7,666 research outputs found
Analysis And Design Optimization Of Multiphase Converter
Future microprocessors pose many challenges to the power conversion techniques. Multiphase synchronous buck converters have been widely used in high current low voltage microprocessor application. Design optimization needs to be carefully carried out with pushing the envelope specification and ever increasing concentration towards power saving features. In this work, attention has been focused on dynamic aspects of multiphase synchronous buck design. The power related issues and optimizations have been comprehensively investigated in this paper. In the first chapter, multiphase DC-DC conversion is presented with background application. Adaptive voltage positioning and various nonlinear control schemes are evaluated. Design optimization are presented to achieve best static efficiency over the entire load range. Power loss analysis from various operation modes and driver IC definition are studied thoroughly to better understand the loss terms and minimize the power loss. Load adaptive control is then proposed together with parametric optimization to achieve optimum efficiency figure. New nonlinear control schemes are proposed to improve the transient response, i.e. load engage and load release responses, of the multiphase VR in low frequency repetitive transient. Drop phase optimization and PWM transition from long tri-state phase are presented to improve the smoothness and robustness of the VR in mode transition. During high frequency repetitive transient, the control loop should be optimized and nonlinear loop should be turned off. Dynamic current sharing are thoroughly studied in chapter 4. The output impedance of the multiphase v synchronous buck are derived to assist the analysis. Beat frequency is studied and mitigated by proposing load frequency detection scheme by turning OFF the nonlinear loop and introducing current protection in the control loop. Dynamic voltage scaling (DVS) is now used in modern Multi-Core processor (MCP) and multiprocessor System-on-Chip (MPSoC) to reduce operational voltage under light load condition. With the aggressive motivation to boost dynamic power efficiency, the design specification of voltage transition (dv/dt) for the DVS is pushing the physical limitation of the multiphase converter design and the component stress as well. In this paper, the operation modes and modes transition during dynamic voltage transition are illustrated. Critical dead-times of driver IC design and system dynamics are first studied and then optimized. The excessive stress on the control MOSFET which increases the reliability concern is captured in boost mode operation. Feasible solutions are also proposed and verified by both simulation and experiment results. CdV/dt compensation for removing the AVP effect and novel nonlinear control scheme for smooth transition are proposed for dealing with fast voltage positioning. Optimum phase number control during dynamic voltage transition is also proposed and triggered by voltage identification (VID) delta to further reduce the dynamic loss. The proposed schemes are experimentally verified in a 200 W six phase synchronous buck converter. Finally, the work is concluded. The references are listed
Multilevel multistate hybrid voltage regulator
In this work, a new set of voltage regulators as well as some controlling methods and schemes are proposed. While normal switched capacitor voltage regulators are easy integrable, they are suffering from charge sharing losses as well as fast degradation of efficiency when deviating from target operation point. On the other hand, conventional buck converters use bulky magnetic components that introduce challenges to integrate them on chip. The new set of voltage regulators covers the gap between inductor-based and capacitor-based voltage regulators by taking the advantages of both of them while avoiding or minimizing their disadvantages. The voltage regulator device consists of a switched capacitor circuit that is periodically switching its output between different voltage levels followed by a low pass filter to give a regulated output voltage. The voltage regulator is capable of converting an input voltage to a wide range of output voltage with a high efficiency that is roughly constant over the whole operation range. By switching between adjacent voltage levels, the voltage drop on the inductor is limited allowing for the use of smaller inductor sizes while maintaining the same performance. The general concept of the proposed voltage regulator as well as some operating conditions and techniques are explained. A phase interleaving technique to operate the multilevel multistate voltage regulator has been proposed. In this technique, the phases of two or more voltage levels are interleaved which enhances the effective switching frequency of the charge transferring components. This results in a further boost in the proposed regulator\u27s performance. A 4-level 4-state hybrid voltage regulator has been introduced as an application on the proposed concepts and techniques. It shows better performance compared to both integrated inductor-based and capacitor-based voltage regulators. The results prove that the proposed set of voltage regulators offers a potential move towards easing the integration of voltage regulators on chip with a performance that approaches that of off-chip voltage regulators
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Active timing margin management to improve microprocessor power efficiency
Improving power/performance efficiency is critical for today’s micro- processors. From edge devices to datacenters, lower power or higher performance always produces better systems, measured by lower cost of ownership or longer battery time. This thesis studies improving microprocessor power/performance efficiency by optimizing the pipeline timing margin. In particular, this thesis focuses on improving the efficacy of Active Timing Margin, a young technology that dynamically adjusts the margin.
Active timing margin trims down the pipeline timing margin with a control loop that adjusts voltage and frequency based on real-time chip environment monitoring. The key insight of this thesis is that in order to maximize active timing margin’s efficiency enhancement benefits, synergistic management from processor architecture design and system software scheduling are needed. To that end, this thesis covers the major consumers of pipeline timing margin, including temperature, voltage, and process variation. For temperature variation, the thesis proposes a table-lookup based active timing margin mechanism, and an associated temperature management scheme to minimize power consumption. For voltage variation, the thesis characterizes the limiting factors of adaptive clocking’s power saving and proposes application scheduling to maximize total system power reduction. For process variation, the thesis proposes core-level adaptive clocking reconfiguration to automatically expose inter-core variation and discusses workload scheduling and throttling management to control critical application performance.
The author believes the optimization presented in this thesis can potentially benefit a variety of processor architectures as the conclusions are based on the solid measurement on state-of-the-art processors, and the research objective, active timing margin, already has wide applicability in the latest microprocessors by the time this thesis is written.Electrical and Computer Engineerin
Addressing On-Chip Power Conversion and Dissipation Issues in Many-Core System-on-a-Chip based on Conventional Silicon and Emerging Nanotechnologies
Title from PDF of title page viewed August 27, 2018Dissertation advisor: Masud H ChowdhuryVitaIncludes bibliographical references (pages 158-163)Thesis (Ph.D.)--School of Computing and Engineering and Department of Physics and Astronomy. University of Missouri--Kansas City, 2017Integrated circuits (ICs) are moving towards system-on-a-chip (SOC) designs. SOC
allows various small and large electronic systems to be implemented in a single chip. This
approach enables the miniaturization of design blocks that leads to high density transistor
integration, faster response time, and lower fabrication costs. To reap the benefits of SOC
and uphold the miniaturization of transistors, innovative power delivery and power
dissipation management schemes are paramount. This dissertation focuses on on-chip
integration of power delivery systems and managing power dissipation to increase the
lifetime of energy storage elements. We explore this problem from two different angels:
On-chip voltage regulators and power gating techniques. On-chip voltage regulators reduce
parasitic effects, and allow faster and efficient power delivery for microprocessors. Power
gating techniques, on the other hand, reduce the power loss incurred by circuit blocks
during standby mode.
Power dissipation (Ptotal = Pstatic and Pdynamic) in a complementary metal-oxide
semiconductor (CMOS) circuit comes from two sources: static and dynamic. A quadratic
dependency on the dynamic switching power and a more than linear dependency on static
power as a form of gate leakage (subthreshold current) exist. To reduce dynamic power
loss, the supply power should be reduced. A significant reduction in power dissipation
occurs when portions of a microprocessor operate at a lower voltage level. This reduction
in supply voltage is achieved via voltage regulators or converters. Voltage regulators are
used to provide a stable power supply to the microprocessor. The conventional off-chip
switching voltage regulator contains a passive floating inductor, which is difficult to be
implemented inside the chip due to excessive power dissipation and parasitic effects.
Additionally, the inductor takes a very large chip area while hampering the scaling process.
These limitations make passive inductor based on-chip regulator design very unattractive
for SOC integration and multi-/many-core environments. To circumvent the challenges,
three alternative techniques based on active circuit elements to replace the passive LC filter
of the buck convertor are developed. The first inductorless on-chip switching voltage
regulator architecture is based on a cascaded 2nd order multiple feedback (MFB) low-pass
filter (LPF). This design has the ability to modulate to multiple voltage settings via pulse
with modulation (PWM). The second approach is a supplementary design utilizing a hybrid
low drop-out scheme to lower the output ripple of the switching regulator over a wider
frequency range. The third design approach allows the integration of an entire power
management system within a single chipset by combining a highly efficient switching
regulator with an intermittently efficient linear regulator (area efficient), for robust and
highly efficient on-chip regulation.
The static power (Pstatic) or subthreshold leakage power (Pleak) increases with
technology scaling. To mitigate static power dissipation, power gating techniques are
implemented. Power gating is one of the popular methods to manage leakage power during
standby periods in low-power high-speed IC design. It works by using transistor based
switches to shut down part of the circuit block and put them in the idle mode. The efficiency
of a power gating scheme involves minimum Ioff and high Ion for the sleep transistor. A
conventional sleep transistor circuit design requires an additional header, footer, or both
switches to turn off the logic block. This additional transistor causes signal delay and
increases the chip area. We propose two innovative designs for next generation sleep
transistor designs. For an above threshold operation, we present a sleep transistor design
based on fully depleted silicon-on-insulator (FDSOI) device. For a subthreshold circuit
operation, we implement a sleep transistor utilizing the newly developed silicon-on
ferroelectric-insulator field effect transistor (SOFFET). In both of the designs, the ability
to control the threshold voltage via bias voltage at the back gate makes both devices more
flexible for sleep transistors design than a bulk MOSFET. The proposed approaches
simplify the design complexity, reduce the chip area, eliminate the voltage drop by sleep
transistor, and improve power dissipation. In addition, the design provides a dynamically
controlled Vt for times when the circuit needs to be in a sleep or switching mode.Introduction -- Background and literature review -- Fully integrated on-chip switching voltage regulator -- Hybrid LDO voltage regulator based on cascaded second order multiple feedback loop -- Single and dual output two-stage on-chip power management system -- Sleep transistor design using double-gate FDSOI -- Subthreshold region sleep transistor design -- Conclusio
A Case Study in CMOS Design Scaling for Analog Applications: The Ringamp LDO
As CMOS process nodes scale to smaller feature sizes, process optimizations are made to achieve improvements in digital circuit performance, such as increasing speed and memory, while decreasing power consumption. Unfortunately for analog design, these optimizations usually come at the expense of poorer transistor performance, such as reduced small signal output resistance and increased channel length modulation. The ring amplifier has been proposed as a digital solution to the analog scaling problem, by configuring digital inverters to function as analog amplifiers through deadzone biasing. As digital inverters naturally scale, the ring amplifier is a promising area of exploration for analog design. This work presents a ring amplifier scaling study by demonstration of scaling an output capacitor-less, ring amplifier based low-dropout voltage regulator designed in a standard 180 nm CMOS process down to a standard 90 nm CMOS process
High Performance Power Management Integrated Circuits for Portable Devices
abstract: Portable devices often require multiple power management IC (PMIC) to power different sub-modules, Li-ion batteries are well suited for portable devices because of its small size, high energy density and long life cycle. Since Li-ion battery is the major power source for portable device, fast and high-efficiency battery charging solution has become a major requirement in portable device application.
In the first part of dissertation, a high performance Li-ion switching battery charger is proposed. Cascaded two loop (CTL) control architecture is used for seamless CC-CV transition, time based technique is utilized to minimize controller area and power consumption. Time domain controller is implemented by using voltage controlled oscillator (VCO) and voltage controlled delay line (VCDL). Several efficiency improvement techniques such as segmented power-FET, quasi-zero voltage switching (QZVS) and switching frequency reduction are proposed. The proposed switching battery charger is able to provide maximum 2 A charging current and has an peak efficiency of 93.3%. By configure the charger as boost converter, the charger is able to provide maximum 1.5 A charging current while achieving 96.3% peak efficiency.
The second part of dissertation presents a digital low dropout regulator (DLDO) for system on a chip (SoC) in portable devices application. The proposed DLDO achieve fast transient settling time, lower undershoot/overshoot and higher PSR performance compared to state of the art. By having a good PSR performance, the proposed DLDO is able to power mixed signal load. To achieve a fast load transient response, a load transient detector (LTD) enables boost mode operation of the digital PI controller. The boost mode operation achieves sub microsecond settling time, and reduces the settling time by 50% to 250 ns, undershoot/overshoot by 35% to 250 mV and 17% to 125 mV without compromising the system stability.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201
Dual-frequency single-inductor multiple-output (DF-SIMO) power converter topology for SoC applications
Modern mixed-signal SoCs integrate a large number of sub-systems in a single nanometer CMOS chip. Each sub-system typically requires its own independent and well-isolated power supply. However, to build these power supplies requires many large off-chip passive components, and thus the bill of material, the package pin count, and the printed circuit board area and complexity increase dramatically, leading to higher overall cost. Conventional (single-frequency) Single-Inductor Multiple-Output (SIMO) power converter topology can be employed to reduce the burden of off-chip inductors while producing a large number of outputs. However, this strategy requires even larger off-chip output capacitors than single-output converters due to time multiplexing between the multiple outputs, and thus many of them suffer from cross coupling issues that limit the isolation between the outputs.
In this thesis, a Dual-Frequency SIMO (DF-SIMO) buck converter topology is proposed. Unlike conventional SIMO topologies, the DF-SIMO decouples the rate of power conversion at the input stage from the rate of power distribution at the output stage. Switching the input stage at low frequency (~2 MHz) simplifies its design in nanometer CMOS, especially with input voltages higher than 1.2 V, while switching the output stage at higher frequency enables faster output dynamic response, better cross-regulation, and smaller output capacitors without the efficiency and design complexity penalty of switching both the input and output stages at high frequency. Moreover, for output switching frequency higher than 100 MHz, the output capacitors can be small enough to be integrated on-chip. A 5-output 2-MHz/120-MHz design in 45-nm CMOS with 1.8-V input targeting low-power microcontrollers is presented as an application. The outputs vary from 0.6 to 1.6 V, with 4 outputs providing up to 15 mA and one output providing up to 50 mA. The design uses single 10-uH off-chip inductor, 2-nF on-chip capacitor for each 15-mA output and 4.5-nF for the 50-mA output. The peak efficiency is 73%, Dynamic Voltage Scaling (DVS) is 0.6 V/80 ns, and settling time is 30 ns for half-to-full load steps with no observable overshoot/undershoot or cross-coupling transients. The DF-SIMO topology enables realizing multiple efficient power supplies with faster dynamic response, better cross-regulation, and lower overall cost compared to conventional SIMO topologies
Power Management ICs for Internet of Things, Energy Harvesting and Biomedical Devices
This dissertation focuses on the power management unit (PMU) and integrated circuits (ICs) for the internet of things (IoT), energy harvesting and biomedical devices. Three monolithic power harvesting methods are studied for different challenges of smart nodes of IoT networks. Firstly, we propose that an impedance tuning approach is implemented with a capacitor value modulation to eliminate the quiescent power consumption. Secondly, we develop a hill-climbing MPPT mechanism that reuses and processes the information of the hysteresis controller in the time-domain and is free of power hungry analog circuits. Furthermore, the typical power-performance tradeoff of the hysteresis controller is solved by a self-triggered one-shot mechanism. Thus, the output regulation achieves high-performance and yet low-power operations as low as 12 µW. Thirdly, we introduce a reconfigurable charge pump to provide the hybrid conversion ratios (CRs) as 1⅓× up to 8× for minimizing the charge redistribution loss. The reconfigurable feature also dynamically tunes to maximum power point tracking (MPPT) with the frequency modulation, resulting in a two-dimensional MPPT. Therefore, the voltage conversion efficiency (VCE) and the power conversion efficiency (PCE) are enhanced and flattened across a wide harvesting range as 0.45 to 3 V. In a conclusion, we successfully develop an energy harvesting method for the IoT smart nodes with lower cost, smaller size, higher conversion efficiency, and better applicability.
For the biomedical devices, this dissertation presents a novel cost-effective automatic resonance tracking method with maximum power transfer (MPT) for piezoelectric transducers (PT). The proposed tracking method is based on a band-pass filter (BPF) oscillator, exploiting the PT’s intrinsic resonance point through a sensing bridge. It guarantees automatic resonance tracking and maximum electrical power converted into mechanical motion regardless of process variations and environmental interferences. Thus, the proposed BPF oscillator-based scheme was designed for an ultrasonic vessel sealing and dissecting (UVSD) system. The sealing and dissecting functions were verified experimentally in chicken tissue and glycerin. Furthermore, a combined sensing scheme circuit allows multiple surgical tissue debulking, vessel sealer and dissector (VSD) technologies to operate from the same sensing scheme board. Its advantage is that a single driver controller could be used for both systems simplifying the complexity and design cost. In a conclusion, we successfully develop an ultrasonic scalpel to replace the other electrosurgical counterparts and the conventional scalpels with lower cost and better functionality
Efficient and Scalable Computing for Resource-Constrained Cyber-Physical Systems: A Layered Approach
With the evolution of computing and communication technology, cyber-physical systems such as self-driving cars, unmanned aerial vehicles, and mobile cognitive robots are achieving increasing levels of multifunctionality and miniaturization, enabling them to execute versatile tasks in a resource-constrained environment. Therefore, the computing systems that power these resource-constrained cyber-physical systems (RCCPSs) have to achieve high efficiency and scalability. First of all, given a fixed amount of onboard energy, these computing systems should not only be power-efficient but also exhibit sufficiently high performance to gracefully handle complex algorithms for learning-based perception and AI-driven decision-making. Meanwhile, scalability requires that the current computing system and its components can be extended both horizontally, with more resources, and vertically, with emerging advanced technology. To achieve efficient and scalable computing systems in RCCPSs, my research broadly investigates a set of techniques and solutions via a bottom-up layered approach. This layered approach leverages the characteristics of each system layer (e.g., the circuit, architecture, and operating system layers) and their interactions to discover and explore the optimal system tradeoffs among performance, efficiency, and scalability. At the circuit layer, we investigate the benefits of novel power delivery and management schemes enabled by integrated voltage regulators (IVRs). Then, between the circuit and microarchitecture/architecture layers, we present a voltage-stacked power delivery system that offers best-in-class power delivery efficiency for many-core systems. After this, using Graphics Processing Units (GPUs) as a case study, we develop a real-time resource scheduling framework at the architecture and operating system layers for heterogeneous computing platforms with guaranteed task deadlines. Finally, fast dynamic voltage and frequency scaling (DVFS) based power management across the circuit, architecture, and operating system layers is studied through a learning-based hierarchical power management strategy for multi-/many-core systems
Integrated high-voltage switched-capacitor DC-DC converters
The focus of this work is on the integrated circuit (IC) level integration of high-voltage switched-capacitor (SC) converters with the goal of fully integrated power management solutions for system-on-chip (SoC) and system-in-pagage (SiP) applications. The full integration of SC converters provides a low cost and compact power supply solution for modern electronics. Currently, there are almost no fully integrated SC converters with input voltages above 5 V. The purpose of this work is to provide solutions for higher input voltages. The increasing challenges of a compact and efficient power supply on the chip are addressed. High-voltage rated components and the increased losses caused by parasitics not only reduce power density but also efficiency. Loss mechanisms in high-voltage SC converters are investigated resulting in an optimized model for high-voltage SC converters. The model developed allows an appropriate comparison of different semiconductor technologies and converter topologies. Methods and design proposals for loss
reduction are presented. Control of power switches with their supporting circuits is a further challenge for high-voltage SC converters. The aim of this work is to develop fully integrated SC converters with a wide input voltage range. Different topologies and concepts are investigated. The implemented fully integrated SC converter has an input voltage range of 2 V to 13 V. This is twice the range of existing converters. This is achieved by an implemented buck and boost mode as well as 17 conversion ratios. Experimental results show a peak efficiency of 81.5%. This is the highest published peak efficiency for fully integrated SC converters with an input voltage > 5V. With the help of the model developed in this work, a three-phase SC converter topology for input voltages up to 60 V is derived and then investigated and discussed. Another focus of this work is on the power supply of sensor nodes and smart home applications with low-power consumption. Highly integrated micro power supplies that operate directly from mains voltage are particularly suitable for these applications. The micro power supply proposed in this work utilizes the high-voltage SC converter developed. The output power is 14 times higher and the power density eleven times higher than prior work. Since plenty of power switches are built into modern multi-ratio SC converters, the switch control circuits must be optimized with regard to low-power consumption and area requirements. In this work, different level shifter concepts are investigated and a low-power high-voltage level shifter for 50 V applications based on a capacitive level shifter is introduced. The level shifter developed exceeds the state of the art by a factor of more than eleven with a power consumption of 2.1pJ per transition. A propagation delay of 1.45 ns is achieved. The presented high-voltage level shifter is the first level shifter for 50 V applications with a propagation delay below 2 ns and power consumption below 20pJ per transition. Compared to the state of the art, the figure of merit is significantly improved by a factor of two. Furthermore, various charge pump concepts are investigated and evaluated within the context of this work. The charge pump, optimized in this work, improves the state of the art by a factor of 1.6 in terms of efficiency. Bidirectional
switches must be implemented at certain locations within the power stage to prevent reverse conduction. The topology of a bidirectional switch developed in this work reduces the dynamic switching losses by 70% and the area consumption including the required charge pumps by up to 65% compared to the state of the
art. These improvements make it possible to control the power switches in a fast and efficient way.
Index terms — integrated power management, high input voltage, multi-ratio SC converter, level shifter,
bidirectional switch, micro power supplyDer Schwerpunkt dieser Arbeit liegt auf der Erforschung von Switched-Capacitor (SC) Spannungswandler für höhere Eingangsspannungen. Ziel der Arbeit ist es Lösungen für ein voll auf dem Halbleiterchip integriertes Power Management anzubieten um System on Chip (SoC) und System in Package (SiP) zu ermöglichen. Die vollständige Integration von SC Spannungswandlern bietet eine kostengünstige und kompakte Spannungsversorgungslösung für moderne Elektronik. Der kontinuierliche Trend hin zu immer kompakterer Elektronik und hin zu höheren Versorgungsspannungen wird in dieser Arbeit adressiert. Aktuell gibt es sehr wenige voll integrierte SC Spannungswandler mit einer Eingangsspannung größer 5 V. Die mit steigender Spannung zunehmenden Herausforderungen an eine kompakte und effiziente Spannungsversorgung auf dem Chip werden in dieser Arbeit untersucht. Die höhere Spannungsfestigkeit der verwendeten Komponenten korreliert mit erhöhten Verlusten und erhöhtem Flächenverbrauch, welche sich
negativ auf den Wirkungsgrad und die Leistungsdichte von SC Spannungswandlern auswirkt. Bestandteil dieser Arbeit ist die Untersuchung dieser Verlustmechanismen und die Entwicklung eines Modells, welches speziell für höhere Spannungen optimiert wurde. Das vorgestellte Modell ermöglicht zum einen die optimale Dimensionierung der Spannungswandler und zum anderen faire Vergleichsmöglichkeiten zwischen verschiedenen SC Spannungswandler Architekturen und Halbleitertechnologien. Demnach haben sowohl die gewählte Architektur und Halbleitertechnologie als auch die Kombination aus gewählter Architektur und Technologie erheblichen Einfluss auf die Leistungsfähigkeit der Spannungswandler. Ziel dieser Arbeit ist die Vollintegration eines SC Spannungswandlers mit einem weiten und hohen Eingangsspannungsbereich zu
entwickeln. Dazu wurden verschiedene Schaltungsarchitekturen und Konzepte untersucht. Der vorgestellte vollintegrierte SC Spannungswandler weist einen Eingangsspannungsbereich von 2 V bis 13 V auf. Dies ist eine Verdopplung im Vergleich zum Stand der Technik. Dies wird durch einen implementierten Auf- und
Abwärtswandler-Betriebsmodus sowie 17 Übersetzungsverhältnisse erreicht. Experimentelle Ergebnisse zeigen einen Spitzenwirkungsgrad von 81.5%. Dies ist der höchste veröffentlichte Spitzenwirkungsgrad für vollintegrierte SC Spannungswandler mit einer Eingangsspannung größer 5 V. Mit Hilfe des in dieser
Arbeit entwickelten Modells wird eine dreiphasige SC Spannungswandler Architektur für Eingangsspannungen bis zu 60 V entwickelt und anschließend analysiert und diskutiert.
Ein weiterer Schwerpunkt dieser Arbeit adressiert die kompakte Spannungsversorgung von Sensorknoten mit geringem Stromverbrauch, für Anwendungen wie Smart Home und Internet der Dinge (IoT). Für diese Anwendungen eignen sich besonders gut hochintegrierte Mikro-Netzteile, welche direkt mit dem 230VRMS-Hausnetz (bzw. 110VRMS) betrieben werden können. Das in dieser Arbeit vorgestellte Mikro-Netzteil nutzt einen in dieser Arbeit entwickelten SC Spannungswandler für hohe Eingangsspannungen. Die damit erzielte Ausgangsleistung ist 14-mal größer im Vergleich zum Stand der Technik.
In SC Spannungswandlern für hohe Spannungen werden viele Leistungsschalter benötigt, deshalb muss bei der Schalteransteuerung besonders auf einen geringen Leistungsverbrauch und Flächenbedarf der benötigten Schaltungsblöcke geachtet werden. Gegenstand dieser Arbeit ist sowohl die Analyse verschiedener Konzepte
für Pegelumsetzer, als auch die Entwicklung eines stromsparenden Pegelumsetzers für 50 V-Anwendungen. Mit einer Leistungsaufnahme von 2.1pJ pro Signalübergang reduziert der entwickelte Pegelumsetzer mit kapazitiver Kopplung um mehr als elfmal die Leistungsaufnahme im Vergleich zum Stand der Technik. Die erreichte Laufzeitverzögerung beträgt 1.45 ns. Damit erzielt der vorgestellte Hochspannungs-Pegelumsetzer als erster Pegelumsetzer für 50 V-Anwendungen eine Laufzeitverzögerung unter 2 ns und eine Leistungsaufnahme unter 20pJ pro Signalwechsel. Im Vergleich zum Stand der Technik wird die Leistungskennzahl
um den Faktor zwei deutlich verbessert. Darüber hinaus werden im Rahmen dieser Arbeiten verschiedene Ladungspumpenkonzepte untersucht und bewertet. Die in dieser Arbeit optimierte Ladungspumpe verbessert den Stand der Technik um den Faktor 1.6 in Bezug auf den Wirkungsgrad. Die in dieser Arbeit entwickelte Schaltungsarchitektur eines bidirektionalen Schalters reduziert die dynamischen Schaltverluste um 70% und den benötigten Flächenbedarf inklusive der benötigten Ladungspumpe um bis zu 65% gegenüber dem Stand der Technik. Diese Verbesserungen ermöglichen es, die Leistungsschalter schnell und effizient anzusteuern.
Schlagworte — Integriertes Powermanagement, hohe Eingangsspannung, Multi-Ratio SC Spannungswan-
dler, Pegelumsetzer, bidirektionaler Schalter, Mikro-Netztei
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