REDUCING POWER DURING MANUFACTURING TEST USING DIFFERENT ARCHITECTURES

Power during manufacturing test can be several times higher than power consumption in functional mode. Excessive power during test can cause IR drop, over-heating, and early aging of the chips. In this dissertation, three different architectures have been introduced to reduce test power in general cases as well as in certain scenarios, including field test. In the first architecture, scan chains are divided into several segments. Every segment needs a control bit to enable capture in a segment when new faults are detectable on that segment for that pattern. Otherwise, the segment should be disabled to reduce capture power. We group the control bits together into one or more control chains. To address the extra pin(s) required to shift data into the control chain(s) and significant post processing in the first architecture, we explored a second architecture. The second architecture stitches the control bits into the chains they control as EECBs (embedded enable capture bits) in between the segments. This allows an ATPG software tool to automatically generate the appropriate EECB values for each pattern to maintain the fault coverage. This also works in the presence of an on-chip decompressor. The last architecture focuses primarily on the self-test of a device in a 3D stacked IC when an existing FPGA in the stack can be programmed as a tester. We show that the energy expended during test is significantly less than would be required using low power patterns fed by an on-chip decompressor for the same very short scan chains

A Novel Reseeding Mechanism for Improving Pseudo-Random Testing of VLSI Circuits

[[abstract]]During built-in self-test (BIST), the set of patterns generated by a pseudo-random pattern generator may not provide sufficiently high fault coverage and many patterns can't detect fault (called useless patterns). In order to reduce the test time, we can remove useless patterns or change them to useful patterns (fault dropping). In fact, a random test set includes many useless patterns. Therefore we present a technology, including both reseeding and bit modifying (a.k.a. pattern mapping) to remove useless patterns or change them to useful patterns. When patterns changed, we pick out number of different fewer bits, leading to very short test length. Then we use an additional bit counter to improve test length and achieve high fault coverage. The technique we present is applicable for single-stuck-at faults. Experimental results indicate that complete fault coverage-100% can be obtained with less test time.[[notice]]補正完畢[[journaltype]]國際[[incitationindex]]EI[[ispeerreviewed]]Y[[booktype]]紙本[[countrycodes]]TW

Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

Phase Locking Authentication for Scan Architecture

Scan design is a widely used Design for Testability (DfT) approach for digital circuits. It provides a high level of controllability and observability resulting in a high fault coverage. To achieve a high level of testability, scan architecture must provide access to the internal nodes of the circuit-under-test (CUT). This access however leads to vulnerability in the security of the CUT. If an unrestricted access is provided through a scan architecture, unlimited test vectors can be applied to the CUT and its responses can be captured. Such an unrestricted access to the CUT can potentially undermine the security of the critical information stored in the CUT. There is a need to secure scan architecture to prevent hardware attacks however a secure solution may limit the CUT testability. There is a trade-off between security and testability, therefore, a secure scan architecture without hindering its controllability and observability is required. Three solutions to secure scan architecture have been proposed in this thesis. In the first method, the tester is authenticated and the number of authentication attempts has been limited. In the second method, a Phase Locked Loop (PLL) is utilized to secure scan architecture. In the third method, the scan architecture is secured through a clock and data recovery (CDR) technique. This is a manuscript based thesis and the results of this study have been published in two conference proceedings. The latest results have also been prepared as an article for submission to a high rank conference

Delay Measurements and Self Characterisation on FPGAs

This thesis examines new timing measurement methods for self delay characterisation of Field-Programmable Gate Arrays (FPGAs) components and delay measurement of complex circuits on FPGAs. Two novel measurement techniques based on analysis of a circuit's output failure rate and transition probability is proposed for accurate, precise and efficient measurement of propagation delays. The transition probability based method is especially attractive, since it requires no modifications in the circuit-under-test and requires little hardware resources, making it an ideal method for physical delay analysis of FPGA circuits. The relentless advancements in process technology has led to smaller and denser transistors in integrated circuits. While FPGA users benefit from this in terms of increased hardware resources for more complex designs, the actual productivity with FPGA in terms of timing performance (operating frequency, latency and throughput) has lagged behind the potential improvements from the improved technology due to delay variability in FPGA components and the inaccuracy of timing models used in FPGA timing analysis. The ability to measure delay of any arbitrary circuit on FPGA offers many opportunities for on-chip characterisation and physical timing analysis, allowing delay variability to be accurately tracked and variation-aware optimisations to be developed, reducing the productivity gap observed in today's FPGA designs. The measurement techniques are developed into complete self measurement and characterisation platforms in this thesis, demonstrating their practical uses in actual FPGA hardware for cross-chip delay characterisation and accurate delay measurement of both complex combinatorial and sequential circuits, further reinforcing their positions in solving the delay variability problem in FPGAs

System-on-Chip Design and Test with Embedded Debug Capabilities

In this project, I started with a System-on-Chip platform with embedded test structures. The baseline platform consisted of a Leon2 CPU, AMBA on-chip bus, and an Advanced Encryption Standard decryption module. The basic objective of this thesis was to use the embedded reconfigurable logic blocks for post-silicon debug and verification. The System-on-Chip platform was designed at the register transistor level and implemented in a 180-nm IBM process. Test logic instrumentation was done with DAFCA (Design Automation for Flexible Chip Architecture) Inc. pre-silicon tools. The design was then synthesized using the Synopsys Design Compiler and placed and routed using Cadence SOC Encounter. Total transistor count is about 3 million, including 1400K transistors for the debug module serving as on chip logic analyzer. Core size of the design is about 4.8mm x 4.8mm and the system is working at 151MHz. Design verification was done with Cadence NCSim. The controllability and observability of internal signals of the design is greatly increased with the help of pre-silicon tools which helps locate bugs and later fix them with the help of post-silicon tools. This helps prevent re-spins on several occasions thus saving millions of dollars. Post-silicon tools have been used to program assertions and triggers and inject numerous personalities into the reconfigurable fabric which has greatly increased the versatility of the circuit

Layer-by-layer assembly of organic films and their application to multichannel surface plasmon resonance sensing

This thesis provides a study of a single chip, multi-channel surface plasmon resonance (SPR) imaging system. The equipment has no moving parts and uses a single sensor "chip" onto which multiple channels can be incorporated. A light emitting diode is used as a photon source while a CCD camera forms the detector. The optical configuration has been designed to achieve a uniform illumination of the sample over a fixed area with a range of incident angles. Poly(ethylene imine), PEI, poly(ethylene-co-maleic acid), PMAE, poly(styrene sulfonate), PSS, and a cationic modified polyacrylic ester, PMADAMBQ, are used as the molecular "bricks" in layer-by-layer (LbL) self-assembled organic architectures. Reflectivity changes in real time are used to follow the adsorption steps during the deposition of the multilayer films. Sensing experiments are mainly focused on the first row transition metals such as iron (II), nickel (II), copper (II)and zinc (II). Sensing of anionic sodium dodecylbenzene sulphate, C(_12)H(_25)C(_6)H(_4)SO(_3)Na, and a reversible pH-dependent response for a PEI/PMAE/PMADAMBQ LbL film are also reported. Using a two bilayer structure, PEI/PMAE/PMADAMBQ/PMAE, a detection limit of less of one part per million for copper ions in solution is measured. Atomic force microscopy is used to elucidate the morphology of the organic films. In some cases, the visualization of isolated polymeric chains is demonstrated. It is proved that polyelectrolytes of different charge density form dissimilar structures. The outer surface of PEI/PSS bilayers appears to be more uniform than that of PEI/PMAE bilayers. This is believed to have an influence on the sensing performance of the LbL architectures. The use of the SPR sensing system for simultaneous interrogation of different polyelectrolyte thin films is demonstrated. Two different LbL self-assembled films, PEI/PSS and PEI/PMAE, are built-up on the same chip. Their response to a variety of metal ions is shown to be independent and reasonably reproducible. Moreover, consistent results are obtained when using sensing chips stored for a relatively long time

DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

Automated Debugging Methodology for FPGA-based Systems

Electronic devices make up a vital part of our lives. These are seen from mobiles, laptops, computers, home automation, etc. to name a few. The modern designs constitute billions of transistors. However, with this evolution, ensuring that the devices fulfill the designer’s expectation under variable conditions has also become a great challenge. This requires a lot of design time and effort. Whenever an error is encountered, the process is re-started. Hence, it is desired to minimize the number of spins required to achieve an error-free product, as each spin results in loss of time and effort. Software-based simulation systems present the main technique to ensure the verification of the design before fabrication. However, few design errors (bugs) are likely to escape the simulation process. Such bugs subsequently appear during the post-silicon phase. Finding such bugs is time-consuming due to inherent invisibility of the hardware. Instead of software simulation of the design in the pre-silicon phase, post-silicon techniques permit the designers to verify the functionality through the physical implementations of the design. The main benefit of the methodology is that the implemented design in the post-silicon phase runs many order-of-magnitude faster than its counterpart in pre-silicon. This allows the designers to validate their design more exhaustively. This thesis presents five main contributions to enable a fast and automated debugging solution for reconfigurable hardware. During the research work, we used an obstacle avoidance system for robotic vehicles as a use case to illustrate how to apply the proposed debugging solution in practical environments. The first contribution presents a debugging system capable of providing a lossless trace of debugging data which permits a cycle-accurate replay. This methodology ensures capturing permanent as well as intermittent errors in the implemented design. The contribution also describes a solution to enhance hardware observability. It is proposed to utilize processor-configurable concentration networks, employ debug data compression to transmit the data more efficiently, and partially reconfiguring the debugging system at run-time to save the time required for design re-compilation as well as preserve the timing closure. The second contribution presents a solution for communication-centric designs. Furthermore, solutions for designs with multi-clock domains are also discussed. The third contribution presents a priority-based signal selection methodology to identify the signals which can be more helpful during the debugging process. A connectivity generation tool is also presented which can map the identified signals to the debugging system. The fourth contribution presents an automated error detection solution which can help in capturing the permanent as well as intermittent errors without continuous monitoring of debugging data. The proposed solution works for designs even in the absence of golden reference. The fifth contribution proposes to use artificial intelligence for post-silicon debugging. We presented a novel idea of using a recurrent neural network for debugging when a golden reference is present for training the network. Furthermore, the idea was also extended to designs where golden reference is not present

Within-Die Delay Variation Measurement And Analysis For Emerging Technologies Using An Embedded Test Structure

Both random and systematic within-die process variations (PV) are growing more severe with shrinking geometries and increasing die size. Escalation in the variations in delay and power with reductions in feature size places higher demands on the accuracy of variation models. Their availability can be used to improve yield, and the corresponding profitability and product quality of the fabricated integrated circuits (ICs). Sources of within-die variations include optical source limitations, and layout-based systematic effects (pitch, line-width variability, and microscopic etch loading). Unfortunately, accurate models of within-die PVs are becoming more difficult to derive because of their increasingly sensitivity to design-context. Embedded test structures (ETS) continue to play an important role in the development of models of PVs and as a mechanism to improve correlations between hardware and models. Variations in path delays are increasing with scaling, and are increasingly affected by neighborhood\u27 interactions. In order to fully characterize within-die variations, delays must be measured in the context of actual core-logic macros. Doing so requires the use of an embedded test structure, as opposed to traditional scribe line test structures such as ring oscillators (RO). Accurate measurements of within-die variations can be used, e.g., to better tune models to actual hardware (model-to-hardware correlations). In this research project, I propose an embedded test structure called REBEL (Regional dELay BEhavior) that is designed to measure path delays in a minimally invasive fashion; and its architecture measures the path delays more accurately. Design for manufacture-ability (DFM) analysis is done on the on 90 nm ASIC chips and 28nm Zynq 7000 series FPGA boards. I present ASIC results on within-die path delay variations in a floating-point unit (FPU) fabricated in IBM\u27s 90 nm technology, with 5 pipeline stages, used as a test vehicle in chip experiments carried out at nine different temperature/voltage (TV) corners. Also experimental data has been analyzed for path delay variations in short vs long paths. FPGA results on within-die variation and die-to-die variations on Advanced Encryption System (AES) using single pipelined stage are also presented. Other analysis that have been performed on the calibrated path delays are Flip Flop propagation delays for both rising and falling edge (tpHL and tpLH), uncertainty analysis, path distribution analysis, short versus long path variations and mid-length path within-die variation. I also analyze the impact on delay when the chips are subjected to industrial-level temperature and voltage variations. From the experimental results, it has been established that the proposed REBEL provides capabilities similar to an off-chip logic analyzer, i.e., it is able to capture the temporal behavior of the signal over time, including any static and dynamic hazards that may occur on the tested path. The ASIC results further show that path delays are correlated to the launch-capture (LC) interval used to time them. Therefore, calibration as proposed in this work must be carried out in order to obtain an accurate analysis of within-die variations. Results on ASIC chips show that short paths can vary up to 35% on average, while long paths vary up to 20% at nominal temperature and voltage. A similar trend occurs for within-die variations of mid-length paths where magnitudes reduced to 20% and 5%, respectively. The magnitude of delay variations in both these analyses increase as temperature and voltage are changed to increase performance. The high level of within-die delay variations are undesirable from a design perspective, but they represent a rich source of entropy for applications that make use of \u27secrets\u27 such as authentication, hardware metering and encryption. Physical unclonable functions (PUFs) are a class of primitives that leverage within-die-variations as a means of generating random bit strings for these types of applications, including hardware security and trust. Zynq FPGAs Die-to-Die and within-die variation study shows that on average there is 5% of within-Die variation and the range of die-to-Die variation can go upto 3ns. The die-to-Die variations can be explored in much further detail to study the variations spatial dependance. Additionally, I also carried out research in the area data mining to cater for big data by focusing the work on decision tree classification (DTC) to speed-up the classification step in hardware implementation. For this purpose, I devised a pipelined architecture for the implementation of axis parallel binary decision tree classification for meeting up with the requirements of execution time and minimal resource usage in terms of area. The motivation for this work is that analyzing larger data-sets have created abundant opportunities for algorithmic and architectural developments, and data-mining innovations, thus creating a great demand for faster execution of these algorithms, leading towards improving execution time and resource utilization. Decision trees (DT) have since been implemented in software programs. Though, the software implementation of DTC is highly accurate, the execution times and the resource utilization still require improvement to meet the computational demands in the ever growing industry. On the other hand, hardware implementation of DT has not been thoroughly investigated or reported in detail. Therefore, I propose a hardware acceleration of pipelined architecture that incorporates the parallel approach in acquiring the data by having parallel engines working on different partitions of data independently. Also, each engine is processing the data in a pipelined fashion to utilize the resources more efficiently and reduce the time for processing all the data records/tuples. Experimental results show that our proposed hardware acceleration of classification algorithms has increased throughput, by reducing the number of clock cycles required to process the data and generate the results, and it requires minimal resources hence it is area efficient. This architecture also enables algorithms to scale with increasingly large and complex data sets. We developed the DTC algorithm in detail and explored techniques for adapting it to a hardware implementation successfully. This system is 3.5 times faster than the existing hardware implementation of classification.\u2