Ultra-low power, low-voltage transmitter at ISM band for short range transceivers

Tezin basılısı İstanbul Şehir Üniversitesi Kütüphanesi'ndedir.The increasing demand for technology to be used in every aspect of our lives has led the way to many new applications and communication standards. WSN and BAN are some of the new examples that utilize electronic circuit design in the form of very small sensors to perform their applications. They consist of small sensor nodes and have applications ranging from entertainment to medicine. Requirements such as decreasing the area and the power consumption help to have longer-lasting batteries and smaller devices. The standard paves the way for the devices from different vendors to communicate with each other, and that motivates us to make designs as compatible with the standard as it can be. In this thesis, an ultra-low power high efficient transmitter with a small area working at 2.4 GHz have been designed for BAN applications. A study on the system-view perspective is important in optimizing the area and power since the transmitter architecture can change the circuit design. From a circuit design perspective, seeking to decrease power consumption means thinking of new techniques to implement the same function or a new system. Inspired by new trends, this research presents a design solution to the previously mentioned problem and hopefully, after fabrication, the measured results will match the simulated results to prove the validity of the design.Declaration of Authorship ii Abstract iv Öz v Acknowledgments vii List of Figures x List of Tables xiii Abbreviations xiv 1 Introduction 1 1.1 Background and Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 Communication Concepts . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2.1 Digital Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2.2 Unwanted Power Limitations . . . . . . . . . . . . . . . . . . . . . 3 1.2.3 Multiple Access Techniques . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Transmitter System Level Specifications . . . . . . . . . . . . . . . . . . . 4 1.3.1 Low Power Wireless Standards . . . . . . . . . . . . . . . . . . . . 4 1.4 Low-Power Wireless Transceiver systems . . . . . . . . . . . . . . . . . . . 6 1.4.1 Survey of the previous work . . . . . . . . . . . . . . . . . . . . . . 7 1.4.2 The Designed Transmitter System . . . . . . . . . . . . . . . . . . 8 1.5 Ultra-Low Power Transmitters Performance Metrics . . . . . . . . . . . . 9 1.6 Thesis Contribution and Outline . . . . . . . . . . . . . . . . . . . . . . . 10 2 Circuit Design for The Transmitter 11 2.1 Technology Characterization and Modeling for Low-Power Designs . . . 11 2.1.1 Passive Components modeling . . . . . . . . . . . . . . . . . . . . 11 2.1.2 Active Components Modeling . . . . . . . . . . . . . . . . . . . . . 13 2.1.3 MOS Transistor Sub-threshold Modeling . . . . . . . . . . . . . . 13 2.1.4 MOS Transistor Simulation-Based Modeling . . . . . . . . . . . . . 14 2.2 Low-Voltage Low-Power Analog and RF Design Principles . . . . . . . . . 17 2.2.1 Separate Gate Biasing of The Inverter . . . . . . . . . . . . . . . . 17 2.2.2 Body Biasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3 Low-Voltage Analog Mixed Biasing Circuit Designs . . . . . . . . . . . . . 18 2.3.1 DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.3.2 Operational Amplifier Design . . . . . . . . . . . . . . . . . . . . . 19 2.4 Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.4.1 The MEMS Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.4.2 Crystal Oscillator Topologies . . . . . . . . . . . . . . . . . . . . . 23 2.4.3 Design of The CMOS Crystal Oscillator . . . . . . . . . . . . . . . 26 2.5 Pre-Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2.6 OOK Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 2.7 BPSK Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2.8 Digital Control of the Modulators . . . . . . . . . . . . . . . . . . . . . . . 35 2.9 Power Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 2.9.1 ULP PA Topologies Survey . . . . . . . . . . . . . . . . . . . . . . 38 2.9.2 The Push-Pull PA Design Methodology . . . . . . . . . . . . . . . 41 2.10 Transmit/Receive (T/R) Switch . . . . . . . . . . . . . . . . . . . . . . . 43 2.10.1 T/R Switch Topologies . . . . . . . . . . . . . . . . . . . . . . . . . 43 2.10.2 Suggested Low-Area Low-Voltage RF Switch . . . . . . . . . . . . 46 3 Transmitter Integration and Final Results 48 3.1 Transmitter Simulations . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 3.2 Transmitter Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 3.3 Results Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 3.4 Results Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 4 Conclusions 59 4.1 Thesis Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 4.2 Future Work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 A Bond Wire Parasitic Modeling 61 B Crystal Oscillator With Parasitic Effects 67 B.1 Simulation of FBAR with Parasitic Effects . . . . . . . . . . . . . . . . . 67 B.2 Root Locus Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Bibliography 7

Monolithic Integration Piezoelectric Resonators on CMOS for Radio-Frequency and Sensing Applications

Software cognitive radios and Internet of Things (IoT) are recent interest areas that need low loss and low power consumption hardware. More specifically, the area of software cognitive radios requires that hardware be frequency agile and highly selective. Meanwhile, IoT relies on multiple low power sensor networks. By combining Complementary Metal Oxide Semiconductors (CMOS) technology with piezoelectric Micro-Electro-Mechanical Systems (MEMS), we can fabricate Systems-on-Chip (SoC) that can be used as filters or references (oscillators) and highly selective sensors. In this work we developed a die-level compatible process for the monolithic integration of Bulk Acoustic Resonators (BAWs) on CMOS for low power, reduced area and high-quality passives for radio frequency applications. Using CMOS as a fabrication substrate some stringent requirements were added to maintain the dies and the technology’s integrity. A few of these limitations were the need for a low thermal budget fabrication process, die handling and electro-static discharge (ESD) protection. The devices were first fabricated on glass for modeling extraction that was later used for the design of the integrated circuits (IC). Three integrated circuits were designed as substrates for the integration using IBM’s 180nm and TSMC’s 65nm technology. A monolithic BAW oscillator with a resonance frequency of 1.8GHz was demonstrated with an FOM ~186dBc/Hz, comparable to other academia work. Using the developed process, a membrane BAW structure (FBAR) was integrated as well. Using a susceptor coating and zinc oxide’s (ZnO) high temperature coefficient of frequency (TCF) the device was studied as an alternative uncooled infrared sensor. Finally, a reprogrammable IC and an RF PCB were designed for volatile organic compound (VOC) testing using self-assembled monolayers (SAMs) as the absorber layer

Low-Power Integrated Circuits For Biomedical Applications

With thousands new cases of spinal cord injury reported everyday, many people suffer from paralysis and loss of sensation in both legs. Beside the healthcare costs, such a state severely deteriorates the patients' quality of life and may even lead to additional medical conditions. Therefore, there is a growing need for cyber-physical systems to restore the walking ability through bypassing the damaged spinal cord. This goal can be achieved by monitoring and processing patient's brain signals to enable brain-directed control of prosthetic legs. Among several existing methods to record brain signals, electrocorticography (ECoG) has gained popularity due to being robust to motion artifacts, having high spatial resolution and signal to noise ratio, being moderately invasive and the possibility of chronic implantation of recording grids with no or minor scar tissue formation. The latest property is of particular importance for the whole system to be a viable fully implantable solution. Furthermore, the implanted system has to operate independently with no or minimal need of external hardware (e.g. a bulky personal computer) to be individually and socially accepted. To implement a fully implantable system, low-power and miniaturized electronics are needed to reduced heat generation, increase battery life-time and be minimally intrusive. These requirements indicate that many of the system's components should be custom-designed to integrated as much functionality as possible in a given real estate. This thesis presents silicon tested prototypes of several building blocks for the envisioned system, namely, ultra low-power brain signal acquisition front-ends, a low-power and inductorless MedRadio transceiver, and a fast start-up crystal oscillator. Brain signal acquisition front-ends provide low noise amplification of weak ECoG biosignals. MedRadio transceiver enables communication between the implant and end effectors or base station (e.g. prosthetic legs or desktop computer). Crystal oscillator generates the reference signal for other system's components such as analog to digital converter. Novel techniques to improve important performance parameters (power consumption, low noise operation and interference resilience) have been introduced. Electrical, in-vitro and in-vivo experimental measurements have verified the functionality and performance of each design

Diseño y desarrollo del sistema de comunicaciones inalámbrico de un enjambre de UAV`S colaborativos

[Resumen] La Inteligencia Colectiva, dentro del campo de la Inteligencia Computacional, aborda temas de estudio como el comportamiento de los agentes individuales dentro de un sistema global y la asociación de la información para la resolución conjunta de problemas complejos. Dentro de la línea de investigación de Inteligencia Computacional e Inteligencia Colectiva, el Grupo Integrado de Ingeniería (GII) ha propuesto como proyecto de estudio el abordar un análisis exhaustivo de las tecnologías IoT de comunicación existentes, con el fin de adoptar la más adecuada a los requerimientos e incorporarla a un modelo de enjambre de UAV’s colaborativos. Las características más valoradas a la hora de la adopción del sistema serán las inherentes a los UAV’s, como son el alcance o la eficiencia energética, además de obtener las mejores prestaciones a la hora de establecer el radioenlace, como obtener el máximo ancho de banda, optimización de latencias y ciclos de CPU y la mayor inmunidad posible frente a interferencias. Una vez elegido el sistema, se tratará de optimizar para su uso en UAV’s y se realizarán pruebas de vuelo en escenarios reales para obtener datos específicos sobre consumo energético, rendimiento y alcance máximo.Traballo fin de mestrado (UDC.EPS). Enxeñaría industrial. Curso 2016/201

NASA Tech Briefs, April 1995

This issue of the NASA Tech Briefs has a special focus section on video and imaging, a feature on the NASA invention of the year, and a resource report on the Dryden Flight Research Center. The issue also contains articles on electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences and life sciences. In addition to the standard articles in the NASA Tech brief, this contains a supplement entitled "Laser Tech Briefs" which features an article on the National Ignition Facility, and other articles on the use of Lasers

NASA Tech Briefs, February 1996

Topics covered include: Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

Development of an acoustic measurement system of the Modulus of Elasticity in trees, logs and boards

The objective of this Bachelor’s Thesis is to develop a portable electronic device capable of quantifying the stiffness of the wood of standing trees, logs and boards using non-destructive testing (NDT) by means of acoustic wave analysis. As an indicator of stiffness, the Modulus of Elasticity (MOE) is used, a standard figure in the industry. This way, wood from forestry can be characterized and classified for different purposes. This Thesis is part of LIFE Wood For Future, a project of the University of Granada (UGR) financed by the European Union’s LIFE programme. LIFE Wood For Future aims to recover the cultivation of poplar (populus sp.) in the Vega de Granada, by proving the quality of its wood through innovative structural bioproducts. Recovering the poplar groves of Granada would have great benefits for the Metropolitan Area: creation of local and sustainable jobs, improvement of biodiversity, and increase in the absorption of carbon dioxide in the long term, helping to reduce the endemic air pollution of Granada. This Final Degree Project has been developed in collaboration with the ADIME research group of the Higher Technical School of Building Engineering (ETSIE) and the aerospace electronics group GranaSat of the UGR. The goal of the developed device, named Tree Inspection Kit (or TIK), is to be an innovative, portable and easy-to-use tool for non-destructive diagnosis and classification of wood by measuring its MOE. TIK is equipped with the necessary electronics to quantify the Time of Flight (ToF) of an acoustic wave that propagates inside a piece of wood. In order to do this, two piezoelectric probes are used, nailed in the wood and separated a given distance longitudinally. The MOE can be derived from the propagation speed of the longitudinal acoustic wave if the density of the is known. For this reason, this device has the possibility of connecting a load cell for weighing logs or boards to estimate their density. It also has an expansion port reserved for future functionality. A methodology based on the Engineering Design Process (EDP) has been followed. The scope of this project embraces all aspects of the development of an electronic product from start to finish: conceptualization, specification of requirements, design, manufacture and verification. A project of this reach requires planning, advanced knowledge of signal analysis, electronics, design and manufacture of Printed Circuit Boards (PCB) and product design, as well as the development of a firmware for the embedded system, based on a RTOS. Prior to the design of the electronics, a Reverse Engineering process of some similar products of the competition is performed; as well as an exhaustive analysis of the signals coming from the piezoelectric sensors that are going to be used, and the frequency response characterization of the piezoelectric probes themselves. This project has as its ultimate goal the demonstration of the multidisciplinary knowledge of engineering, and the capacity of analysis, design and manufacturing by the author; his skill and professionalism in CAD and EDA software required for these tasks, as well as in the documentation of the entire process.El presente Trabajo de Fin de Grado tiene como objetivo el desarrollo de un dispositivo electrónico portátil capaz de cuantificar la rigidez de la madera de árboles en pie, trozas y tablas usando ensayos no destructivos (Non-Destructive Testing, NDT) por medio del análisis de ondas acústicas. Como indicador de la rigidez se usa el Módulo de Elasticidad (MOE), una figura estándar en la industria. Este TFG forma parte de LIFE Wood For Future, un proyecto de la Universidad de Granada (UGR) financiado por el programa LIFE de la Unión Europea. LIFEWood For Future tiene como objetivo recuperar el cultivo del chopo (populus sp.) en la Vega de Granada demostrando la viabilidad de su madera a través de bioproductos estructurales innovadores. Recuperar las choperas de Granada tendría grandes beneficios para la zona del Área Metropolitana: creación de puestos de trabajo locales y sostenibles, mejora de la biodiversidad, e incremento de la tasa de absorción de dióxido de carbono a largo plazo, contribuyendo a reducir la contaminación endémica del aire en Granada. Este Trabajo de Fin de Grado se ha desarrollado con la colaboración del grupo de investigación ADIME de la Escuela Técnica Superior de Ingeniería de Edificación (ETSIE) y el grupo de electrónica aeroespacial GranaSat de la UGR. El objetivo del dispositivo, denominado Tree Inspection Kit (TIK), es ser una herramienta innovadora, portátil y fácil de usar para el diagnóstico y clasificación no destructiva de la madera por medio de su MOE. TIK está dotado de la electrónica necesaria para medir el tiempo de tránsito (ToF) de una onda acústica que se propaga en el interior de una pieza de madera. Para ello, se utilizan dos sondas piezoeléctricas clavadas en la madera y separadas longitudinalmente una distancia conocida. De la velocidad de propagación de la onda longitudinal se puede derivar el MOE, previo conocimiento de la densidad del material. Por ello, este dispositivo cuenta con la posibilidad de conectarle una célula de carga y pesar trozas o tablas para estimar su densidad. También tiene un puerto de expansión reservado para funcionalidad futura. Se ha seguido una metodología basada en el Proceso de Diseño de Ingeniería (Engineering Design Process, EDP), abarcando todos los aspectos del desarrollo de un producto electrónico de principio a fin: conceptualización, especificación de requisitos, diseño, fabricación y verificación. Un proyecto de este alcance requiere de planificación, conocimientos avanzados de análisis de señales, de electrónica, de diseño y fabricación de Placas de Circuito Impreso (PCB) y de diseño de producto, así como el desarrollo de un firmware para el sistema empotrado, basado en un RTOS. Previo al diseño de la electrónica, se realiza un proceso de Ingeniería Inversa (Reverse Engineering) de algunos productos similares de la competencia; al igual que un exhaustivo análisis de las señales provenientes de los sensores piezoeléctricos que van a utilizarse y la caracterización en frecuencia de las propias sondas piezoeléctricas. Este proyecto tiene como fin último la demostración de los conocimientos multidisciplinares propios de la ingeniería y la capacidad de análisis, diseño y fabricación por parte del autor; su habilidad y profesionalidad en el software CAD y EDA requerido para estas tareas, así como en la documentación de todo el proceso.Unión Europe

NASA Tech Briefs, May 1997

Topics covered include: Advanced Composites, Plastics and Metals; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

Cumulative index to NASA Tech Briefs, 1986-1990, volumes 10-14

Tech Briefs are short announcements of new technology derived from the R&D activities of the National Aeronautics and Space Administration. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This cumulative index of Tech Briefs contains abstracts and four indexes (subject, personal author, originating center, and Tech Brief number) and covers the period 1986 to 1990. The abstract section is organized by the following subject categories: electronic components and circuits, electronic systems, physical sciences, materials, computer programs, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences