1,552 research outputs found

    Custom Integrated Circuits

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    Contains reports on twelve research projects.Analog Devices, Inc.International Business Machines, Inc.Joint Services Electronics Program (Contract DAAL03-86-K-0002)Joint Services Electronics Program (Contract DAAL03-89-C-0001)U.S. Air Force - Office of Scientific Research (Grant AFOSR 86-0164)Rockwell International CorporationOKI Semiconductor, Inc.U.S. Navy - Office of Naval Research (Contract N00014-81-K-0742)Charles Stark Draper LaboratoryNational Science Foundation (Grant MIP 84-07285)National Science Foundation (Grant MIP 87-14969)Battelle LaboratoriesNational Science Foundation (Grant MIP 88-14612)DuPont CorporationDefense Advanced Research Projects Agency/U.S. Navy - Office of Naval Research (Contract N00014-87-K-0825)American Telephone and TelegraphDigital Equipment CorporationNational Science Foundation (Grant MIP-88-58764

    Immunotronics - novel finite-state-machine architectures with built-in self-test using self-nonself differentiation

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    A novel approach to hardware fault tolerance is demonstrated that takes inspiration from the human immune system as a method of fault detection. The human immune system is a remarkable system of interacting cells and organs that protect the body from invasion and maintains reliable operation even in the presence of invading bacteria or viruses. This paper seeks to address the field of electronic hardware fault tolerance from an immunological perspective with the aim of showing how novel methods based upon the operation of the immune system can both complement and create new approaches to the development of fault detection mechanisms for reliable hardware systems. In particular, it is shown that by use of partial matching, as prevalent in biological systems, high fault coverage can be achieved with the added advantage of reducing memory requirements. The development of a generic finite-state-machine immunization procedure is discussed that allows any system that can be represented in such a manner to be "immunized" against the occurrence of faulty operation. This is demonstrated by the creation of an immunized decade counter that can detect the presence of faults in real tim

    Custom Integrated Circuits

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    Contains reports on ten research projects.Analog Devices, Inc.IBM CorporationNational Science Foundation/Defense Advanced Research Projects Agency Grant MIP 88-14612Analog Devices Career Development Assistant ProfessorshipU.S. Navy - Office of Naval Research Contract N0014-87-K-0825AT&TDigital Equipment CorporationNational Science Foundation Grant MIP 88-5876

    Acta Cybernetica : Volume 21. Number 2.

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    Optimized synthesis of self-testable finite state machines

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    A synthesis procedure for self-testable finite state machines is presented. Testability comes under consideration when the behavioral description of the circuit is being transformed into a structural description. To this end, a novel state encoding algorithm, as well as a modified self-test architecture, is developed. Experimental results show that this approach leads to a significant reduction of hardware overhead. Self-testing circuits generally employ linear feedback shift registers for pattern generation. The impact of choosing a particular feedback polynomial on the state encoding is discussed

    A unified approach for the synthesis of self-testable finite state machines

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    Conventionally self-test hardware is added after synthesis is completed. For highly sequential circuits like controllers this design method either leads to high hardware overheads or compromises fault coverage. In this paper we outline a unified approach for considering self-test hardware like pattern generators and signature registers during synthesis. Three novel target structures are presented, and a method for designing parallel self-testable circuits is discussed in more detail. For a collection of benchmark circuits we show that hardware overheads for self-testable circuits can be significantly reduced this way without sacrificing testability

    An efficient procedure for the synthesis of fast self-testable controller structures

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    The BIST implementation of a conventionally synthesized controller in most cases requires the integration of an additional register only for rest purposes. This leads to some serious drawbacks concerning the fault coverage, the system speed and the area overhead. A synthesis technique is presented which uses the additional test register also to implement the system function by supporting self-testable pipeline-like controller structures. It will be shown, that if the need of two different registers in the final structure is already taken into account during synthesis, then the overall number of flipflops can be reduced, and the fault coverage and system speed call be enhanced. The presented algorithm constructs realizations of a given finite state machine a self-testable structure. The efficiency of the procedure is ensured by a very precise characterization of the space of suitable realizations, which avoids the computational overhead of previously published algorithms

    Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

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    Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements
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