Test Strategies for Low Power Devices

Ultra low-power devices are being developed for embedded applications in bio-medical electronics, wireless sensor networks, environment monitoring and protection, etc. The testing of these low-cost, low-power devices is a daunting task. Depending on the target application, there are stringent guidelines on the number of defective parts per million shipped devices. At the same time, since such devices are cost-sensitive, test cost is a major consideration. Since system-level power-management techniques are employed in these devices, test generation must be power-management-aware to avoid stressing the power distribution infrastructure in the test mode. Structural test techniques such as scan test, with or without compression, can result in excessive heat dissipation during testing and damage the package. False failures may result due to the electrical and thermal stressing of the device in the test mode of operation, leading to yield loss. This paper considers different aspects of testing low-power devices and some new techniques to address these problems.Design, Automation and Test in Europe (DATE \u2708), 10-14 March 2008, Munich, German

REDUCING POWER DURING MANUFACTURING TEST USING DIFFERENT ARCHITECTURES

Power during manufacturing test can be several times higher than power consumption in functional mode. Excessive power during test can cause IR drop, over-heating, and early aging of the chips. In this dissertation, three different architectures have been introduced to reduce test power in general cases as well as in certain scenarios, including field test. In the first architecture, scan chains are divided into several segments. Every segment needs a control bit to enable capture in a segment when new faults are detectable on that segment for that pattern. Otherwise, the segment should be disabled to reduce capture power. We group the control bits together into one or more control chains. To address the extra pin(s) required to shift data into the control chain(s) and significant post processing in the first architecture, we explored a second architecture. The second architecture stitches the control bits into the chains they control as EECBs (embedded enable capture bits) in between the segments. This allows an ATPG software tool to automatically generate the appropriate EECB values for each pattern to maintain the fault coverage. This also works in the presence of an on-chip decompressor. The last architecture focuses primarily on the self-test of a device in a 3D stacked IC when an existing FPGA in the stack can be programmed as a tester. We show that the energy expended during test is significantly less than would be required using low power patterns fed by an on-chip decompressor for the same very short scan chains

Doctor of Philosophy

dissertationThe design of integrated circuit (IC) requires an exhaustive verification and a thorough test mechanism to ensure the functionality and robustness of the circuit. This dissertation employs the theory of relative timing that has the advantage of enabling designers to create designs that have significant power and performance over traditional clocked designs. Research has been carried out to enable the relative timing approach to be supported by commercial electronic design automation (EDA) tools. This allows asynchronous and sequential designs to be designed using commercial cad tools. However, two very significant holes in the flow exist: the lack of support for timing verification and manufacturing test. Relative timing (RT) utilizes circuit delay to enforce and measure event sequencing on circuit design. Asynchronous circuits can optimize power-performance product by adjusting the circuit timing. A thorough analysis on the timing characteristic of each and every timing path is required to ensure the robustness and correctness of RT designs. All timing paths have to conform to the circuit timing constraints. This dissertation addresses back-end design robustness by validating full cyclical path timing verification with static timing analysis and implementing design for testability (DFT). Circuit reliability and correctness are necessary aspects for the technology to become commercially ready. In this study, scan-chain, a commercial DFT implementation, is applied to burst-mode RT designs. In addition, a novel testing approach is developed along with scan-chain to over achieve 90% fault coverage on two fault models: stuck-at fault model and delay fault model. This work evaluates the cost of DFT and its coverage trade-off then determines the best implementation. Designs such as a 64-point fast Fourier transform (FFT) design, an I2C design, and a mixed-signal design are built to demonstrate power, area, performance advantages of the relative timing methodology and are used as a platform for developing the backend robustness. Results are verified by performing post-silicon timing validation and test. This work strengthens overall relative timed circuit flow, reliability, and testability

Design and Evaluation of Radiation-Hardened Standard Cell Flip-Flops

Use of a standard non-rad-hard digital cell library in the rad-hard design can be a cost-effective solution for space applications. In this paper we demonstrate how a standard non-rad-hard flip-flop, as one of the most vulnerable digital cells, can be converted into a rad-hard flip-flop without modifying its internal structure. We present five variants of a Triple Modular Redundancy (TMR) flip-flop: baseline TMR flip-flop, latch-based TMR flip-flop, True-Single Phase Clock (TSPC) TMR flip-flop, scannable TMR flip-flop and self-correcting TMR flip-flop. For all variants, the multi-bit upsets have been addressed by applying special placement constraints, while the Single Event Transient (SET) mitigation was achieved through the usage of customized SET filters and selection of optimal inverter sizes for the clock and reset trees. The proposed flip-flop variants feature differing performance, thus enabling to choose the optimal solution for every sensitive node in the circuit, according to the predefined design constraints. Several flip-flop designs have been validated on IHP’s 130nm BiCMOS process, by irradiation of custom-designed shift registers. It has been shown that the proposed TMR flip-flops are robust to soft errors with a threshold Linear Energy Transfer (LET) from ( 32.4 (MeV⋅cm2/mg) ) to ( 62.5 (MeV⋅cm2/mg) ), depending on the variant

Test and Diagnosis of Integrated Circuits

The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users, the manufacturing process is becoming finer and denser, making chips more prone to defects.The work presented in the HDR manuscript addresses the challenges of test and diagnosis of integrated circuits. It covers:- Power aware test;- Test of Low Power Devices;- Fault Diagnosis of digital circuits

The impact of design techniques in the reduction of power consumption of SoCs Multimedia

Orientador: Guido Costa Souza de AraújoDissertação (mestrado) - Universidade Estadual de Campinas, Instituto de ComputaçãoResumo: A indústria de semicondutores sempre enfrentou fortes demandas em resolver problema de dissipação de calor e reduzir o consumo de energia em dispositivos. Esta tendência tem sido intensificada nos últimos anos com o movimento de sustentabilidade ambiental. A concepção correta de um sistema eletrônico de baixo consumo de energia é um problema de vários níveis de complexidade e exige estratégias sistemáticas na sua construção. Fora disso, a adoção de qualquer técnica de redução de energia sempre está vinculada com objetivos especiais e provoca alguns impactos no projeto. Apesar dos projetistas conheçam bem os impactos de forma qualitativa, as detalhes quantitativas ainda são incógnitas ou apenas mantidas dentro do 'know-how' das empresas. Neste trabalho, de acordo com resultados experimentais baseado num plataforma de SoC1 industrial, tentamos quantificar os impactos derivados do uso de técnicas de redução de consumo de energia. Nos concentramos em relacionar o fator de redução de energia de cada técnica aos impactos em termo de área, desempenho, esforço de implementação e verificação. Na ausência desse tipo de dados, que relacionam o esforço de engenharia com as metas de consumo de energia, incertezas e atrasos serão frequentes no cronograma de projeto. Esperamos que este tipo de orientações possam ajudar/guiar os arquitetos de projeto em selecionar as técnicas adequadas para reduzir o consumo de energia dentro do alcance de orçamento e cronograma de projetoAbstract: The semiconductor industry has always faced strong demands to solve the problem of heat dissipation and reduce the power consumption in electronic devices. This trend has been increased in recent years with the action of environmental sustainability. The correct conception of an electronic system for low power consumption is an issue with multiple levels of complexities and requires systematic approaches in its construction. However, the adoption of any technique for reducing the power consumption is always linked with some specific goals and causes some impacts on the project. Although the designers know well that these impacts can affect the design in a quality aspect, the quantitative details are still unkown or just be kept inside the company's know-how. In this work, according to the experimental results based on an industrial SoC2 platform, we try to quantify the impacts of the use of low power techniques. We will relate the power reduction factor of each technique to the impact in terms of area, performance, implementation and verification effort. In the absence of such data, which relates the engineering effort to the goals of power consumption, uncertainties and delays are frequent. We hope that such guidelines can help/guide the project architects in selecting the appropriate techniques to reduce the power consumption within the limit of budget and project scheduleMestradoCiência da ComputaçãoMestre em Ciência da Computaçã

Techniques for Improving Security and Trustworthiness of Integrated Circuits

The integrated circuit (IC) development process is becoming increasingly vulnerable to malicious activities because untrusted parties could be involved in this IC development flow. There are four typical problems that impact the security and trustworthiness of ICs used in military, financial, transportation, or other critical systems: (i) Malicious inclusions and alterations, known as hardware Trojans, can be inserted into a design by modifying the design during GDSII development and fabrication. Hardware Trojans in ICs may cause malfunctions, lower the reliability of ICs, leak confidential information to adversaries or even destroy the system under specifically designed conditions. (ii) The number of circuit-related counterfeiting incidents reported by component manufacturers has increased significantly over the past few years with recycled ICs contributing the largest percentage of the total reported counterfeiting incidents. Since these recycled ICs have been used in the field before, the performance and reliability of such ICs has been degraded by aging effects and harsh recycling process. (iii) Reverse engineering (RE) is process of extracting a circuit’s gate-level netlist, and/or inferring its functionality. The RE causes threats to the design because attackers can steal and pirate a design (IP piracy), identify the device technology, or facilitate other hardware attacks. (iv) Traditional tools for uniquely identifying devices are vulnerable to non-invasive or invasive physical attacks. Securing the ID/key is of utmost importance since leakage of even a single device ID/key could be exploited by an adversary to hack other devices or produce pirated devices. In this work, we have developed a series of design and test methodologies to deal with these four challenging issues and thus enhance the security, trustworthiness and reliability of ICs. The techniques proposed in this thesis include: a path delay fingerprinting technique for detection of hardware Trojans, recycled ICs, and other types counterfeit ICs including remarked, overproduced, and cloned ICs with their unique identifiers; a Built-In Self-Authentication (BISA) technique to prevent hardware Trojan insertions by untrusted fabrication facilities; an efficient and secure split manufacturing via Obfuscated Built-In Self-Authentication (OBISA) technique to prevent reverse engineering by untrusted fabrication facilities; and a novel bit selection approach for obtaining the most reliable bits for SRAM-based physical unclonable function (PUF) across environmental conditions and silicon aging effects

Power Minimisation Techniques for Testing Low Power VLSI Circuits (PhD Dissertation)

Testing low power very large scale integrated (VLSI) circuits has recently become an area of concern due to yield and reliability problems. This dissertation focuses on minimising power dissipation during test application at logic level and register-transfer level (RTL) of abstraction of the VLSI design flow. The first part of this dissertation addresses power minimisation techniques in scan sequential circuits at the logic level of abstraction. A new best primary input change (BPIC) technique based on a novel test application strategy has been proposed. The technique increases the correlation between successive states during shifting in test vectors and shifting out test responses by changing the primary inputs such that the smallest number of transitions is achieved. The new technique is test set dependent and it is applicable to small to medium sized full and partial scan sequential circuits. Since the proposed test application strategy depends only on controlling primary input change time, power is minimised with no penalty in test area, performance, test efficiency, test application time or volume of test data. Furthermore, it is shown that partial scan does not provide only the commonly known benefits such as less test area overhead and test application time, but also less power dissipation during test application when compared to full scan. To achieve power savings in large scan sequential circuits a new test set independent multiple scan chain-based technique which employs a new design for test (DFT) architecture and a novel test application strategy, is presented. The technique has been validated using benchmark examples, and it has been shown that power is minimised with low computational time, low overhead in test area and volume of test data, and with no penalty in test application time, test efficiency, or performance. The second part of this dissertation addresses power minimisation techniques for testing low power VLSI circuits using built-in self-test (BIST) at RTL. First, it is important to overcome the shortcomings associated with traditional BIST methodologies. It is shown how a new BIST methodology for RTL data paths using a novel concept called test compatibility classes (TCC) overcomes high test application time, BIST area overhead, performance degradation, volume of test data, fault-escape probability, and complexity of the testable design space exploration. Second, power minimisation in BIST RTL data paths is achieved by analysing the effect of test synthesis and test scheduling on power dissipation during test application and by employing new power conscious test synthesis and test scheduling algorithms. Third, the new BIST methodology has been validated using benchmark examples. Further, it is shown that when the proposed power conscious test synthesis and test scheduling is combined with novel test compatibility classes simultaneous reduction in test application time and power dissipation is achieved with low overhead in computational time

Spatial defects nanoengineering for bipolar conductivity in MoS2

Understanding the atomistic origin of defects in two-dimensional transition metal dichalcogenides, their impact on the electronic properties, and how to control them is critical for future electronics and optoelectronics. Here, we demonstrate the integration of thermochemical scanning probe lithography (tc-SPL) with a flow-through reactive gas cell to achieve nanoscale control of defects in monolayer MoS2. The tc-SPL produced defects can present either p- or n-type doping on demand, depending on the used gasses, allowing the realization of field effect transistors, and p-n junctions with precise sub-μm spatial control, and a rectification ratio of over 104. Doping and defects formation are elucidated by means of X-Ray photoelectron spectroscopy, scanning transmission electron microscopy, and density functional theory. We find that p-type doping in HCl/H2O atmosphere is related to the rearrangement of sulfur atoms, and the formation of protruding covalent S-S bonds on the surface. Alternatively, local heating MoS2 in N2 produces n-character