Yield-driven power-delay-optimal CMOS full-adder design complying with automotive product specifications of PVT variations and NBTI degradations

We present the detailed results of the application of mathematical optimization algorithms to transistor sizing in a full-adder cell design, to obtain the maximum expected fabrication yield. The approach takes into account all the fabrication process parameter variations specified in an industrial PDK, in addition to operating condition range and NBTI aging. The final design solutions present transistor sizing, which depart from intuitive transistor sizing criteria and show dramatic yield improvements, which have been verified by Monte Carlo SPICE analysis

Fast, non-monte-carlo estimation of transient performance variation due to device mismatch

This paper describes an efficient way of simulating the effects of device random mismatch on circuit transient characteristics, such as variations in delay or in frequency. The proposed method models DC random offsets as equivalent AC pseudo-noises and leverages the fast, linear periodically time-varying (LPTV) noise analysis available from RF circuit simulators. Therefore, the method can be considered as an extension to DC match analysis and offers a large speed-up compared to the traditional Monte-Carlo analysis. Although the assumed linear perturbation model is valid only for small variations, it enables easy ways to estimate correlations among variations and identify the most sensitive design parameters to mismatch, all at no additional simulation cost. Three benchmarks measuring the variations in the input offset voltage of a clocked comparator, the delay of a logic path, and the frequency of an oscillator demonstrate the speed improvement of about 100-1000x compared to a 1000-point Monte-Carlo method

A collection of fuzzy logic-based tools for the automated design, modelling and test of analog circuits

We have developed a collection of tools for the design, modeling, and test of analog circuits. Sharing a common fuzzy-logic based framework, the tools are part of FASY (Fuzzy-Logic-Based Analog Synthesis), an analog design package developed at the University of Seville. The first tool uses fuzzy logic for topology selection of analog cells. It follows decision rules directly entered by a human expert or automatically generated from its experience with earlier designs. Second, a performance-modeling tool provides a qualitative description of a circuit's behavior. Alternatively, it can use a learning process to accurately model circuit performance. Finally, an analog testing tool uses a fuzzy-neuron classifier to detect and classify faults in analog circuits

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

The nanocops project on algorithms for nanoelectronic coupled problems solutions

The nanoCOPS project [1, 2] is a collaborative research project within the FP7- ICT research program funded by the European Union. The consortium comprises experts in mathematics, physics and electrical engineering from seven universities (BU Wuppertal, HU Berlin, Brno UT, TU Darmstadt, FH OÖ Hagenberg, U Greifswald, KU Leuven), one research institute (MPG Magdeburg), two industrial partners (NXP Semiconductors Netherland and ON Semiconductor Belgium) and two SMEs (MAGWEL and ACCO Semiconductor). We present an overview of the project subjects addressing the "bottlenecks" in the currently-available infrastructure for nanoelectronic design and simulation. In particular, we discuss the issues of an electro-thermal-stress coupled simulation for Power-MOS device design and of simulation approaches for transceiver designs at high carrier frequencies and baseband waveforms such as OFDM (Orthogonal Frequency Division Multiplex)

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

SCALABLE INTEGRATED CIRCUIT SIMULATION ALGORITHMS FOR ENERGY-EFFICIENT TERAFLOP HETEROGENEOUS PARALLEL COMPUTING PLATFORMS

Integrated circuit technology has gone through several decades of aggressive scaling.It is increasingly challenging to analyze growing design complexity. Post-layout SPICE simulation can be computationally prohibitive due to the huge amount of parasitic elements, which can easily boost the computation and memory cost. As the decrease in device size, the circuits become more vulnerable to process variations. Designers need to statistically simulate the probability that a circuit does not meet the performance metric, which requires millions times of simulations to capture rare failure events. Recent, multiprocessors with heterogeneous architecture have emerged as mainstream computing platforms. The heterogeneous computing platform can achieve highthroughput energy efficient computing. However, the application of such platform is not trivial and needs to reinvent existing algorithms to fully utilize the computing resources. This dissertation presents several new algorithms to address those aforementioned two significant and challenging issues on the heterogeneous platform. Harmonic Balance (HB) analysis is essential for efficient verification of large postlayout RF and microwave integrated circuits (ICs). However, existing methods either suffer from excessively long simulation time and prohibitively large memory consumption or exhibit poor stability. This dissertation introduces a novel transient-simulation guided graph sparsification technique, as well as an efficient runtime performance modeling approach tailored for heterogeneous manycore CPU-GPU computing system to build nearly-optimal subgraph preconditioners that can lead to minimum HB simulation runtime. Additionally, we propose a novel heterogeneous parallel sparse block matrix algorithm by taking advantages of the structure of HB Jacobian matrices as well as GPU’s streaming multiprocessors to achieve optimal workload balancing during the preconditioning phase of HB analysis. We also show how the proposed preconditioned iterative algorithm can efficiently adapt to heterogeneous computing systems with different CPU and GPU computing capabilities. Extensive experimental results show that our HB solver can achieve up to 20X speedups and 5X memory reduction when compared with the state-of-the-art direct solver highly optimized for twelve-core CPUs. In nowadays variation-aware IC designs, cell characterizations and SRAM memory yield analysis require many thousands or even millions of repeated SPICE simulations for relatively small nonlinear circuits. In this dissertation, for the first time, we present a massively parallel SPICE simulator on GPU, TinySPICE, for efficiently analyzing small nonlinear circuits. TinySPICE integrates a highly-optimized shared-memory based matrix solver and fast parametric three-dimensional (3D) LUTs based device evaluation method. A novel circuit clustering method is also proposed to improve the stability and efficiency of the matrix solver. Compared with CPU-based SPICE simulator, TinySPICE achieves up to 264X speedups for parametric SRAM yield analysis without loss of accuracy

System level performance and yield optimisation for analogue integrated circuits

Advances in silicon technology over the last decade have led to increased integration of analogue and digital functional blocks onto the same single chip. In such a mixed signal environment, the analogue circuits must use the same process technology as their digital neighbours. With reducing transistor sizes, the impact of process variations on analogue design has become prominent and can lead to circuit performance falling below specification and hence reducing the yield.This thesis explores the methodology and algorithms for an analogue integrated circuit automation tool that optimizes performance and yield. The trade-offs between performance and yield are analysed using a combination of an evolutionary algorithm and Monte Carlo simulation. Through the integration of yield parameter into the optimisation process, the trade off between the performance functions can be better treated that able to produce a higher yield. The results obtained from the performance and variation exploration are modelled behaviourally using a Verilog-A language. The model has been verified with transistor level simulation and a silicon prototype.For a large analogue system, the circuit is commonly broken down into its constituent sub-blocks, a process known as hierarchical design. The use of hierarchical-based design and optimisation simplifies the design task and accelerates the design flow by encouraging design reuse.A new approach for system level yield optimisation using a hierarchical-based design is proposed and developed. The approach combines Multi-Objective Bottom Up (MUBU) modelling technique to model the circuit performance and variation and Top Down Constraint Design (TDCD) technique for the complete system level design. The proposed method has been used to design a 7th order low pass filter and a charge pump phase locked loop system. The results have been verified with transistor level simulations and suggest that an accurate system level performance and yield prediction can be achieved with the proposed methodology

Tensor Computation: A New Framework for High-Dimensional Problems in EDA

Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System