Investigation into voltage and process variation-aware manufacturing test

Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality. The focus is on logic testing of static CMOS designs with respect to two important defect types in deep submicron CMOS: resistive bridges and full opens. The first part of the thesis addresses testing for resistive bridge defects in designs with multiple supply voltage settings. To enable analysis, a fault simulator is developed using a supply voltage-aware model for bridge defect behaviour. The analysis shows that for high defect coverage it is necessary to perform test for more than one supply voltage setting, due to supply voltage-dependent behaviour. A low-cost and effective test method is presented consisting of multi-voltage test generation that achieves high defect coverage and test set size reduction without compromise to defect coverage. Experiments on synthesised benchmarks with realistic bridge locations validate the proposed method.The second part focuses on the behaviour of full open defects under supply voltage variation. The aim is to determine the appropriate value of supply voltage to use when testing. Two models are considered for the behaviour of full open defects with and without gate tunnelling leakage influence. Analysis of the supply voltage-dependent behaviour of full open defects is performed to determine if it is required to test using more than one supply voltage to detect all full open defects. Experiments on synthesised benchmarks using an extended version of the fault simulator tool mentioned above, measure the quantitative impact of supply voltage variation on defect coverage.The final part studies the impact of process variation on the behaviour of bridge defects. Detailed analysis using synthesised ISCAS benchmarks and realistic bridge model shows that process variation leads to additional faults. If process variation is not considered in test generation, the test will fail to detect some of these faults, which leads to test escapes. A novel metric to quantify the impact of process variation on test quality is employed in the development of a new test generation tool, which achieves high bridge defect coverage. The method achieves a user-specified test quality with test sets which are smaller than test sets generated without consideration of process variation

Fault modelling and accelerated simulation of integrated circuits manufacturing defects under process variation

As silicon manufacturing process scales to and beyond the 65-nm node, process variation can no longer be ignored. The impact of process variation on integrated circuit performance and power has received significant research input. Variation-aware test, on the other hand, is a relatively new research area that is currently receiving attention worldwide.Research has shown that test without considering process variation may lead to loss of test quality. Fault modelling and simulation serve as a backbone of manufacturing test. This thesis is concerned with developing efficient fault modelling techniques and simulation methodologies that take into account the effect of process variation on manufacturing defects with particular emphasis on resistive bridges and resistive opens.The first contribution of this thesis addresses the problem of long computation time required to generate logic fault of resistive bridges under process variation by developing a fast and accurate modelling technique to model logic fault behaviour of resistive bridges.The new technique is implemented by employing two efficient voltage calculation algorithms to calculate the logic threshold voltage of driven gates and critical resistance of a fault-site to enable the computation of bridge logic faults without using SPICE. Simulation results show that the technique is fast (on average 53 times faster) and accurate (worst case is 2.64% error) when compared with HSPICE. The second contribution analyses the complexity of delay fault simulation of resistive bridges to reduce the computation time of delay fault when considering process variation. An accelerated delay fault simulation methodology of resistive bridges is developed by employing a three-step strategy to speed up the calculation of transient gate output voltage which is needed to accurately compute delay faults. Simulation results show that the methodology is on average 17.4 times faster, with 5.2% error in accuracy, when compared with HSPICE. The final contribution presents an accelerated simulation methodology of resistive opens to address the problem of long simulation time of delay fault when considering process variation. The methodology is implemented by using two efficient algorithms to accelerate the computation of transient gate output voltage and timing critical resistance of an open fault-site. Simulation results show that the methodology is on average up to 52 times faster than HSPICE, with 4.2% error in accuracy

The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

Fault simulation and test generation for small delay faults

Delay faults are an increasingly important test challenge. Traditional delay fault models are incomplete in that they model only a subset of delay defect behaviors. To solve this problem, a more realistic delay fault model has been developed which models delay faults caused by the combination of spot defects and parametric process variation. According to the new model, a realistic delay fault coverage metric has been developed. Traditional path delay fault coverage metrics result in unrealistically low fault coverage, and the real test quality is not reflected. The new metric uses a statistical approach and the simulation based fault coverage is consistent with silicon data. Fast simulation algorithms are also included in this dissertation. The new metric suggests that testing the K longest paths per gate (KLPG) has high detection probability for small delay faults under process variation. In this dissertation, a novel automatic test pattern generation (ATPG) methodology to find the K longest testable paths through each gate for both combinational and sequential circuits is presented. Many techniques are used to reduce search space and CPU time significantly. Experimental results show that this methodology is efficient and able to handle circuits with an exponential number of paths, such as ISCAS85 benchmark circuit c6288. The ATPG methodology has been implemented on industrial designs. Speed binning has been done on many devices and silicon data has shown significant benefit of the KLPG test, compared to several traditional delay test approaches

Sensors i estratègies de test de circuits digitals CMOS per vigilància del consum

El objetivo de la tesis es realizar aportaciones en el campo de las estrategias de test basadas en la vigilancia del consumo quiescente de los circuitos integrados CMOS y de los sensores utilizados para dicho fin (test de corriente o test iddq). Para ello se analiza en primer lugar el estado del arte en el diseño de sensores para el test IDDQ y se extraen criterios para la evaluacion de la calidad de dichos sensores. En la tesis se propone un nuevo tipo de sensor integrado (proportional built-in current sensor) que utiliza como elemento transductor un transistor bipolar compatible con la tecnologia CMOS. Se caracteriza tambien su comportamiento estetico y dinamico y se realizan pruebas con circuitos experimentales para validar los analisis realizados.En la tesis se proponen dos metodos originales para el test IDDQ mediante sensores externos al circuito que se este verificando (cut): el primero se basa en la desconexion de la alimentacion del cut y en la observacion del comportamiento de sus salidas. El segundo metodo se basa en el analisis de la evolucion de la tension en el nodo de alimentacion de un CUT cuando se le aplica un conjunto de vectores de test estando el circuito alimentado por un condensador. Ambos metodos propuestos requieren un interruptor para la alimentacion del CUT con unas caracteristicas especiales. Por ello, se ha diseñado un nuevo tipo de interruptor que cumple con las especificaciones de baja resistencia en estado de conduccion y baja inyeccion de carga en el paso del estado de no conduccion al de conduccion. Finalmente, los metodos propuestos se han validado experimentalmente al ser implementados en una maquina de test convencional verificandose su efectividad en la deteccion de los defectos de multiples circuitos integrados

Resilience of an embedded architecture using hardware redundancy

In the last decade the dominance of the general computing systems market has being replaced by embedded systems with billions of units manufactured every year. Embedded systems appear in contexts where continuous operation is of utmost importance and failure can be profound. Nowadays, radiation poses a serious threat to the reliable operation of safety-critical systems. Fault avoidance techniques, such as radiation hardening, have been commonly used in space applications. However, these components are expensive, lag behind commercial components with regards to performance and do not provide 100% fault elimination. Without fault tolerant mechanisms, many of these faults can become errors at the application or system level, which in turn, can result in catastrophic failures. In this work we study the concepts of fault tolerance and dependability and extend these concepts providing our own definition of resilience. We analyse the physics of radiation-induced faults, the damage mechanisms of particles and the process that leads to computing failures. We provide extensive taxonomies of 1) existing fault tolerant techniques and of 2) the effects of radiation in state-of-the-art electronics, analysing and comparing their characteristics. We propose a detailed model of faults and provide a classification of the different types of faults at various levels. We introduce an algorithm of fault tolerance and define the system states and actions necessary to implement it. We introduce novel hardware and system software techniques that provide a more efficient combination of reliability, performance and power consumption than existing techniques. We propose a new element of the system called syndrome that is the core of a resilient architecture whose software and hardware can adapt to reliable and unreliable environments. We implement a software simulator and disassembler and introduce a testing framework in combination with ERA’s assembler and commercial hardware simulators

Modeling defective part level due to static and dynamic defects based upon site observation and excitation balance

Manufacture testing of digital integrated circuits is essential for high quality. However, exhaustive testing is impractical, and only a small subset of all possible test patterns (or test pattern pairs) may be applied. Thus, it is crucial to choose a subset that detects a high percentage of the defective parts and produces a low defective part level. Historically, test pattern generation has often been seen as a deterministic endeavor. Test sets are generated to deterministically ensure that a large percentage of the targeted faults are detected. However, many real defects do not behave like these faults, and a test set that detects them all may still miss many defects. Unfortunately, modeling all possible defects as faults is impractical. Thus, it is important to fortuitously detect unmodeled defects using high quality test sets. To maximize fortuitous detection, we do not assume a high correlation between faults and actual defects. Instead, we look at the common requirements for all defect detection. We deterministically maximize the observations of the leastobserved sites while randomly exciting the defects that may be present. The resulting decrease in defective part level is estimated using the MPGD model. This dissertation describes the MPGD defective part level model and shows how it can be used to predict defective part levels resulting from static defect detection. Unlike many other predictors, its predictions are a function of site observations, not fault coverage, and thus it is generally more accurate at high fault coverages. Furthermore, its components model the physical realities of site observation and defect excitation, and thus it can be used to give insight into better test generation strategies. Next, we investigate the effect of additional constraints on the fortuitous detection of defects-specifically, as we focus on detecting dynamic defects instead of static ones. We show that the quality of the randomness of excitation becomes increasingly important as defect complexity increases. We introduce a new metric, called excitation balance, to estimate the quality of the excitation, and we show how excitation balance relates to the constant τ in the MPGD model