Enabling Design and Simulation of Massive Parallel Nanoarchitectures

A common element in emerging nanotechnologies is the increasing complex- ity of the problems to face when attempting the design phase, because issues related to technology, specific application and architecture must be evalu- ated simultaneously. In several cases faced problems are known, but require a fresh re-think on the basis of different constraints not enforced by standard design tools. Among the emerging nanotechnologies, the two-dimensional structures based on nanowire arrays is promising in particular for massively parallel architec- tures. Several studies have been proposed on the exploration of the space of architectural solutions, but only a few derived high-level information from the results of an extended and reliable characterization of low-level structures. The tool we present is of aid in the design of circuits based on nanotech- nologies, here discussed in the specific case of nanowire arrays, as best candi- date for massively parallel architectures. It enables the designer to start from a standard High-level Description Languages (HDL), inherits constraints at physical level and applies them when organizing the physical implementation of the circuit elements and of their connections. It provides a complete simu- lation environment with two levels of refinement. One for DC analysis using a fast engine based on a simple switch level model. The other for obtaining transient performance based on automatic extraction of circuit parasitics, on detailed device (nanowire-FET) information derived by experiments or by existing accurate models, and on spice-level modeling of the nanoarray. Re- sults about the method used for the design and simulation of circuits based on nanowire-FET and nanoarray will be presente

A distributed interleaving scheme for efficient access to WideIO DRAM memory

Achieving the main memory (DRAM) required bandwidth at acceptable power levels for current and future applications is a major challenge for System-on-Chip designers for mobile platforms. Three dimensional (3D) integration and 3D stacked DRAM memories promise to provide a significant boost in bandwidth at low power levels by exploiting multiple channels and wide data interfaces. In this paper, we address the problem of efficiently exploiting the multiple channels provided by standard (JEDEC’s WIDEIO) 3D-stacked memories, to extract maximal effective bandwidth and minimize latency for main memory access. We propose a new distributed interleaved access method that leverages the on-chip interconnect to simplify the design and implementation of the DRAM controller, without impacting performance compared to traditional centralized implementations. We perform experiments on realistic workload for a mobile communication and multimedia platform and show that our proposed distributed interleaving memory access method improves the overall throughput while minimally impacting the performance of latency sensitive communication flows

Heurísticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Optimal Multi-Processor SoC Thermal Simulation via Adaptive Differential Equation Solvers

Thermal management is a critical challenge in the design of high performance multi-processor system-on-chips (MPSoCs). Therefore, accurate and fast thermal modeling tools are necessary for efficiently analyzing the thermal profiles of MPSoCs. This paper advances state-of-the-art MPSoC thermal modeling approaches in several directions. Our first contribution is a novel matrix statespace compatible representation of MPSoC thermal behavior. This representation can be used to choose the “best fit” solver among various ordinary differential equation (ODE) solvers according to the required accuracy and simulation speed. Then, we exploit this representation to develop an adaptive thermal simulation infrastructure that provides the shortest simulation time for the desired thermal modeling accuracy and the given MPSoC floorplan. The experimental results, which are based on a commercial 8-core MPSoC, show that our thermal simulation method achieves both higher thermal estimation accuracy (6x better) and faster simulation time (up to 70%) when compared to state-of-the-art MPSoC thermal simulators

Hierarchical Thermal Management Policy for High-Performance 3D Systems with Liquid Cooling

3-Dimensional integrated circuits and systems are expected to be present in electronic products in the short term. We consider specifically 3-D multi-processor systems-onchip (MPSoCs), realized by stacking silicon CMOS chips and interconnecting them by means of through-silicon vias (TSVs). Because of the high power density of devices and interconnect in the 3D stack, thermal issues pose critical challenges, such as hot-spot avoidance and thermal gradient reduction. Thermal management is achieved by a combination of active control of on-chip switching rates as well as active interlayer cooling with pressurized fluids. In this paper, we propose a novel online thermal management policy for high-performance 3D systems with liquid cooling. Our proposed controller uses a hierarchical approach with a global controller regulating the active cooling and local controllers (on each layer) performing dynamic voltage and frequency scaling (DVFS) and interacting with the global controller. Then, the online control is achieved by policies that are computed off-line by solving an optimization problem that considers the thermal profile of 3D-MPSoCs, its evolution over time and current time-varying workload requirements. The proposed hierarchical scheme is scalable to complex (and heterogeneous) 3D chip stacks. We perform experiments on a 3D-MPSoC case study with different interlayer cooling structures, using benchmarks ranging from web-accessing to playing multimedia. Results show significant advantages in terms of energy savings that reaches values up to 50% versus state-of-the-art thermal control techniques for liquid cooling, and thermal balance with differences of less than 10oC per layer

Online Thermal Control Methods for Multi-Processor Systems

With technological advances, the number of cores integrated on a chip is increasing. This, in turn is leading to thermal constraints and thermal design challenges. Temperature gradients and hot-spots not only affect the performance of the system, but also lead to unreliable circuit operation and affect the life-time of the chip. Meeting temperature constraints and reducing hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. In this article we analyze the use of four of the most promising families of online control techniques for thermal management of multi-processors system-on-chip (MPSoC). In particular, in our exploration we aim at achieving an online smooth thermal control action that minimizes the performance loss as well as the computational and hardware overhead of embedding a thermal management system inside the MPSoC. The definition of the optimization problem to tackle in this work considers the thermal profile of the system, its evolution over time and current time-varying workload requirements. Thus, this problem is formulated as a finite-horizon optimal control problem and we analyze the control features of different on-line thermal control approaches. In addition, we implemented the policies on an MPSoC hardware simulation platform and performed experiments on a cycle-accurate model of the 8-core Niagara multi-core architecture using benchmarks ranging from web-accessing to playing multimedia. Results show different trade-offs among the analyzed techniques regarding the thermal profile, the frequency setting, the power consumption and the implementation complexity

Cell Transformations and Physical Design Techniques for 3D Monolithic Integrated Circuits

3D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. In 3DMI technology the 3D contacts, connecting different active layers, are in the order of few 100 nm. Given the advantage of such small contacts, 3DMI enables fine-grain (gate-level) partitioning of circuits. In this work we present three cell transformation techniques for standard cell based ICs with 3DMI technology. As a major contribution of this work, we propose a design flow comprising of a cell transformation technique, cell-on-cell stacking, and a physical design technique (CELONCELPD) aimed at placing cells transformed with cell-on-cell stacking. We analyze and compare various cell transformation techniques for 3DMI technology without disrupting the regularity of the IC design flow. Our experiments demonstrate the effectiveness of CELONCEL design technique, yielding us an area reduction of 37.5%, 16.2% average reduction in wirelength, and 6.2% average improvement in overall delay, compared with a 2D case when benchmarked across various designs in 45nm technology node

Temperature Control of High Performance Multicore Platforms Using Convex Optimization

With technology advances, the number of cores integrated on a chip and their speed of operation is increasing. This, in turn is leading to a significant increase in chip temperature. Temperature gradi- ents and hot-spots not only affect the performance of the system, but also lead to unreliable circuit operation and affect the life-time of the chip. Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. In this work, we present Pro-Temp, a convex optimization based method that pro-actively controls the temperature of the cores, while minimizing the power consumption and satisfying application performance constraints. The method guarantees that the temperature of the cores are below a user- defined threshold at all instances of operation, while also reducing the hot-spots. We perform experiments on several realistic multi- core benchmarks, which show that the proposed method guarantees that the cores never exceed the maximum temperature limit, while matching the application performance requirements. We compare this to traditional methods, where we find several temperature vio- lations during the operation of the system

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems