442 research outputs found

    Modelling and Test Generation for Crosstalk Faults in DSM Chips

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    In the era of deep submicron technology (DSM), many System-on-Chip (SoC) applications require the components to be operating at high clock speeds. With the shrinking feature size and ever increasing clock frequencies, the DSM technology has led to a well-known problem of Signal Integrity (SI) more especially in the connecting layout design. The increasing aspect ratios of metal wires and also the ratio of coupling capacitance over substrate capacitance result in electrical coupling of interconnects which leads to crosstalk problems. In this thesis, first the work carried out to model the crosstalk behaviour between aggressor and victim by considering the distributed RLGC parameters of interconnect and the coupling capacitance and mutual conductance between the two nets is presented. The proposed model also considers the RC linear models of the CMOS drivers and receivers. The behaviour of crosstalk in case of under etching problem has been studied and modelled by distributing and approximating the defect behaviour throughout the nets. Next, the proposed model has also been extended to model the behaviour of crosstalk in case of one victim is influenced by several aggressors by considering all aggressors have similar effect (worst-case) on victim. In all the above cases simulation experiments were also carried out and compared with well-known circuit simulation tool PSPICE. It has been proved that the generated crosstalk model is faster and the results generated are within 10% of error margin compared to latter simulation tool. Because of the accuracy and speed of the proposed model, the model is very useful for both SoC designers and test engineers to analyse the crosstalk behaviour. Each manufactured device needs to be tested thoroughly to ensure the functionality before its delivery. The test pattern generation for crosstalk faults is also necessary to test the corresponding crosstalk faults. In this thesis, the well-known PODEM algorithm for stuck-at faults is extended to generate the test patterns for crosstalk faults between single aggressor and single victim. To apply modified PODEM for crosstalk faults, the transition behaviour has been divided into two logic parts as before transition and after transition. After finding individually required test patterns for before transition and after transition, the generated logic vectors are appended to create transition test patterns for crosstalk faults. The developed algorithm is also applied for a few ISCAS 85 benchmark circuits and the fault coverage is found excellent in most circuits. With the incorporation of proposed algorithm into the ATPG tools, the efficiency of testing will be improved by generating the test patterns for crosstalk faults besides for the conventional stuck-at faults. In generating test patterns for crosstalk faults on single victim due to multiple aggressors, the modified PODEM algorithm is found to be more time consuming. The search capability of Genetic Algorithms in finding the required combination of several input factors for any optimized problem fascinated to apply GA for generating test patterns as generating the test pattern is also similar to finding the required vector out of several input transitions. Initially the GA is applied for generating test patterns for stuck-at faults and compared the results with PODEM algorithm. As the fault coverage is almost similar to the deterministic algorithm PODEM, the GA developed for stuck-at faults is extended to find test patterns for crosstalk faults between single aggressor and single victim. The elitist GA is also applied for a few ISCAS 85 benchmark circuits. Later the algorithm is extended to generate test patterns for worst-case crosstalk faults. It has been proved that elitist GA developed in this thesis is also very useful in generating test patterns for crosstalk faults especially for multiple aggressor and single victim crosstalk faults

    Empirical timing analysis of CPUs and delay fault tolerant design using partial redundancy

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    The operating clock frequency is determined by the longest signal propagation delay, setup/hold time, and timing margin. These are becoming less predictable with the increasing design complexity and process miniaturization. The difficult challenge is then to ensure that a device operating at its clock frequency is error-free with quantifiable assurance. Effort at device-level engineering will not suffice for these circuits exhibiting wide process variation and heightened sensitivities to operating condition stress. Logic-level redress of this issue is a necessity and we propose a design-level remedy for this timing-uncertainty problem. The aim of the design and analysis approaches presented in this dissertation is to provide framework, SABRE, wherein an increased operating clock frequency can be achieved. The approach is a combination of analytical modeling, experimental analy- sis, hardware /time-redundancy design, exception handling and recovery techniques. Our proposed design replicates only a necessary part of the original circuit to avoid high hardware overhead as in triple-modular-redundancy (TMR). The timing-critical combinational circuit is path-wise partitioned into two sections. The combinational circuits associated with long paths are laid out without any intrusion except for the fan-out connections from the first section of the circuit to a replicated second section of the combinational circuit. Thus only the second section of the circuit is replicated. The signals fanning out from the first section are latches, and thus are far shorter than the paths spanning the entire combinational circuit. The replicated circuit is timed at a subsequent clock cycle to ascertain relaxed timing paths. This insures that the likelihood of mistiming due to stress or process variation is eliminated. During the subsequent clock cycle, the outcome of the two logically identical, yet time-interleaved, circuit outputs are compared to detect faults. When a fault is detected, the retry sig- nal is triggered and the dynamic frequency-step-down takes place before a pipe flush, and retry is issued. The significant timing overhead associated with the retry is offset by the rarity of the timing violation events. Simulation results on ISCAS Benchmark circuits show that 10% of clock frequency gain is possible with 10 to 20 % of hardware overhead of replicated timing-critical circuit

    Commentary: JWST near-infrared detector degradation— finding the problem, fixing the problem, and moving forward

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    The James Webb Space Telescope (JWST) is the successor to the Hubble Space Telescope. JWST will be an infrared-optimized telescope, with an approximately 6.5 m diameter primary mirror, that is located at the Sun-Earth L2 Lagrange point. Three of JWST’s four science instruments use Teledyne HgCdTe HAWAII-2RG (H2RG) near infrared detector arrays. During 2010, the JWST Project noticed that a few of its 5 ÎŒm cutoff H2RG detectors were degrading during room temperature storage, and NASA chartered a “Detector Degradation Failure Review Board” (DD-FRB) to investigate. The DD-FRB determined that the root cause was a design flaw that allowed indium to interdiffuse with the gold contacts and migrate into the HgCdTe detector layer. Fortunately, Teledyne already had an improved design that eliminated this degradation mechanism. During early 2012, the improved H2RG design was qualified for flight and JWST began making additional H2RGs. In this article, we present the two public DD-FRB “Executive Summaries” that: (1) determined the root cause of the detector degradation and (2) defined tests to determine whether the existing detectors are qualified for flight. We supplement these with a brief introduction to H2RG detector arrays, some recent measurements showing that the performance of the improved design meets JWST requirements, and a discussion of how the JWST Project is using cryogenic storage to retard the degradation rate of the existing flight spare H2RGs

    Maximizing Crosstalk-Induced Slowdown During Path Delay Test

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    Capacitive crosstalk between adjacent signal wires in integrated circuits may lead to noise or a speedup or slowdown in signal transitions. These in turn may lead to circuit failure or reduced operating speed. This thesis focuses on generating test patterns to induce crosstalk-induced signal delays, in order to determine whether the circuit can still meet its timing specification. A timing-driven test generator is developed to sensitize multiple aligned aggressors coupled to a delay-sensitive victim path to detect the combination of a delay spot defect and crosstalk-induced slowdown. The framework uses parasitic capacitance information, timing windows and crosstalk-induced delay estimates to screen out unaligned or ineffective aggressors coupled to a victim path, speeding up crosstalk pattern generation. In order to induce maximum crosstalk slowdown along a path, aggressors are prioritized based on their potential delay increase and timing alignment. The test generation engine introduces the concept of alignment-driven path sensitization to generate paths from inputs to coupled aggressor nets that meet timing alignment and direction requirements. By using path delay information obtained from circuit preprocessing, preferred paths can be chosen during aggressor path propagation processes. As the test generator sensitizes aggressors in the presence of victim path necessary assignments, the search space is effectively reduced for aggressor path generation. This helps in reducing the test generation time for aligned aggressors. In addition, two new crosstalk-driven dynamic test compaction algorithms are developed to control the increase in test pattern count. The proposed test generation algorithm is applied to ISCAS85 and ISCAS89 benchmark circuits. SPICE simulation results demonstrate the ability of the alignment-driven test generator to increase crosstalk-induced delays along victim paths

    Machine learning support for logic diagnosis

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    GROK-FPGA: Generating Real on-Chip Knowledge for FPGA Fine-Grain Delays Using Timing Extraction

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    Circuit variation is one of the biggest problems to overcome if Moore\u27s Law is to continue. It is no longer possible to maintain an abstraction of identical devices without huge yield losses, performance penalties, and energy costs. Current techniques such as margining and grade binning are used to deal with this problem. However, they tend to be conservative, offering limited solutions that will not scale as variation increases. Conventional circuits use limited tests and statistical models to determine the margining and binning required to counteract variation. If the limited tests fail, the whole chip is discarded. On the other hand, reconfigurable circuits, such as FPGAs, can use more fine-grained, aggressive techniques that carefully choose which resources to use in order to mitigate variation. Knowing which resources to use and avoid, however, requires measurement of underlying variation. We present Timing Extraction, a methodology that allows measurement of process variation without expensive testers nor highly invasive techniques, rather, relying only on resources already available on conventional FPGAs. It takes advantage of the fact that we can measure the delay of logic paths between any two registers. Measuring enough paths, provides the information necessary to decompose the delay of each path into individual components-essentially, forming a system of linear equations. Determining which paths to measure requires simple graph transformation algorithms applied to a representation of the FPGA circuit. Ultimately, this process decomposes the FPGA into individual components and identifies which paths to measure for computing the delay of individual components. We apply Timing Extraction to 18 commercially available Altera Cyclone III (65 nm) FPGAs. We measure 22×28 logic clusters and the interconnect within and between cluster. Timing Extraction decomposes this region into 1,356,182 components, classified into 10 categories, requiring 2,736,556 path measurements. With an accuracy of ±3.2 ps, our measurements reveal regional variation on the order of 50 ps, systematic variation from 30 ps to 70 ps, and random variation in the clusters with σ=15 ps and in the interconnect with σ=62 ps

    Empirical timing analysis of CPUs and delay fault tolerant design using partial redundancy

    Get PDF
    The operating clock frequency is determined by the longest signal propagation delay, setup/hold time, and timing margin. These are becoming less predictable with the increasing design complexity and process miniaturization. The difficult challenge is then to ensure that a device operating at its clock frequency is error-free with quantifiable assurance. Effort at device-level engineering will not suffice for these circuits exhibiting wide process variation and heightened sensitivities to operating condition stress. Logic-level redress of this issue is a necessity and we propose a design-level remedy for this timing-uncertainty problem. The aim of the design and analysis approaches presented in this dissertation is to provide framework, SABRE, wherein an increased operating clock frequency can be achieved. The approach is a combination of analytical modeling, experimental analy- sis, hardware /time-redundancy design, exception handling and recovery techniques. Our proposed design replicates only a necessary part of the original circuit to avoid high hardware overhead as in triple-modular-redundancy (TMR). The timing-critical combinational circuit is path-wise partitioned into two sections. The combinational circuits associated with long paths are laid out without any intrusion except for the fan-out connections from the first section of the circuit to a replicated second section of the combinational circuit. Thus only the second section of the circuit is replicated. The signals fanning out from the first section are latches, and thus are far shorter than the paths spanning the entire combinational circuit. The replicated circuit is timed at a subsequent clock cycle to ascertain relaxed timing paths. This insures that the likelihood of mistiming due to stress or process variation is eliminated. During the subsequent clock cycle, the outcome of the two logically identical, yet time-interleaved, circuit outputs are compared to detect faults. When a fault is detected, the retry sig- nal is triggered and the dynamic frequency-step-down takes place before a pipe flush, and retry is issued. The significant timing overhead associated with the retry is offset by the rarity of the timing violation events. Simulation results on ISCAS Benchmark circuits show that 10% of clock frequency gain is possible with 10 to 20 % of hardware overhead of replicated timing-critical circuit

    Characterisation of crosstalk defects in submicron CMOS VLSI interconnects

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    The main problem addressed in this research work is a crosstalk defect, which is defined as an unexpected signal change due to the coupling between signals or power lines. Here its characteristic under 3 proposed models is investigated to find whether such a noise could lead to real logic faults in IC systems. As a result, mathematical analysis for various bus systems was established, with 3 main factors found to determine the amount of crosstalk: i) how the input buffers are sized; ii) the physical arrangements of the tracks; and iii) the number of switching tracks involved. Minimum sizes of the width and separation lead to the highest crosstalk while increasing in the length does not contribute much variation. Higher level of crosstalk is also found in higher metal layers due mainly to the reduced capacitance to the substrate. The crosstalk is at its maximum when the track concerned is the middle track of a bus connected to a weak buffer while the other signal lines are switching. From this information, the worse-case analysis for various bus configurations is proposed for 0.7, 0.5 and 0.35 ” CMOS technologies. For most of conventional logic circuits, a crosstalk as large as about a half of the supply voltage is required if a fault is to occur. For the buffer circuits the level of crosstalk required depends very much on the transition voltage, which is in turn controlled by the sizing of its n and p MOS transistors forming the buffer. It is concluded that in general case if crosstalk can be kept to be no larger that 30% of the supply voltage the circuit can be said to be very reliable and virtually free from crosstalk fault. Finally test structures are suggested so that real measurements can be made to verify the simulation result

    Application of Contactless Testing to PCBs with BGAs and Open Sockets

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