Analysis and design of low power CMOS ultra wideband receiver

This research concentrates on the design and analysis of low power ultra wideband receivers for Multiband Orthogonal Frequency Division Multiplexing systems. Low power design entails different performance tradeoffs, which are analyzed. Relationship among power consumption, achievable noise figure and linearity performance including distortion products (cross-modulation, inter-modulation and harmonic distortion) are derived. From these relationships, circuit design proceeds with allocation of gain among different sub circuit blocks for power optimum system. A power optimum RF receiver front-end for MB-OFDM based UWB systems is designed that covers all the MB-OFDM spectrum between 3.1 GHZ to 9.6 GHZ. The receiver consists of a low-noise amplifier, down-converter, channel select filter and programmable gain amplifier and occupies only 1mm 2 in 0.13um CMOS process. Receiver consumes 20 mA from a 1.2 V supply and has the measured gain of 69db, noise figure less than 6 dB and input IIP 3 of -6 dBm

Compact Models for Integrated Circuit Design

This modern treatise on compact models for circuit computer-aided design (CAD) presents industry standard models for bipolar-junction transistors (BJTs), metal-oxide-semiconductor (MOS) field-effect-transistors (FETs), FinFETs, and tunnel field-effect transistors (TFETs), along with statistical MOS models. Featuring exercise problems at the end of each chapter and extensive references at the end of the book, the text supplies fundamental and practical knowledge necessary for efficient integrated circuit (IC) design using nanoscale devices. It ensures even those unfamiliar with semiconductor physics gain a solid grasp of compact modeling concepts

Time-domain optimization of amplifiers based on distributed genetic algorithms

Thesis presented in partial fulfillment of the requirements for the degree of Doctor of Philosophy in the subject of Electrical and Computer EngineeringThe work presented in this thesis addresses the task of circuit optimization, helping the designer facing the high performance and high efficiency circuits demands of the market and technology evolution. A novel framework is introduced, based on time-domain analysis, genetic algorithm optimization, and distributed processing. The time-domain optimization methodology is based on the step response of the amplifier. The main advantage of this new time-domain methodology is that, when a given settling-error is reached within the desired settling-time, it is automatically guaranteed that the amplifier has enough open-loop gain, AOL, output-swing (OS), slew-rate (SR), closed loop bandwidth and closed loop stability. Thus, this simplification of the circuit‟s evaluation helps the optimization process to converge faster. The method used to calculate the step response expression of the circuit is based on the inverse Laplace transform applied to the transfer function, symbolically, multiplied by 1/s (which represents the unity input step). Furthermore, may be applied to transfer functions of circuits with unlimited number of zeros/poles, without approximation in order to keep accuracy. Thus, complex circuit, with several design/optimization degrees of freedom can also be considered. The expression of the step response, from the proposed methodology, is based on the DC bias operating point of the devices of the circuit. For this, complex and accurate device models (e.g. BSIM3v3) are integrated. During the optimization process, the time-domain evaluation of the amplifier is used by the genetic algorithm, in the classification of the genetic individuals. The time-domain evaluator is integrated into the developed optimization platform, as independent library, coded using C programming language. The genetic algorithms have demonstrated to be a good approach for optimization since they are flexible and independent from the optimization-objective. Different levels of abstraction can be optimized either system level or circuit level. Optimization of any new block is basically carried-out by simply providing additional configuration files, e.g. chromosome format, in text format; and the circuit library where the fitness value of each individual of the genetic algorithm is computed. Distributed processing is also employed to address the increasing processing time demanded by the complex circuit analysis, and the accurate models of the circuit devices. The communication by remote processing nodes is based on Message Passing interface (MPI). It is demonstrated that the distributed processing reduced the optimization run-time by more than one order of magnitude. Platform assessment is carried by several examples of two-stage amplifiers, which have been optimized and successfully used, embedded, in larger systems, such as data converters. A dedicated example of an inverter-based self-biased two-stage amplifier has been designed, laid-out and fabricated as a stand-alone circuit and experimentally evaluated. The measured results are a direct demonstration of the effectiveness of the proposed time-domain optimization methodology.Portuguese Foundation for the Science and Technology (FCT

Ultra Small Antenna and Low Power Receiver for Smart Dust Wireless Sensor Networks

Wireless Sensor Networks have the potential for profound impact on our daily lives. Smart Dust Wireless Sensor Networks (SDWSNs) are emerging members of the Wireless Sensor Network family with strict requirements on communication node sizes (1 cubic centimeter) and power consumption (< 2mW during short on-states). In addition, the large number of communication nodes needed in SDWSN require highly integrated solutions. This dissertation develops new design techniques for low-volume antennas and low-power receivers for SDWSN applications. In addition, it devises an antenna and low noise amplifier co-design methodology to increase the level of design integration, reduce receiver noise, and reduce the development cycle. This dissertation first establishes stringent principles for designing SDWSN electrically small antennas (ESAs). Based on these principles, a new ESA, the F-Inverted Compact Antenna (FICA), is designed at 916MHz. This FICA has a significant advantage in that it uses a small-size ground plane. The volume of this FICA (including the ground plane) is only 7% of other state-of-the-art ESAs, while its efficiency (48.53%) and gain (-1.38dBi) are comparable to antennas of much larger dimensions. A physics-based circuit model is developed for this FICA to assist system level design at the earliest stage, including optimization of the antenna performance. An antenna and low noise amplifier (LNA) co-design method is proposed and proven to be valid to design low power LNAs with the very low noise figure of only 1.5dB. To reduce receiver power consumption, this dissertation proposes a novel LNA active device and an input/ouput passive matching network optimization method. With this method, a power efficient high voltage gain cascode LNA was designed in a 0.13um CMOS process with only low quality factor inductors. This LNA has a 3.6dB noise figure, voltage gain of 24dB, input third intercept point (IIP3) of 3dBm, and power consumption of 1.5mW at 1.0V supply voltage. Its figure of merit, using the typical definition, is twice that of the best in the literature. A full low power receiver is developed with a sensitivity of -58dBm, chip area of 1.1mm2, and power consumption of 2.85mW

Strain-Engineered MOSFETs

This book brings together new developments in the area of strain-engineered MOSFETs using high-mibility substrates such as SIGe, strained-Si, germanium-on-insulator and III-V semiconductors into a single text which will cover the materials aspects, principles, and design of advanced devices, their fabrication and applications. The book presents a full TCAD methodology for strain-engineering in Si CMOS technology involving data flow from process simulation to systematic process variability simulation and generation of SPICE process compact models for manufacturing for yield optimization

DESIGN OF LOW POWER MOBILE TRANSMITTER

The objective of this project is to design a power amplifier for a new two way mobile radio product being launched by Motorola. Two-way mobile radio consists of a transmitter, receiver and a voltage-controlled oscillator. Mobile radios usually have transmitter whose power output ranges from 1 W to 50 W. Design of transmitter lineup for mobile radio involves the design of appropriate matching network for driver and power amplifier. The power and voltage control of these devices are equally important. Designing a mobile radio transmitter is regarded tricky due to difficulty in getting a robust transmitter that is stable with minimum oscillation. In this work, the design is attempted usmg Advanced Design Simulator (ADS). The design simulation provides accurate simulation on harmonic filter and antenna switch. 50 ohm matching networks have also been designed and simulated using ADS and it gives close approximation to the specifications. The radio has since been prototyped and tested. The evaluation and testing of the radio has been carried out and it satisfies the specifications that are set by the Telecommunication Industry Association (TIA). Some minor optimization has also been performed to improve the radio performance. Eventual product is a transmitter line up that function well today. 11

Ultra-thin and flexible CMOS technology: ISFET-based microsystem for biomedical applications

A new paradigm of silicon technology is the ultra-thin chip (UTC) technology and the emerging applications. Very thin integrated circuits (ICs) with through-silicon vias (TSVs) will allow the stacking and interconnection of multiple dies in a compact format allowing a migration towards three-dimensional ICs (3D-ICs). Also, extremely thin and therefore mechanically bendable silicon chips in conjunction with the emerging thin-film and organic semiconductor technologies will enhance the performance and functionality of large-area flexible electronic systems. However, UTC technology requires special attention related to the circuit design, fabrication, dicing and handling of ultra-thin chips as they have different physical properties compared to their bulky counterparts. Also, transistors and other active devices on UTCs experiencing variable bending stresses will suffer from the piezoresistive effect of silicon substrate which results in a shift of their operating point and therefore, an additional aspect should be considered during circuit design. This thesis tries to address some of these challenges related to UTC technology by focusing initially on modelling of transistors on mechanically bendable Si-UTCs. The developed behavioural models are a combination of mathematical equations and extracted parameters from BSIM4 and BSIM6 modified by a set of equations describing the bending-induced stresses on silicon. The transistor models are written in Verilog-A and compiled in Cadence Virtuoso environment where they were simulated at different bending conditions. To complement this, the verification of these models through experimental results is also presented. Two chips were designed using a 180 nm CMOS technology. The first chip includes nMOS and pMOS transistors with fixed channel width and two different channel lengths and two different channel orientations (0° and 90°) with respect to the wafer crystal orientation. The second chip includes inverter logic gates with different transistor sizes and orientations, as in the previous chip. Both chips were thinned down to ∼20m using dicing-before-grinding (DBG) prior to electrical characterisation at different bending conditions. Furthermore, this thesis presents the first reported fully integrated CMOS-based ISFET microsystem on UTC technology. The design of the integrated CMOS-based ISFET chip with 512 integrated on-chip ISFET sensors along with their read-out and digitisation scheme is presented. The integrated circuits (ICs) are thinned down to ∼30m and the bulky, as well as thinned ICs, are electrically and electrochemically characterised. Also, the thesis presents the first reported mechanically bendable CMOS-based ISFET device demonstrating that mechanical deformation of the die can result in drift compensation through the exploitation of the piezoresistive nature of silicon. Finally, this thesis presents the studies towards the development of on-chip reference electrodes and biodegradable and ultra-thin biosensors for the detection of neurotransmitters such as dopamine and serotonin

Low Power Decoding Circuits for Ultra Portable Devices

A wide spread of existing and emerging battery driven wireless devices do not necessarily demand high data rates. Rather, ultra low power, portability and low cost are the most desired characteristics. Examples of such applications are wireless sensor networks (WSN), body area networks (BAN), and a variety of medical implants and health-care aids. Being small, cheap and low power for the individual transceiver nodes, let those to be used in abundance in remote places, where access for maintenance or recharging the battery is limited. In such scenarios, the lifetime of the battery, in most cases, determines the lifetime of the individual nodes. Therefore, energy consumption has to be so low that the nodes remain operational for an extended period of time, even up to a few years. It is known that using error correcting codes (ECC) in a wireless link can potentially help to reduce the transmit power considerably. However, the power consumption of the coding-decoding hardware itself is critical in an ultra low power transceiver node. Power and silicon area overhead of coding-decoding circuitry needs to be kept at a minimum in the total energy and cost budget of the transceiver node. In this thesis, low power approaches in decoding circuits in the framework of the mentioned applications and use cases are investigated. The presented work is based on the 65nm CMOS technology and is structured in four parts as follows: In the first part, goals and objectives, background theory and fundamentals of the presented work is introduced. Also, the ECC block in coordination with its surrounding environment, a low power receiver chain, is presented. Designing and implementing an ultra low power and low cost wireless transceiver node introduces challenges that requires special considerations at various levels of abstraction. Similarly, a competitive solution often occurs after a conclusive design space exploration. The proposed decoder circuits in the following parts are designed to be embedded in the low power receiver chain, that is introduced in the first part. Second part, explores analog decoding method and its capabilities to be embedded in a compact and low power transceiver node. Analog decod- ing method has been theoretically introduced over a decade ago that followed with early proof of concept circuits that promised it to be a feasible low power solution. Still, with the increased popularity of low power sensor networks, it has not been clear how an analog decoding approach performs in terms of power, silicon area, data rate and integrity of calculations in recent technologies and for low data rates. Ultra low power budget, small size requirement and more relaxed demands on data rates suggests a decoding circuit with limited complexity. Therefore, the four-state (7,5) codes are considered for hardware implementation. Simulations to chose the critical design factors are presented. Consequently, to evaluate critical specifications of the decoding circuit, three versions of analog decoding circuit with different transistor dimensions fabricated. The measurements results reveal different trade-off possibilities as well as the potentials and limitations of the analog decoding approach for the target applications. Measurements seem to be crucial, since the available computer-aided design (CAD) tools provide limited assistance and precision, given the amount of calculations and parameters that has to be included in the simulations. The largest analog decoding core (AD1) takes 0.104mm2 on silicon and the other two (AD2 and AD3) take 0.035mm2 and 0.015mm2, respectively. Consequently, coding gain in trade-off with silicon area and throughput is presented. The analog decoders operate with 0.8V supply. The achieved coding gain is 2.3 dB at bit error rates (BER)=0.001 and 10 pico-Joules per bit (pJ/b) energy efficiency is reached at 2 Mbps. Third part of this thesis, proposes an alternative low power digital decoding approach for the same codes. The desired compact and low power goal has been pursued by designing an equivalent digital decoding circuit that is fabricated in 65nm CMOS technology and operates in low voltage (near-threshold) region. The architecture of the design is optimized in system and circuit levels to propose a competitive digital alternative. Similarly, critical specifications of the decoder in terms of power, area, data rate (speed) and integrity are reported according to the measurements. The digital implementation with 0.11mm2 area, consumes minimum energy at 0.32V supply which gives 9 pJ/b energy efficiency at 125 kb/s and 2.9 dB coding gain at BER=0.001. The forth and last part, compares the proposed design alternatives based on the fabricated chips and the results attained from the measurements to conclude the most suitable solution for the considered target applications. Advantages and disadvantages of both approaches are discussed. Possible extensions of this work is introduced as future work