7,326 research outputs found
A survey on scheduling and mapping techniques in 3D Network-on-chip
Network-on-Chips (NoCs) have been widely employed in the design of
multiprocessor system-on-chips (MPSoCs) as a scalable communication solution.
NoCs enable communications between on-chip Intellectual Property (IP) cores and
allow those cores to achieve higher performance by outsourcing their
communication tasks. Mapping and Scheduling methodologies are key elements in
assigning application tasks, allocating the tasks to the IPs, and organising
communication among them to achieve some specified objectives. The goal of this
paper is to present a detailed state-of-the-art of research in the field of
mapping and scheduling of applications on 3D NoC, classifying the works based
on several dimensions and giving some potential research directions
Physical parameter-aware Networks-on-Chip design
PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable
and power-efficient communication fabric for chip multiprocessors
(CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine
both the performance and the reliability of such systems, with a
significant power demand that is expected to increase due to developments
in both technology and architecture. In terms of architecture, an
important trend in many-core systems architecture is to increase the
number of cores on a chip while reducing their individual complexity.
This trend increases communication power relative to computation
power. Moreover, technology-wise, power-hungry wires are dominating
logic as power consumers as technology scales down. For these
reasons, the design of future very large scale integration (VLSI) systems
is moving from being computation-centric to communication-centric.
On the other hand, chip’s physical parameters integrity, especially
power and thermal integrity, is crucial for reliable VLSI systems. However,
guaranteeing this integrity is becoming increasingly difficult with
the higher scale of integration due to increased power density and operating
frequencies that result in continuously increasing temperature
and voltage drops in the chip. This is a challenge that may prevent
further shrinking of devices. Thus, tackling the challenge of power
and thermal integrity of future many-core systems at only one level
of abstraction, the chip and package design for example, is no longer
sufficient to ensure the integrity of physical parameters. New designtime
and run-time strategies may need to work together at different
levels of abstraction, such as package, application, network, to provide
the required physical parameter integrity for these large systems. This
necessitates strategies that work at the level of the on-chip network
with its rising power budget.
This thesis proposes models, techniques and architectures to improve
power and thermal integrity of Network-on-Chip (NoC)-based
many-core systems. The thesis is composed of two major parts: i)
minimization and modelling of power supply variations to improve
power integrity; and ii) dynamic thermal adaptation to improve thermal
integrity. This thesis makes four major contributions. The first is
a computational model of on-chip power supply variations in NoCs.
The proposed model embeds a power delivery model, an NoC activity
simulator and a power model. The model is verified with SPICE simulation
and employed to analyse power supply variations in synthetic
and real NoC workloads. Novel observations regarding power supply
noise correlation with different traffic patterns and routing algorithms
are found. The second is a new application mapping strategy aiming
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to minimize power supply noise in NoCs. This is achieved by defining
a new metric, switching activity density, and employing a force-based
objective function that results in minimizing switching density. Significant
reductions in power supply noise (PSN) are achieved with a low
energy penalty. This reduction in PSN also results in a better link timing
accuracy. The third contribution is a new dynamic thermal-adaptive
routing strategy to effectively diffuse heat from the NoC-based threedimensional
(3D) CMPs, using a dynamic programming (DP)-based distributed
control architecture. Moreover, a new approach for efficient extension
of two-dimensional (2D) partially-adaptive routing algorithms
to 3D is presented. This approach improves three-dimensional networkon-
chip (3D NoC) routing adaptivity while ensuring deadlock-freeness.
Finally, the proposed thermal-adaptive routing is implemented in
field-programmable gate array (FPGA), and implementation challenges,
for both thermal sensing and the dynamic control architecture are addressed.
The proposed routing implementation is evaluated in terms
of both functionality and performance.
The methodologies and architectures proposed in this thesis open a
new direction for improving the power and thermal integrity of future
NoC-based 2D and 3D many-core architectures
Thermal and Performance Efficient On-Chip Surface-Wave Communication for Many-Core Systems in Dark Silicon Era
Due to the exceedingly high integration density of VLSI circuits and the resulting high power density, thermal integrity became a major challenge. One way to tackle this problem is Dark silicon. Dark silicon is the amount of circuitry in a chip that is forced to switch off to insure thermal integrity of the system and prevent permanent thermal-related faults. In many-core systems, the presence of Dark Silicon adds new design constraints, in general, and on the communication fabric of such systems, in particular. This is due to the fact that system-level thermal-management systems tend to increase the distance between high activity cores to insure better thermal balancing and integrity. Consequently, a designing dilemma is created where a compromise has to be made between interconnect performance and power consumption. This study proposes a hybrid wire and surface-wave interconnect (SWI) based Network-on-Chip (NoC) to address the dark silicon challenge. Through efficient utilization of one-hop cross the chip communication SWI links, the proposed architecture is able to offer an efficient and scalable communication platform in terms of performance, power, and thermal impact. As a result, evaluations of the proposed architecture compared to baseline architecture under dark silicon scenarios show reduction in maximum temperature by 15°C, average delay up to 73.1%, and energy-saving up to ~3X. This study explores the promising potential of the proposed architecture in extending the utilization wall for current and future many-core systems in dark silicon era
Energy and performance-aware application mapping for inhomogeneous 3D networks-on-chip
Three dimensional Networks-on-Chip (3D NoCs) have evolved as an ideal solution to the communication demands and complexity of future high density many core architectures. However, the design practicality of 3D NoCs faces several challenges such as thermal issues, high power consumption and area overhead of 3D routers as well as high complexity and cost of vertical link implementation. To mitigate the performance and manufacturing cost of 3D NoCs, inhomogeneous architectures have emerged to combine 2D and 3D routers in 3D NoCs producing lower area and energy consumption while maintaining the performance of homogeneous 3D NoCs. Due to the limited number of vertical links, application mapping on inhomogeneous 3D NoCs can be complex. However, application mapping has a great impact on the performance and energy consumption of NoCs. This paper presents an energy and performance aware application mapping algorithm for inhomogeneous 3D NoCs. The algorithm has been evaluated with various realistic traffic patterns and compared with existing mapping algorithms. Experimental results show NoCs mapped with the proposed algorithm have lower energy consumption and significant reduction in packet delays compared to the existing algorithms and comparable average packet latency with Branch-and-Bound
Addressing Manufacturing Challenges in NoC-based ULSI Designs
Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669
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