Development of Wireless Techniques in Data and Power Transmission - Application for Particle Physics Detectors

Wireless techniques have developed extremely fast over the last decade and using them for data and power transmission in particle physics detectors is not science- fiction any more. During the last years several research groups have independently thought of making it a reality. Wireless techniques became a mature field for research and new developments might have impact on future particle physics experiments. The Instrumentation Frontier was set up as a part of the SnowMass 2013 Community Summer Study [1] to examine the instrumentation R&D for the particle physics research over the coming decades: {\guillemotleft} To succeed we need to make technical and scientific innovation a priority in the field {\guillemotright}. Wireless data transmission was identified as one of the innovations that could revolutionize the transmission of data out of the detector. Power delivery was another challenge mentioned in the same report. We propose a collaboration to identify the specific needs of different projects that might benefit from wireless techniques. The objective is to provide a common platform for research and development in order to optimize effectiveness and cost, with the aim of designing and testing wireless demonstrators for large instrumentation systems

Performance and Energy Trade-offs for 3D IC NoC Interconnects and Architectures

With the increased complexity and continual scaling of integrated circuit performance, multi-core chips with dozens, hundreds, even thousands of parallel computing units require high performance interconnects to maximize data throughput and minimize latency and energy consumption. High core counts render bus based interconnects inefficient and lackluster in performance. Networks-on-Chip were introduced to simplify the interconnect design process and maintain a more scalable interconnection architecture. With the continual scaling of feature sizes for smaller and smaller transistors, the global interconnections of planar integrated circuits are consuming higher energy proportional to the rest of the chip power dissipation as well as increasing communication delays. Three-dimensional integrated circuits were introduced to shorten global wire lengths and increase chip connectivity. These 3D ICs bring heat dissipation challenges as the power density increases drastically for each additional chip layer. One of the most popularly researched vertical interconnection technologies is through-silicon vias (TSVs). TSVs require additional manufacturing steps to build but generally have low energy dissipation and good performance. Alternative wireless technologies such as capacitive or inductive coupling do not require additional manufacturing steps and also provide the option of having a liquid cooling layer between planar chips. They are typically much slower and consume more energy than their wired counterparts, however. This work compares the interconnection technologies across several different NoC architectures including a proposed sparse 3D mesh for inductive coupling that increases vertical throughput per link and reduces chip area compared to the other wireless architectures and technologies

Overcoming the Challenges for Multichip Integration: A Wireless Interconnect Approach

The physical limitations in the area, power density, and yield restrict the scalability of the single-chip multicore system to a relatively small number of cores. Instead of having a large chip, aggregating multiple smaller chips can overcome these physical limitations. Combining multiple dies can be done either by stacking vertically or by placing side-by-side on the same substrate within a single package. However, in order to be widely accepted, both multichip integration techniques need to overcome significant challenges. In the horizontally integrated multichip system, traditional inter-chip I/O does not scale well with technology scaling due to limitations of the pitch. Moreover, to transfer data between cores or memory components from one chip to another, state-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the target chip over a wireline interconnect fabric. This multi-hop communication increases energy consumption while decreasing data bandwidth in a multichip system. On the other hand, in vertically integrated multichip system, the high power density resulting from the placement of computational components on top of each other aggravates the thermal issues of the chip leading to degraded performance and reduced reliability. Liquid cooling through microfluidic channels can provide cooling capabilities required for effective management of chip temperatures in vertical integration. However, to reduce the mechanical stresses and at the same time, to ensure temperature uniformity and adequate cooling competencies, the height and width of the microchannels need to be increased. This limits the area available to route Through-Silicon-Vias (TSVs) across the cooling layers and make the co-existence and co-design of TSVs and microchannels extreamly challenging. Research in recent years has demonstrated that on-chip and off-chip wireless interconnects are capable of establishing radio communications within as well as between multiple chips. The primary goal of this dissertation is to propose design principals targeting both horizontally and vertically integrated multichip system to provide high bandwidth, low latency, and energy efficient data communication by utilizing mm-wave wireless interconnects. The proposed solution has two parts: the first part proposes design methodology of a seamless hybrid wired and wireless interconnection network for the horizontally integrated multichip system to enable direct chip-to-chip communication between internal cores. Whereas the second part proposes a Wireless Network-on-Chip (WiNoC) architecture for the vertically integrated multichip system to realize data communication across interlayer microfluidic coolers eliminating the need to place and route signal TSVs through the cooling layers. The integration of wireless interconnect will significantly reduce the complexity of the co-design of TSV based interconnects and microchannel based interlayer cooling. Finally, this dissertation presents a combined trade-off evaluation of such wireless integration system in both horizontal and vertical sense and provides future directions for the design of the multichip system

Integrated phased array systems in silicon

Silicon offers a new set of possibilities and challenges for RF, microwave, and millimeter-wave applications. While the high cutoff frequencies of the SiGe heterojunction bipolar transistors and the ever-shrinking feature sizes of MOSFETs hold a lot of promise, new design techniques need to be devised to deal with the realities of these technologies, such as low breakdown voltages, lossy substrates, low-Q passives, long interconnect parasitics, and high-frequency coupling issues. As an example of complete system integration in silicon, this paper presents the first fully integrated 24-GHz eight-element phased array receiver in 0.18-μm silicon-germanium and the first fully integrated 24-GHz four-element phased array transmitter with integrated power amplifiers in 0.18-μm CMOS. The transmitter and receiver are capable of beam forming and can be used for communication, ranging, positioning, and sensing applications

Miniaturised Wireless Power Transfer Systems for Neurostimulation: A Review

In neurostimulation, wireless power transfer is an efficient technology to overcome several limitations affecting medical devices currently used in clinical practice. Several methods were developed over the years for wireless power transfer. In this review article, we report and discuss the three most relevant methodologies for extremely miniaturised implantable neurostimulator: ultrasound coupling, inductive coupling and capacitive coupling. For each powering method, the discussion starts describing the physical working principle. In particular, we focus on the challenges given by the miniaturisation of the implanted integrated circuits and the related ad-hoc solutions for wireless power transfer. Then, we present recent developments and progresses in wireless power transfer for biomedical applications. Last, we compare each technique based on key performance indicators to highlight the most relevant and innovative solutions suitable for neurostimulation, with the gaze turned towards miniaturisation

A HEURISTIC FOR OPTIMIZING THE PHYSICAL LAYOUT AND NETWORK TOPOLOGY OF INTEGRATED 3D MULTI-CHIP SYSTEMS UNDER TEMPERATURE CONSTRAINTS

M.S. Thesis. University of Hawaiʻi at Mānoa 2018

Ultra-Low-Power Superconductor Logic

We have developed a new superconducting digital technology, Reciprocal Quantum Logic, that uses AC power carried on a transmission line, which also serves as a clock. Using simple experiments we have demonstrated zero static power dissipation, thermally limited dynamic power dissipation, high clock stability, high operating margins and low BER. These features indicate that the technology is scalable to far more complex circuits at a significant level of integration. On the system level, Reciprocal Quantum Logic combines the high speed and low-power signal levels of Single-Flux- Quantum signals with the design methodology of CMOS, including low static power dissipation, low latency combinational logic, and efficient device count.Comment: 7 pages, 5 figure

Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level