Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip

The sustained demand for faster, more powerful chips has been met by the availability of chip manufacturing processes allowing for the integration of increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent of which is the design of the chip interconnection. With a number of on-chip blocks presently ranging in the tens, and quickly approaching the hundreds, the novel issue of how to best provide on-chip communication resources is clearly felt. NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable answer to this design concern. By bringing large-scale networking concepts to the on-chip domain, they guarantee a structured answer to present and future communication requirements. The point-to-point connection and packet switching paradigms they involve are also of great help in minimizing wiring overhead and physical routing issues. However, as with any technology of recent inception, NoC design is still an evolving discipline. Several main areas of interest require deep investigation for NoCs to become viable solutions: • The design of the NoC architecture needs to strike the best tradeoff among performance, features and the tight area and power constraints of the onchip domain. • Simulation and verification infrastructure must be put in place to explore, validate and optimize the NoC performance. • NoCs offer a huge design space, thanks to their extreme customizability in terms of topology and architectural parameters. Design tools are needed to prune this space and pick the best solutions. • Even more so given their global, distributed nature, it is essential to evaluate the physical implementation of NoCs to evaluate their suitability for next-generation designs and their area and power costs. This dissertation performs a design space exploration of network-on-chip architectures, in order to point-out the trade-offs associated with the design of each individual network building blocks and with the design of network topology overall. The design space exploration is preceded by a comparative analysis of state-of-the-art interconnect fabrics with themselves and with early networkon- chip prototypes. The ultimate objective is to point out the key advantages that NoC realizations provide with respect to state-of-the-art communication infrastructures and to point out the challenges that lie ahead in order to make this new interconnect technology come true. Among these latter, technologyrelated challenges are emerging that call for dedicated design techniques at all levels of the design hierarchy. In particular, leakage power dissipation, containment of process variations and of their effects. The achievement of the above objectives was enabled by means of a NoC simulation environment for cycleaccurate modelling and simulation and by means of a back-end facility for the study of NoC physical implementation effects. Overall, all the results provided by this work have been validated on actual silicon layout

Automatic synthesis and optimization of chip multiprocessors

The microprocessor technology has experienced an enormous growth during the last decades. Rapid downscale of the CMOS technology has led to higher operating frequencies and performance densities, facing the fundamental issue of power dissipation. Chip Multiprocessors (CMPs) have become the latest paradigm to improve the power-performance efficiency of computing systems by exploiting the parallelism inherent in applications. Industrial and prototype implementations have already demonstrated the benefits achieved by CMPs with hundreds of cores.CMP architects are challenged to take many complex design decisions. Only a few of them are:- What should be the ratio between the core and cache areas on a chip?- Which core architectures to select?- How many cache levels should the memory subsystem have?- Which interconnect topologies provide efficient on-chip communication?These and many other aspects create a complex multidimensional space for architectural exploration. Design Automation tools become essential to make the architectural exploration feasible under the hard time-to-market constraints. The exploration methods have to be efficient and scalable to handle future generation on-chip architectures with hundreds or thousands of cores.Furthermore, once a CMP has been fabricated, the need for efficient deployment of the many-core processor arises. Intelligent techniques for task mapping and scheduling onto CMPs are necessary to guarantee the full usage of the benefits brought by the many-core technology. These techniques have to consider the peculiarities of the modern architectures, such as availability of enhanced power saving techniques and presence of complex memory hierarchies.This thesis has several objectives. The first objective is to elaborate the methods for efficient analytical modeling and architectural design space exploration of CMPs. The efficiency is achieved by using analytical models instead of simulation, and replacing the exhaustive exploration with an intelligent search strategy. Additionally, these methods incorporate high-level models for physical planning. The related contributions are described in Chapters 3, 4 and 5 of the document.The second objective of this work is to propose a scalable task mapping algorithm onto general-purpose CMPs with power management techniques, for efficient deployment of many-core systems. This contribution is explained in Chapter 6 of this document.Finally, the third objective of this thesis is to address the issues of the on-chip interconnect design and exploration, by developing a model for simultaneous topology customization and deadlock-free routing in Networks-on-Chip. The developed methodology can be applied to various classes of the on-chip systems, ranging from general-purpose chip multiprocessors to application-specific solutions. Chapter 7 describes the proposed model.The presented methods have been thoroughly tested experimentally and the results are described in this dissertation. At the end of the document several possible directions for the future research are proposed

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

Doctor of Philosophy

dissertationPortable electronic devices will be limited to available energy of existing battery chemistries for the foreseeable future. However, system-on-chips (SoCs) used in these devices are under a demand to offer more functionality and increased battery life. A difficult problem in SoC design is providing energy-efficient communication between its components while maintaining the required performance. This dissertation introduces a novel energy-efficient network-on-chip (NoC) communication architecture. A NoC is used within complex SoCs due it its superior performance, energy usage, modularity, and scalability over traditional bus and point-to-point methods of connecting SoC components. This is the first academic research that combines asynchronous NoC circuits, a focus on energy-efficient design, and a software framework to customize a NoC for a particular SoC. Its key contribution is demonstrating that a simple, asynchronous NoC concept is a good match for low-power devices, and is a fruitful area for additional investigation. The proposed NoC is energy-efficient in several ways: simple switch and arbitration logic, low port radix, latch-based router buffering, a topology with the minimum number of 3-port routers, and the asynchronous advantages of zero dynamic power consumption while idle and the lack of a clock tree. The tool framework developed for this work uses novel methods to optimize the topology and router oorplan based on simulated annealing and force-directed movement. It studies link pipelining techniques that yield improved throughput in an energy-efficient manner. A simulator is automatically generated for each customized NoC, and its traffic generators use a self-similar message distribution, as opposed to Poisson, to better match application behavior. Compared to a conventional synchronous NoC, this design is superior by achieving comparable message latency with half the energy

Ocin_tsim - A DVFS Aware Simulator for NoC Design Space Exploration and Optimization

Networks-on-Chip (NoCs) are a general purpose, scalable replacement for shared medium wired interconnects offering many practical applications in industry. Dynamic Voltage Frequency Scaling (DVFS) is a technique whereby a chip?s voltage-frequency levels are varied at run time, often used to conserve dynamic power. Various DVFSbased NoC optimization techniques have been proposed. However, due to the resources required to validate architectural decisions through prototyping, few are implemented. As a result, designers are faced with a lack of insight into potential power savings or performance gains at early architecture stages. This thesis proposes a DVFS aware NoC simulator with support for per node power-frequency modeling to allow fine-tuning of such optimization techniques early on in the design cycle. The proposed simulator also provides a framework for benchmarking various candidate strategies to allow selective prototyping and optimization. As part of the research, DVFS extensions were built for an existing NoC performance simulator and released for public use. This thesis presents some of the preliminary results from our simulator that show the average power consumed per node for all the benchmarks in SPLASH 2 benchmark suite [74] to be quite similar to each other. This thesis also serves as a technical manual for the simulator extensions. Important links for downloading and using the simulator are provided at the end of this document in Appendix C

An investigation of latency prediction for NoC-based communication architectures using machine learning techniques

© 2019, Springer Science+Business Media, LLC, part of Springer Nature. Due to the increasing number of cores in Systems on Chip (SoCs), bus architectures have suffered with limitations regarding performance. As applications demand higher bandwidth and lower latencies, buses have not been able to comply with such requirements due to longer wires and increased capacitance. Facing this scenario, Networks on Chip (NoCs) emerged as a way to overcome the limitations found in bus-based systems. Fully exploring all possible NoC characteristics settings is unfeasible due to the vast design space to cover. Therefore, some methods which aim to speed up the design process are needed. In this work, we propose the use of machine learning techniques to optimise NoC architecture components during the design phase. We have investigated the performance of several different ML techniques and selected the Random Forest one targeting audio/video applications. The results have shown an accuracy of up to 90% and 85% for prediction involving arbitration and routing protocols, respectively, and in terms of applications inference, audio/video achieved up to 99%. After this step, we have evaluated other classifiers for each application individually, aiming at finding the adequate one for each situation. The best class of classifiers found was the Tree-based one (Random Forest, Random Tree, and M5P) which is very encouraging, and it points to different approaches from the current state of the art for NoCs latency prediction