Improved Physical Design for Manufacturing Awareness and Advanced VLSI

Increasing challenges arise with each new semiconductor technology node, especially in advanced nodes, where the industry tries to extract every ounce of benefit as it approaches the limits of physics, through manufacturing-aware design technology co-optimization and design-based equivalent scaling. The increasing complexity of design and process technologies, and ever-more complex design rules, also become hurdles for academic researchers, separating academic researchers from the most up-to-date technical issues.This thesis presents innovative methodologies and optimizations to address the above challenges. There are three directions in this thesis: (i) manufacturing-aware design technology co-optimization; (ii) advanced node design-based equivalent scaling; and (iii) an open source academic detailed routing flow.To realize manufacturing-aware design technology co-optimization, this thesis presents two works: (i) a multi-row detailed placement optimization for neighbor diffusion effect mitigation between neighboring standard cells; and (ii) a post-routing optimization to generate 2D block mask layout for dummy segment removal in self-aligned multiple patterning.To achieve advanced node design-based equivalent scaling, this thesis presents two improved physical design methodologies: (i) a post-placement flop tray generation approach for clock power reduction; and (ii) a detailed placement approach to exploit inter-row M1 routing for congestion and wirelength reduction.To address the increasing gap between academia and industry, this thesis presents two works toward an open source academic detailed routing flow: (i) a complete, robust, scalable and design ruleaware dynamic programming-based pin access analysis framework; and (ii) TritonRoute – the open source detailed router that is capable of delivering DRC-clean detailed routing solutions in advanced nodes.This thesis concludes with a summary of its contributions and open directions for future research

The IPS fidelity scale as a guideline to implement Supported Employment

info:eu-repo/semantics/publishe

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi.Postprint (published version

Algorithmic techniques for physical design : macro placement and under-the-cell routing

With the increase of chip component density and new manufacturability constraints imposed by modern technology nodes, the role of algorithms for electronic design automation is key to the successful implementation of integrated circuits. Two of the critical steps in the physical design flows are macro placement and ensuring all design rules are honored after timing closure. This thesis proposes contributions to help in these stages, easing time-consuming manual steps and helping physical design engineers to obtain better layouts in reduced turnaround time. The first contribution is under-the-cell routing, a proposal to systematically connect standard cell components via lateral pins in the lower metal layers. The aim is to reduce congestion in the upper metal layers caused by extra metal and vias, decreasing the number of design rule violations. To allow cells to connect by abutment, a standard cell library is enriched with instances containing lateral pins in a pre-selected sharing track. Algorithms are proposed to maximize the numbers of connections via lateral connection by mapping placed cell instances to layouts with lateral pins, and proposing local placement modifications to increase the opportunities for such connections. Experimental results show a significant decrease in the number of pins, vias, and in number of design rule violations, with negligible impact on wirelength and timing. The second contribution, done in collaboration with eSilicon (a leading ASIC design company), is the creation of HiDaP, a macro placement tool for modern industrial designs. The proposed approach follows a multilevel scheme to floorplan hierarchical blocks, composed of macros and standard cells. By exploiting RTL information available in the netlist, the dataflow affinity between these blocks is modeled and minimized to find a macro placement with good wirelength and timing properties. The approach is further extended to allow additional engineer input, such as preferred macro locations, and also spectral and force methods to guide the floorplanning search. Experimental results show that the layouts generated by HiDaP outperforms those obtained by a state-of-the-art EDA physical design software, with similar wirelength and better timing when compared to manually designed tape-out ready macro placements. Layouts obtained by HiDaP have successfully been brought to near timing closure with one to two rounds of small modifications by physical design engineers. HiDaP has been fully integrated in the design flows of the company and its development remains an ongoing effort.A causa de l'increment de la densitat de components en els xip i les noves restriccions de disseny imposades pels últims nodes de fabricació, el rol de l'algorísmia en l'automatització del disseny electrònic ha esdevingut clau per poder implementar circuits integrats. Dos dels passos crucials en el procés de disseny físic és el placement de macros i assegurar la correcció de les regles de disseny un cop les restriccions de timing del circuit són satisfetes. Aquesta tesi proposa contribucions per ajudar en aquests dos reptes, facilitant laboriosos passos manuals en el procés i ajudant als enginyers de disseny físic a obtenir millors resultats en menys temps. La primera contribució és el routing "under-the-cell", una proposta per connectar cel·les estàndard usant pins laterals en les capes de metall inferior de manera sistemàtica. L'objectiu és reduir la congestió en les capes de metall superior causades per l'ús de metall i vies, i així disminuir el nombre de violacions de regles de disseny. Per permetre la connexió lateral de cel·les, estenem una llibreria de cel·les estàndard amb dissenys que incorporen connexions laterals. També proposem modificacions locals al placement per permetre explotar aquest tipus de connexions més sovint. Els resultats experimentals mostren una reducció significativa en el nombre de pins, vies i nombre de violacions de regles de disseny, amb un impacte negligible en wirelength i timing. La segona contribució, desenvolupada en col·laboració amb eSilicon (una empresa capdavantera en disseny ASIC), és el desenvolupament de HiDaP, una eina de macro placement per a dissenys industrials actuals. La proposta segueix un procés multinivell per fer el floorplan de blocks jeràrquics, formats per macros i cel·les estàndard. Mitjançant la informació RTL disponible en la netlist, l'afinitat de dataflow entre els mòduls es modela i minimitza per trobar macro placements amb bones propietats de wirelength i timing. La proposta també incorpora la possibilitat de rebre input addicional de l'enginyer, com ara suggeriments de les posicions de les macros. Finalment, també usa mètodes espectrals i de forçes per guiar la cerca de floorplans. Els resultats experimentals mostren que els dissenys generats amb HiDaP són millors que els obtinguts per eines comercials capdavanteres de EDA. Els resultats també mostren que els dissenys presentats poden obtenir un wirelength similar i millor timing que macro placements obtinguts manualment, usats per fabricació. Alguns dissenys obtinguts per HiDaP s'han dut fins a timing-closure en una o dues rondes de modificacions incrementals per part d'enginyers de disseny físic. L'eina s'ha integrat en el procés de disseny de eSilicon i el seu desenvolupament continua més enllà de les aportacions a aquesta tesi

A Practical Investigation into Achieving Bio-Plausibility in Evo-Devo Neural Microcircuits Feasible in an FPGA

Many researchers has conjectured, argued, or in some cases demonstrated, that bio-plausibility can bring about emergent properties such as adaptability, scalability, fault-tolerance, self-repair, reliability, and autonomy to bio-inspired intelligent systems. Evolutionary-developmental (evo-devo) spiking neural networks are a very bio-plausible mixture of such bio-inspired intelligent systems that have been proposed and studied by a few researchers. However, the general trend is that the complexity and thus the computational cost grow with the bio-plausibility of the system. FPGAs (Field- Programmable Gate Arrays) have been used and proved to be one of the flexible and cost efficient hardware platforms for research' and development of such evo-devo systems. However, mapping a bio-plausible evo-devo spiking neural network to an FPGA is a daunting task full of different constraints and trade-offs that makes it, if not infeasible, very challenging. This thesis explores the challenges, trade-offs, constraints, practical issues, and some possible approaches in achieving bio-plausibility in creating evolutionary developmental spiking neural microcircuits in an FPGA through a practical investigation along with a series of case studies. In this study, the system performance, cost, reliability, scalability, availability, and design and testing time and complexity are defined as measures for feasibility of a system and structural accuracy and consistency with the current knowledge in biology as measures for bio-plausibility. Investigation of the challenges starts with the hardware platform selection and then neuron, cortex, and evo-devo models and integration of these models into a whole bio-inspired intelligent system are examined one by one. For further practical investigation, a new PLAQIF Digital Neuron model, a novel Cortex model, and a new multicellular LGRN evo-devo model are designed, implemented and tested as case studies. Results and their implications for the researchers, designers of such systems, and FPGA manufacturers are discussed and concluded in form of general trends, trade-offs, suggestions, and recommendations

Design Techniques for Energy-Quality Scalable Digital Systems

Energy efficiency is one of the key design goals in modern computing. Increasingly complex tasks are being executed in mobile devices and Internet of Things end-nodes, which are expected to operate for long time intervals, in the orders of months or years, with the limited energy budgets provided by small form-factor batteries. Fortunately, many of such tasks are error resilient, meaning that they can toler- ate some relaxation in the accuracy, precision or reliability of internal operations, without a significant impact on the overall output quality. The error resilience of an application may derive from a number of factors. The processing of analog sensor inputs measuring quantities from the physical world may not always require maximum precision, as the amount of information that can be extracted is limited by the presence of external noise. Outputs destined for human consumption may also contain small or occasional errors, thanks to the limited capabilities of our vision and hearing systems. Finally, some computational patterns commonly found in domains such as statistics, machine learning and operational research, naturally tend to reduce or eliminate errors. Energy-Quality (EQ) scalable digital systems systematically trade off the quality of computations with energy efficiency, by relaxing the precision, the accuracy, or the reliability of internal software and hardware components in exchange for energy reductions. This design paradigm is believed to offer one of the most promising solutions to the impelling need for low-energy computing. Despite these high expectations, the current state-of-the-art in EQ scalable design suffers from important shortcomings. First, the great majority of techniques proposed in literature focus only on processing hardware and software components. Nonetheless, for many real devices, processing contributes only to a small portion of the total energy consumption, which is dominated by other components (e.g. I/O, memory or data transfers). Second, in order to fulfill its promises and become diffused in commercial devices, EQ scalable design needs to achieve industrial level maturity. This involves moving from purely academic research based on high-level models and theoretical assumptions to engineered flows compatible with existing industry standards. Third, the time-varying nature of error tolerance, both among different applications and within a single task, should become more central in the proposed design methods. This involves designing “dynamic” systems in which the precision or reliability of operations (and consequently their energy consumption) can be dynamically tuned at runtime, rather than “static” solutions, in which the output quality is fixed at design-time. This thesis introduces several new EQ scalable design techniques for digital systems that take the previous observations into account. Besides processing, the proposed methods apply the principles of EQ scalable design also to interconnects and peripherals, which are often relevant contributors to the total energy in sensor nodes and mobile systems respectively. Regardless of the target component, the presented techniques pay special attention to the accurate evaluation of benefits and overheads deriving from EQ scalability, using industrial-level models, and on the integration with existing standard tools and protocols. Moreover, all the works presented in this thesis allow the dynamic reconfiguration of output quality and energy consumption. More specifically, the contribution of this thesis is divided in three parts. In a first body of work, the design of EQ scalable modules for processing hardware data paths is considered. Three design flows are presented, targeting different technologies and exploiting different ways to achieve EQ scalability, i.e. timing-induced errors and precision reduction. These works are inspired by previous approaches from the literature, namely Reduced-Precision Redundancy and Dynamic Accuracy Scaling, which are re-thought to make them compatible with standard Electronic Design Automation (EDA) tools and flows, providing solutions to overcome their main limitations. The second part of the thesis investigates the application of EQ scalable design to serial interconnects, which are the de facto standard for data exchanges between processing hardware and sensors. In this context, two novel bus encodings are proposed, called Approximate Differential Encoding and Serial-T0, that exploit the statistical characteristics of data produced by sensors to reduce the energy consumption on the bus at the cost of controlled data approximations. The two techniques achieve different results for data of different origins, but share the common features of allowing runtime reconfiguration of the allowed error and being compatible with standard serial bus protocols. Finally, the last part of the manuscript is devoted to the application of EQ scalable design principles to displays, which are often among the most energy- hungry components in mobile systems. The two proposals in this context leverage the emissive nature of Organic Light-Emitting Diode (OLED) displays to save energy by altering the displayed image, thus inducing an output quality reduction that depends on the amount of such alteration. The first technique implements an image-adaptive form of brightness scaling, whose outputs are optimized in terms of balance between power consumption and similarity with the input. The second approach achieves concurrent power reduction and image enhancement, by means of an adaptive polynomial transformation. Both solutions focus on minimizing the overheads associated with a real-time implementation of the transformations in software or hardware, so that these do not offset the savings in the display. For each of these three topics, results show that the aforementioned goal of building EQ scalable systems compatible with existing best practices and mature for being integrated in commercial devices can be effectively achieved. Moreover, they also show that very simple and similar principles can be applied to design EQ scalable versions of different system components (processing, peripherals and I/O), and to equip these components with knobs for the runtime reconfiguration of the energy versus quality tradeoff

The 1992 4th NASA SERC Symposium on VLSI Design

Papers from the fourth annual NASA Symposium on VLSI Design, co-sponsored by the IEEE, are presented. Each year this symposium is organized by the NASA Space Engineering Research Center (SERC) at the University of Idaho and is held in conjunction with a quarterly meeting of the NASA Data System Technology Working Group (DSTWG). One task of the DSTWG is to develop new electronic technologies that will meet next generation electronic data system needs. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The NASA SERC is proud to offer, at its fourth symposium on VLSI design, presentations by an outstanding set of individuals from national laboratories, the electronics industry, and universities. These speakers share insights into next generation advances that will serve as a basis for future VLSI design