CMOS low noise amplifier design utilizing monolithic transformers

Full integration of CMOS low noise amplifiers (LNA) presents a challenge for low cost CMOS receiver systems. A critical problem faced in the design of an RF CMOS LNA is the inaccurate high-frequency noise model of the MOSFET implemented in circuit simulators such as SPICE. Silicon-based monolithic inductors are another bottleneck in RF CMOS design due to their poor quality factor. In this thesis, a CMOS implementation of a fully-integrated differential LNA is presented. A small-signal noise circuit model that includes the two most important noise sources of the MOSFET at radio frequencies, channel thermal noise and induced gate current noise, is developed for CMOS LNA analysis and simulation. Various CMOS LNA architectures are investigated. The optimization techniques and design guidelines and procedures for an LC tuned CMOS LNA are also described. Analysis and modeling of silicon-based monolithic inductors and transformers are presented and it is shown that in fully-differential applications, a monolithic transformer occupies less die area and achieves a higher quality factor compared to two independent inductors with the same total effective inductance. It is also shown that monolithic transformers improve the common-mode rejection of the differential circuits

Design and computer-aided optimization of RF CMOS power amplifiers

In recent years, there has been an extensive effort to develop low-cost implementations of radio frequency integrated circuits for consumer applications. This thesis is a research effort in the design and implementation of integrated RF CMOS Power Amplifiers (PAs). A significant challenge in the implementation of RF CMOS ICs is the impact of device, package and passive element parasitics on circuit performance. Passive components are a critical part of any RF IC design, and a process optimized for digital circuits results in inductors and capacitors with very high parasitics. In this work, we have developed a compact model for inductors fabricated in a digital CMOS process. Measured results have been used to further refine the accuracy of the inductor model. This model has been used to predict the impact of inductor parasitics on the performance of RFICs, and is also simple enough to be included in a CAD tool for circuit optimization. We have also studied the operation of Class A, B and C power amplifiers and highlighted design issues which are specific to the implementation of integrated PAs. It is shown that inductor loss has the most critical impact on the performance of integrated PAs. A custom CAD tool, based on the simulated annealing algorithm, has been developed to optimize the performance of power amplifiers for maximum efficiency in the presence of package, device and passive element parasitics. This CAD tool simulates the process of load-pull to determine the optimum large-signal load impedance for the PA, and optimizes the matching network design based on the trade-off between the loss in the matching network and its impedance transformation properties. This trade-off is relevant in the case of high-loss matching networks only, as is the case in integrated RF CMOS ICs. This CAD tool has been used to optimize the efficiency of balanced 100mW CMOS PAs operating at 900MHz. Measured results validate the design and optimization process outlined in this work. It is demonstrated that in the design of RF CMOS ICs, significant benefits can be gained by incorporating parasitics into the design process by means of CAD optimization. The CAD tool developed is an effort towards achieving this goal. It is further proposed that CAD optimization is an essential part of the design of RF CMOS ICs in general, and with the development of improved package, device and passive element models, CAD optimization will replace the "tuning" of RF circuits and result in robust, fully-integrated implementations of RF circuits

CMOS Integrated Power Amplifiers for RF Reconfigurable and Digital Transmitters

abstract: This dissertation focuses on three different efficiency enhancement methods that are applicable to handset applications. These proposed designs are based on three critical requirements for handset application: 1) Small form factor, 2) CMOS compatibility and 3) high power handling. The three presented methodologies are listed below: 1) A transformer-based power combiner architecture for out-phasing transmitters 2) A current steering DAC-based average power tracking circuit for on-chip power amplifiers (PA) 3) A CMOS-based driver stage for GaN-based switched-mode power amplifiers applicable to fully digital transmitters This thesis highlights the trends in wireless handsets, the motivates the need for fully-integrated CMOS power amplifier solutions and presents the three novel techniques for reconfigurable and digital CMOS-based PAs. Chapter 3, presents the transformer-based power combiner for out-phasing transmitters. The simulation results reveal that this technique is able to shrink the power combiner area, which is one of the largest parts of the transmitter, by about 50% and as a result, enhances the output power density by 3dB. The average power tracking technique (APT) integrated with an on-chip CMOS-based power amplifier is explained in Chapter 4. This system is able to achieve up to 32dBm saturated output power with a linear power gain of 20dB in a 45nm CMOS SOI process. The maximum efficiency improvement is about ∆η=15% compared to the same PA without APT. Measurement results show that the proposed method is able to amplify an enhanced-EDGE modulated input signal with a data rate of 70.83kb/sec and generate more than 27dBm of average output power with EVM<5%. Although small form factor, high battery lifetime, and high volume integration motivate the need for fully digital CMOS transmitters, the output power generated by this type of transmitter is not high enough to satisfy the communication standards. As a result, compound materials such as GaN or GaAs are usually being used in handset applications to increase the output power. Chapter 5 focuses on the analysis and design of two CMOS based driver architectures (cascode and house of cards) for driving a GaN power amplifier. The presented results show that the drivers are able to generate ∆Vout=5V, which is required by the compound transistor, and operate up to 2GHz. Since the CMOS driver is expected to drive an off-chip capacitive load, the interface components, such as bond wires, and decoupling and pad capacitors, play a critical role in the output transient response. Therefore, extensive analysis and simulation results have been done on the interface circuits to investigate their effects on RF transmitter performance. The presented results show that the maximum operating frequency when the driver is connected to a 4pF capacitive load is about 2GHz, which is perfectly matched with the reported values in prior literature.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

ULTRA LOW POWER FSK RECEIVER AND RF ENERGY HARVESTER

This thesis focuses on low power receiver design and energy harvesting techniques as methods for intelligently managing energy usage and energy sources. The goal is to build an inexhaustibly powered communication system that can be widely applied, such as through wireless sensor networks (WSNs). Low power circuit design and smart power management are techniques that are often used to extend the lifetime of such mobile devices. Both methods are utilized here to optimize power usage and sources. RF energy is a promising ambient energy source that is widely available in urban areas and which we investigate in detail. A harvester circuit is modeled and analyzed in detail at low power input. Based on the circuit analysis, a design procedure is given for a narrowband energy harvester. The antenna and harvester co-design methodology improves RF to DC energy conversion efficiency. The strategy of co-design of the antenna and the harvester creates opportunities to optimize the system power conversion efficiency. Previous surveys have found that ambient RF energy is spread broadly over the frequency domain; however, here it is demonstrated that it is theoretically impossible to harvest RF energy over a wide frequency band if the ambient RF energy source(s) are weak, owing to the voltage requirements. It is found that most of the ambient RF energy lies in a series of narrow bands. Two different versions of harvesters have been designed, fabricated, and tested. The simulated and measured results demonstrate a dual-band energy harvester that obtains over 9% efficiency for two different bands (900MHz and 1800MHz) at an input power as low as -19dBm. The DC output voltage of this harvester is over 1V, which can be used to recharge the battery to form an inexhaustibly powered communication system. A new phase locked loop based receiver architecture is developed to avoid the significant conversion losses associated with OOK architectures. This also helps to minimize power consumption. A new low power mixer circuit has also been designed, and a detailed analysis is provided. Based on the mixer, a low power phase locked loop (PLL) based receiver has been designed, fabricated and measured. A power management circuit and a low power transceiver system have also been co-designed to provide a system on chip solution. The low power voltage regulator is designed to handle a variety of battery voltage, environmental temperature, and load conditions. The whole system can work with a battery and an application specific integrated circuit (ASIC) as a sensor node of a WSN network

Design of a 10GHz RF power amplifier in 130nm CMOS technology based on Wilkinson combiner methodology

There is a growing demand today to design and fabricate RF power amplifiers at high frequencies above 5GHz that can directly drive a 50Ω antenna with sufficiently high transmission power to meet the needs of various wireless communication applications. This has typically been done by using GaN or other III-V technologies to build the power amplifier transistor, in order to allow for the use of much higher power supply voltages, than are used in today’s silicon technologies. For example, a 5W GaN power amplifier at 5GHz would typically make use of a VDD of 5V to 10V, and would be done as a discrete device on a separate module from the RF analog circuitry built out of silicon. With the continuing evolution of Moore’s Law, silicon technologies in use today for high frequency wireless communications typically are using VDD of 1.5V or less. There is a desire, however, in many wireless applications to be able to place the RF power amplifier on the same silicon chip as all the other RF/analog IC circuitry, in order to save chip fabrication cost. Consequently, research in improved methods of RF power amplifier design in silicon technology is being done in many IC design laboratories in order to increase the RF power output of power amplifiers built in silicon. This MS Thesis proposes the complete design of a four channel RF power amplifier by using the Wilkinson combiner with 27dBm output power. All the circuits are designed and implemented based on the Global Foundries 130nm SiGe BiCMOS technology and design kit at a frequency of 10GHz with a VDD = 1.5V, to provide 0.5W of RF output signal power into a 50Ω antenna