provides three voltage reference outputs, each one utilizing different threshold voltage MOSFETs (standard-VT , low-VT , and zero-VT ), all available in adopted 130 nm CMOS process. This design results in three different and very low reference voltages: 312, 237, and 51 mV, presenting a TCeff of 214, 372, and 953 ppm/oC in a temperature range from -55 to 125oC, respectively. It occupies around 0.014 mm2 of silicon area for a total power consumption of 5.9 W. Lastly, a few example Gm-C circuits are designed using GZTC technique: a single-ended resistor emulator, an impedance inverter, a first order and a second order filter. These circuits are simulated in a 130 nm CMOS commercial process, resulting improved thermal stability in the main performance parameters, in the range from 27 to 53 ppm/°C.A contínua miniaturização das tecnologias CMOS oferece maior capacidade de integração e, consequentemente, as variações de temperatura dentro de uma pastilha de silício têm se apresentado cada vez mais agressivas. Ademais, dependendo da aplicação, a temperatura ambiente a qual o CHIP está inserido pode variar. Dessa maneira, procedimentos para diminuir o impacto dessas variações no desempenho do circuito são imprescindíveis. Tais métodos devem ser incluídos em ambos fluxos de projeto CMOS, analógico e digital, de maneira que o desempenho do sistema se mantenha estável quando a temperatura oscilar. A ideia principal desta dissertação é propor uma metodologia de projeto CMOS analógico que possibilite circuitos com baixa dependência térmica. Como base fundamental desta metodologia, o efeito de coeficiente térmico nulo no ponto de polarização da corrente de dreno (ZTC) e da transcondutância (GZTC) do MOSFET são analisados e modelados. Tal modelamento é responsável por entregar ao projetista analógico um conjunto de equações que esclarecem como a temperatura influencia o comportamento do transistor e, portanto, o comportamento do circuito. Essas condições especiais de polarização são analisadas usando um modelo de MOSFET que é contínuo da inversão fraca para forte. Além disso, é mostrado que as duas condições ocorrem em inversão moderada para forte em qualquer processo CMOS. Algumas aplicações são projetadas usando a metodologia proposta: duas referências de corrente baseadas em ZTC, duas referências de tensão baseadas em ZTC, e quatro circuitos gm-C polarizados em GZTC. A primeira referência de corrente é uma Corrente de Referência CMOS Auto-Polarizada (ZSBCR), que gera uma referência de 5uA. Projetada em CMOS 180 nm, a referência opera com uma tensão de alimentação de 1.4 à 1.8 V, ocupando uma área em torno de 0:010mm2. Segundo as simulações, o circuito apresenta um coeficiente de temperatura efetivo (TCeff ) de 15 ppm/oC para -45 à +85 oC e uma sensibilidade à variação de processo de = = 4:5% incluindo efeitos de variabilidade dos tipos processo e descasamento local. A sensibilidade de linha encontrada nas simulações é de 1%=V . A segunda referência de corrente proposta é uma Corrente de Referência Sem Resistor Auto-Polarizada com Capacitor Chaveado (ZSCCR). O circuito é projetado também em 180 nm, resultando em uma corrente de referência de 5.88 A, para uma tensão de alimentação de 1.8 V, e ocupando uma área de 0:010mm2. Resultados de simulações mostram um TCeff de 60 ppm/oC para um intervalo de temperatura de -45 à +85 oC e um consumo de potência de 63 W. A primeira referência de tensão proposta é uma Referência de Tensão resistente à pertubações eletromagnéticas contendo apenas MOSFETs (EMIVR), a qual gera um valor de referência de 395 mV. O circuito é projetado no processo CMOS 130 nm, ocupando em torno de 0.0075 mm2 de área de silício, e consumindo apenas 10.3 W. Simulações pós-leiaute apresentam um TCeff de 146 ppm/oC, para um intervalo de temperatura de 55 à +125oC. Uma fonte EMI de 4 dBm (1 Vpp de amplitude) aplicada na alimentação do circuito, de acordo com o padrão Direct Power Injection (DPI), resulta em um máximo de desvio DC e ondulação Pico-à-Pico de -1.7 % e 35.8m Vpp, respectivamente. A segunda referência de tensão é uma Tensão de Referência baseada em diodo Schottky com 0.5V de alimentação (SBVR). Ela gera três saídas, cada uma utilizando MOSFETs com diferentes tensões de limiar (standard-VT , low-VT , e zero-VT ). Todos disponíveis no processo adotado CMOS 130 nm. Este projeto resulta em três diferentes voltages de referências: 312, 237, e 51 mV, apresentando um TCeff de 214, 372, e 953 ppm/oC no intervalo de temperatura de -55 à 125oC, respectivamente. O circuito ocupa em torno de 0.014 mm2, consumindo um total de 5.9 W. Por último, circuitos gm-C são projetados usando o conceito GZTC: um emulador de resistor, um inversor de impedância, um filtro de primeira ordem e um filtro de segunda ordem. Os circuitos também são simulados no processo CMOS 130 nm, resultando em uma melhora na estabilidade térmica dos seus principais parâmetros, indo de 27 à 53 ppm/°C

Techniques for low power analog, digital and mixed signal CMOS integrated circuit design

With the continuously expanding of market for portable devices such as wireless communication devices, portable computers, consumer electronics and implantable medical devices, low power is becoming increasingly important in integrated circuits. The low power design can increase operation time and/or utilize a smaller size and lighter-weight battery. In this dissertation, several low power complementary metal-oxide-semiconductor (CMOS) integrated circuit design techniques are investigated. A metal-oxide-semiconductor field effect transistor (MOSFET) can be operated at a lower voltage by forward-biasing the source-substrate junction. This approach has been investigated in detail and used to designing an ultra-low power CMOS operational amplifier for operation at ± 0.4 V. The issue of CMOS latchup and noise has been investigated in detail because of the forward biasing of the substrates of MOSFETs in CMOS. With increasing forward body-bias, the leakage current increases significantly. Dynamic threshold MOSFET (DTMOS) technique is proposed to overcome the drawback which is inherent in a forward-biased MOSFET. By using the DTMOS method with the forward source-body biased MOSFET, two low-power low-voltage CMOS VLSI circuits that of a CMOS analog multiplexer and a Schmitt trigger circuits are designed. In this dissertation, an adaptive body-bias technique is proposed. Adaptive body-bias voltage is generated for several operational frequencies. Another issue, which the chip design community is facing, is the development of portable, cost effective and low power supply voltage. This dissertation proposes a new cost-effective DC/DC converter design in standard 1.5 um n-well CMOS, which adopts a delay-line controller for voltage regulation

Design of VCOs in Deep Sub-micron Technologies

This work will present a more accurate frequency prediction model for single-ended ring oscillators (ROs), a case-study comparing different ROs, and a design method for LC voltage-controlled oscillators (LCVCOs) that uses a MATLAB script based on analytical equations to output a graphical design space showing performance characteristics as a function of design parameters. Using this method, design trade-offs become clear, and the designer can choose which performance characteristics to optimize. These methods were used to design various topologies of ring oscillators and LCVCOs in the GlobalFoundries 28 nm HPP CMOS technology, comparing the performance between different topologies based on simulation results. The results from the MATLAB design script were compared to simulation results as well to show the effectiveness of the design methods. Three varieties of 5 GHz voltage controlled ring oscillators were designed in the GlobalFoundries 28 nm HPP CMOS technology. The first is a low current low dropout regulator (LDO) tuned ring oscillator designed with thin oxide devices and a 0.85 V supply. The second is a high current LDO-tuned ring oscillator designed with medium oxide devices and a 1.5 V supply. The third is varactor-tuned ring oscillator with no LDO, and 0.85 V supply. Performance comparison of these ring oscillator systems are presented, outlining trade-offs between tuning range, phase noise, power dissipation, and area. The varactor-tuned ring oscillator exhibits 8.89 dBc/Hz (with power supply noise) and 16.27 dBc/Hz (without power supply noise) improvement in phase noise over the best-performing LDO-tuned ring oscillator. There are advantages in average power dissipation and area for a minimal tradeoff in tuning range with the varactor-tuned ring oscillator. Four multi-GHz LCVCOs were designed in the GlobalFoundries 28 nm HPP CMOS technology: 15 GHz varactor-tuned NMOS-only, 9 GHz varactor-tuned self-biased CMOS, 14.2 GHz digitally-tuned NMOS-only, and 8.2 GHz digitally-tuned self-biased CMOS. As a design method, analytical ex-pressions describing tuning range, tank amplitude constraint, and startup condition were used in MATLAB to output a graphical view of the design space for both NMOS-only and CMOS LCVCOs, with maximum varactor capacitance on the y-axis and NMOS transistor width on the x-axis. Phase noise was predicted as well. In addition to the standard varactor control voltage tuning method, digitally-tuned implementations of both NMOS and CMOS LCVCOs are presented. The performance aspects of all designed LCVCOs are compared. Both varactor-tuned and digitally-tuned NMOS LCVCOs have lower phase noise, lower power consumption, and higher tuning range than both CMOS topologies. The varactor-tuned NMOS LCVCO has the lowest phase noise of -97 dBc/Hz at 1 MHz offset from 15 GHz center frequency, FOM of -172.20 dBc/Hz, and FOMT of -167.76 dBc/Hz. The digitally-tuned CMOS LCVCO has the greatest tuning range at 10%. Phase noise is improved by 3 dBc/Hz with the digitally-tuned CMOS topology over varactor-tuned CMOS

Low-Voltage Bulk-Driven Amplifier Design and Its Application in Implantable Biomedical Sensors

The powering unit usually represents a significant component of the implantable biomedical sensor system since the integrated circuits (ICs) inside for monitoring different physiological functions consume a great amount of power. One method to reduce the volume of the powering unit is to minimize the power supply voltage of the entire system. On the other hand, with the development of the deep sub-micron CMOS technologies, the minimum channel length for a single transistor has been scaled down aggressively which facilitates the reduction of the chip area as well. Unfortunately, as an inevitable part of analytic systems, analog circuits such as the potentiostat are not amenable to either low-voltage operations or short channel transistor scheme. To date, several proposed low-voltage design techniques have not been adopted by mainstream analog circuits for reasons such as insufficient transconductance, limited dynamic range, etc. Operational amplifiers (OpAmps) are the most fundamental circuit blocks among all analog circuits. They are also employed extensively inside the implantable biosensor systems. This work first aims to develop a general purpose high performance low-voltage low-power OpAmp. The proposed OpAmp adopts the bulk-driven low-voltage design technique. An innovative low-voltage bulk-driven amplifier with enhanced effective transconductance is developed in an n-well digital CMOS process operating under 1-V power supply. The proposed circuit employs auxiliary bulk-driven input differential pairs to achieve the input transconductance comparable with the traditional gate-driven amplifiers, without consuming a large amount of current. The prototype measurement results show significant improvements in the open loop gain (AO) and the unity-gain bandwidth (UGBW) compared to other works. A 1-V potentiostat circuit for an implantable electrochemical sensor is then proposed by employing this bulk-driven amplifier. To the best of the author’s knowledge, this circuit represents the first reported low-voltage potentiostat system. This 1-V potentiostat possesses high linearity which is comparable or even better than the conventional potentiostat designs thanks to this transconductance enhanced bulk-driven amplifier. The current consumption of the overall potentiostat is maintained around 22 microampere. The area for the core layout of the integrated circuit chip is 0.13 mm2 for a 0.35 micrometer process