Performance Evaluation and Modeling of HPC I/O on Non-Volatile Memory

HPC applications pose high demands on I/O performance and storage capability. The emerging non-volatile memory (NVM) techniques offer low-latency, high bandwidth, and persistence for HPC applications. However, the existing I/O stack are designed and optimized based on an assumption of disk-based storage. To effectively use NVM, we must re-examine the existing high performance computing (HPC) I/O sub-system to properly integrate NVM into it. Using NVM as a fast storage, the previous assumption on the inferior performance of storage (e.g., hard drive) is not valid any more. The performance problem caused by slow storage may be mitigated; the existing mechanisms to narrow the performance gap between storage and CPU may be unnecessary and result in large overhead. Thus fully understanding the impact of introducing NVM into the HPC software stack demands a thorough performance study. In this paper, we analyze and model the performance of I/O intensive HPC applications with NVM as a block device. We study the performance from three perspectives: (1) the impact of NVM on the performance of traditional page cache; (2) a performance comparison between MPI individual I/O and POSIX I/O; and (3) the impact of NVM on the performance of collective I/O. We reveal the diminishing effects of page cache, minor performance difference between MPI individual I/O and POSIX I/O, and performance disadvantage of collective I/O on NVM due to unnecessary data shuffling. We also model the performance of MPI collective I/O and study the complex interaction between data shuffling, storage performance, and I/O access patterns.Comment: 10 page

Extending Memory Capacity in Consumer Devices with Emerging Non-Volatile Memory: An Experimental Study

The number and diversity of consumer devices are growing rapidly, alongside their target applications' memory consumption. Unfortunately, DRAM scalability is becoming a limiting factor to the available memory capacity in consumer devices. As a potential solution, manufacturers have introduced emerging non-volatile memories (NVMs) into the market, which can be used to increase the memory capacity of consumer devices by augmenting or replacing DRAM. Since entirely replacing DRAM with NVM in consumer devices imposes large system integration and design challenges, recent works propose extending the total main memory space available to applications by using NVM as swap space for DRAM. However, no prior work analyzes the implications of enabling a real NVM-based swap space in real consumer devices. In this work, we provide the first analysis of the impact of extending the main memory space of consumer devices using off-the-shelf NVMs. We extensively examine system performance and energy consumption when the NVM device is used as swap space for DRAM main memory to effectively extend the main memory capacity. For our analyses, we equip real web-based Chromebook computers with the Intel Optane SSD, which is a state-of-the-art low-latency NVM-based SSD device. We compare the performance and energy consumption of interactive workloads running on our Chromebook with NVM-based swap space, where the Intel Optane SSD capacity is used as swap space to extend main memory capacity, against two state-of-the-art systems: (i) a baseline system with double the amount of DRAM than the system with the NVM-based swap space; and (ii) a system where the Intel Optane SSD is naively replaced with a state-of-the-art (yet slower) off-the-shelf NAND-flash-based SSD, which we use as a swap space of equivalent size as the NVM-based swap space

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Accelerating Neural Network Inference with Processing-in-DRAM: From the Edge to the Cloud

Neural networks (NNs) are growing in importance and complexity. A neural network's performance (and energy efficiency) can be bound either by computation or memory resources. The processing-in-memory (PIM) paradigm, where computation is placed near or within memory arrays, is a viable solution to accelerate memory-bound NNs. However, PIM architectures vary in form, where different PIM approaches lead to different trade-offs. Our goal is to analyze, discuss, and contrast DRAM-based PIM architectures for NN performance and energy efficiency. To do so, we analyze three state-of-the-art PIM architectures: (1) UPMEM, which integrates processors and DRAM arrays into a single 2D chip; (2) Mensa, a 3D-stack-based PIM architecture tailored for edge devices; and (3) SIMDRAM, which uses the analog principles of DRAM to execute bit-serial operations. Our analysis reveals that PIM greatly benefits memory-bound NNs: (1) UPMEM provides 23x the performance of a high-end GPU when the GPU requires memory oversubscription for a general matrix-vector multiplication kernel; (2) Mensa improves energy efficiency and throughput by 3.0x and 3.1x over the Google Edge TPU for 24 Google edge NN models; and (3) SIMDRAM outperforms a CPU/GPU by 16.7x/1.4x for three binary NNs. We conclude that the ideal PIM architecture for NN models depends on a model's distinct attributes, due to the inherent architectural design choices.Comment: This is an extended and updated version of a paper published in IEEE Micro, pp. 1-14, 29 Aug. 2022. arXiv admin note: text overlap with arXiv:2109.1432

Facilitating Emerging Non-volatile Memories in Next-Generation Memory System Design: Architecture-Level and Application-Level Perspectives

This dissertation focuses on three types of emerging NVMs, spin-transfer torque RAM (STT-RAM), phase change memory (PCM), and metal-oxide resistive RAM (ReRAM). STT-RAM has been identified as the best replacement of SRAM to build large-scale and low-power on-chip caches and also an energy-efficient alternative to DRAM as main memory. PCM and ReRAM have been considered to be promising technologies for building future large-scale and low-power main memory systems. This dissertation investigates two aspects to facilitate them in next-generation memory system design, architecture-level and application-level perspectives. First, multi-level cell (MLC) STT-RAM based cache design is optimized by using data encoding and data compression. Second, MLC STT-RAM is utilized as persistent main memory for fast and energy-efficient local checkpointing. Third, the commonly used database indexing algorithm, B+tree, is redesigned to be NVM-friendly. Forth, a novel processing-in-memory architecture built on ReRAM based main memory is proposed to accelerate neural network applications