High-Speed and Low-Energy On-Chip Communication Circuits.

Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire delays have increased due to less wiring pitch with higher resistance and coupling capacitance. Due to this ever growing gap, long on-chip interconnects pose well-known latency, bandwidth, and energy challenges to high-performance VLSI systems. Repeaters effectively mitigate wire RC effects but do little to improve their energy costs. Moreover, the increased complexity and high level of integration requires higher wire densities, worsening crosstalk noise and power consumption of conventionally repeated interconnects. Such increasing concerns in global on-chip wires motivate circuits to improve wire performance and energy while reducing the number of repeaters. This work presents circuit techniques and investigation for high-performance and energy-efficient on-chip communication in the aspects of encoding, data compression, self-timed current injection, signal pre-emphasis, low-swing signaling, and technology mapping. The improved bus designs also consider the constraints of robust operation and performance/energy gains across process corners and design space. Measurement results from 5mm links on 65nm and 90nm prototype chips validate 2.5-3X improvement in energy-delay product.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/75800/1/jseo_1.pd

Energy efficient communication across on-chip wires in digital CMOS

For the past half century, CMOS process scaling has followed Moore's law, approximately doubling transistor density every 18 months. While locally routed wires have generally scaled with transistor size, longer wires have scaled at a slower rate and in some cases have grown larger as chip size and complexity have increased. Wires routed for non-local communication now consume a large and increasing portion of the power, thermal and area budgets in CMOS designs. Additionally, dynamic energy expended in driving locally routed wires has become comparable to that expended in logic. The goal of this research is to investigate methods of reducing the energy required for on-chip communication, primarily through the use of low-voltage swing signaling. A network-on-chip routing architecture is presented that uses complementary architectural and low-voltage swing signaling techniques to significantly improve the latency, throughput and power of an on-chip network. On-chip signaling circuits are presented that improve the suitability of low-voltage swing signaling for short wire lengths and reduced supply voltages. Finally, a procedure for improving the energy efficiency of wire loads in digital CMOS through the automated insertion of low-voltage swing signaling circuits is presented

Approaching the theoretical limits of a mesh NoC with a 16-node chip prototype in 45nm SOI

In this paper, we present a case study of our chip prototype of a 16-node 4x4 mesh NoC fabricated in 45nm SOI CMOS that aims to simultaneously optimize energy-latency-throughput for unicasts, multicasts and broadcasts. We first define and analyze the theoretical limits of a mesh NoC in latency, throughput and energy, then describe how we approach these limits through a combination of microarchitecture and circuit techniques. Our 1.1V 1GHz NoC chip achieves 1-cycle router-and-link latency at each hop and energy-efficient router-level multicast support, delivering 892Gb/s (87.1% of the theoretical bandwidth limit) at 531.4mW for a mixed traffic of unicasts and broadcasts. Through this fabrication, we derive insights that help guide our research, and we believe, will also be useful to the NoC and multicore research community

Analog/RF Circuit Design Techniques for Nanometerscale IC Technologies

CMOS evolution introduces several problems in analog design. Gate-leakage mismatch exceeds conventional matching tolerances requiring active cancellation techniques or alternative architectures. One strategy to deal with the use of lower supply voltages is to operate critical parts at higher supply voltages, by exploiting combinations of thin- and thick-oxide transistors. Alternatively, low voltage circuit techniques are successfully developed. In order to benefit from nanometer scale CMOS technology, more functionality is shifted to the digital domain, including parts of the RF circuits. At the same time, analog control for digital and digital control for analog emerges to deal with current and upcoming imperfections

Design of Optical Interconnect Transceiver Circuits and Network-on-chip Architectures for Inter- and Intra-chip Communication

The rapid expansion in data communication due to the increased multimedia applications and cloud computing services necessitates improvements in optical transceiver circuitry power efficiency as these systems scale well past 10 Gb/s. In order to meet these requirements, a 26 GHz transimpedance amplifier (TIA) is presented in a 0.25-µm SiGe BiCMOS technology. It employs a transformer-based regulated cascode (RGC) input stage which provides passive negative-feedback gain that enhances the effective transconductance of the TIA’s input common-base transistor; reducing the input resistance and pro- viding considerable bandwidth extension without significant noise degradation or power consumption. The TIA achieves a 53 dBΩ single-ended transimpedance gain with a 26√ GHz bandwidth and 21.3 pA/H z average input-referred noise current spectral density. Total chip power including output buffering is 28.2 mW from a 2.5 V supply, with the core TIA consuming 8.2 mW, and the chip area including pads is 960 µm × 780 µm. With the advance of photonic devices, optical interconnects becomes a promising technology to replace the conventional electrical channels for the high-bandwidth and power efficient inter/intra-chip interconnect. Second, a silicon photonic transceiver is presented for a silicon ring resonator-based optical interconnect architecture in a 1V standard 65nm CMOS technology. The transmitter circuits incorporate high-swing drivers with non-linear pre-emphasis and automatic bias-based tuning for resonance wavelength stabilization. An optical forwarded-clock adaptive inverter-based transimpedance amplifier (TIA) receiver trades-off power for varying link budgets by employing an on-die eye monitor and scaling the TIA supply for the required sensitivity. At 5 GB/s operation, the ring modulator un- der 4Vpp driver achieves 12.7dB extinction ratio with 4.04mW power consumption, while a 0.28nm tuning range is obtained at 6.8µW/GHz efficiency with the bias-based tuning scheme implemented with the 2Vpp transmitter. When tested with a wire-bonded 150f- F p-i-n photodetector, the receiver achieves -12.7dBm sensitivity at a BER=10−15 and consumes 2.2mW at 8 GB/s. Third, a novel Nano-Photonic Network-on-Chip (NoC) architecture, called LumiNoC, is proposed for high performance and power-efficient interconnects for the chip-multi- processors (CMPs). A 64-node LumiNoC under synthetic traffic enjoys 50% less latency at low loads versus other reported photonic NoCs, and ∼25% less latency versus the electrical 2D mesh NoCs on realistic workloads. Under the same ideal throughput, LumiNoC achieves laser power reduction of 78%, and overall power reduction of 44% versus competing designs

SMART: A Single-Cycle Reconfigurable NoC for SoC Applications

As technology scales, SoCs are increasing in core counts, leading to the need for scalable NoCs to interconnect the multiple cores on the chip. Given aggressive SoC design targets, NoCs have to deliver low latency, high bandwidth, at low power and area overheads. In this paper, we propose Single-cycle Multi-hop Asynchronous Repeated Traversal (SMART) NoC, a NoC that reconfigures and tailors a generic mesh topology for SoC applications at runtime. The heart of our SMART NoC is a novel low-swing clockless repeated link circuit embedded within the router crossbars, that allows packets to potentially bypass all the way from source to destination core within a single clock cycle, without being latched at any intermediate router. Our clockless repeater link has been proven in silicon in 45nm SOI. Results show that at 2GHz, we can traverse 8mm within a single cycle, i.e. 8 hops with 1mm cores. We implement the SMART NoC to layout and show that SMART NoC gives 60% latency savings, and 2.2X power savings compared to a baseline mesh NoC.United States. Defense Advanced Research Projects Agency. The Ubiquitous High-Performance Computing Progra

Evaluating Techniques for Wireless Interconnected 3D Processor Arrays

In this thesis the viability of a wireless interconnect network for a highly parallel computer is investigated. The main theme of this thesis is to project the performance of a wireless network used to connect the processors in a parallel machine of such design. This thesis is going to investigate new design opportunities a wireless interconnect network can offer for parallel computing. A simulation environment is designed and implemented to carry out the tests. The results have shown that if the available radio spectrum is shared effectively between building blocks of the parallel machine, there are substantial chances to achieve high processor utilisation. The results show that some factors play a major role in the performance of such a machine. The size of the machine, the size of the problem and the communication and computation capabilities of each element of the machine are among those factors. The results show these factors set a limit on the number of nodes engaged in some classes of tasks. They have shown promising potential for further expansion and evolution of our idea to new architectural opportunities, which is discussed by the end of this thesis. To build a real machine of this type the architects would need to solve a number of challenging problems including heat dissipation, delivering electric power and Chip/board design; however, these issues are not part of this thesis and will be tackled in future

Design Techniques for Energy Efficient Multi-GB/S Serial I/O Transceivers

Total I/O bandwidth demand is growing in high-performance systems due to the emergence of many-core microprocessors and in mobile devices to support the next generation of multi-media features. High-speed serial I/O energy efficiency must improve in order to enable continued scaling of these parallel computing platforms in applications ranging from data centers to smart mobile devices. The first work, a low-power forwarded-clock I/O transceiver architecture is presented that employs a high degree of output/input multiplexing, supply-voltage scaling with data rate, and low-voltage circuit techniques to enable low-power operation. The transmitter utilizes a 4:1 output multiplexing voltage-mode driver along with 4-phase clocking that is efficiently generated from a passive poly-phase filter. The output driver voltage swing is accurately controlled from 100-200 mV_(ppd) using a low-voltage pseudo-differential regulator that employs a partial negative-resistance load for improved low frequency gain. 1:8 input de-multiplexing is performed at the receiver equalizer output with 8 parallel input samplers clocked from an 8-phase injection-locked oscillator that provides more than 1UI de-skew range. Low-power high-speed serial I/O transmitters which include equalization to compensate for channel frequency dependent loss are required to meet the aggressive link energy efficiency targets of future systems. The second work presents a low power serial link transmitter design that utilizes an output stage which combines a voltage-mode driver, which offers low static-power dissipation, and current-mode equalization, which offers low complexity and dynamic-power dissipation. The utilization of current-mode equalization decouples the equalization settings and termination impedance, allowing for a significant reduction in pre-driver complexity relative to segmented voltage-mode drivers. Proper transmitter series termination is set with an impedance control loop which adjusts the on-resistance of the output transistors in the driver voltage-mode portion. Further reductions in dynamic power dissipation are achieved through scaling the serializer and local clock distribution supply with data rate. Finally, it presents that a scalable quarter-rate transmitter employs an analog-controlled impedance-modulated 2-tap voltage-mode equalizer and achieves fast power-state transitioning with a replica-biased regulator and ILO clock generation. Capacitively-driven 2 mm global clock distribution and automatic phase calibration allows for aggressive supply scaling

Interconnects architectures for many-core era using surface-wave communication

PhD ThesisNetworks-on-chip (NoCs) is a communication paradigm that has emerged aiming to address on-chip communication challenges and to satisfy interconnection demands for chip-multiprocessors (CMPs). Nonetheless, there is continuous demand for even higher computational power, which is leading to a relentless downscaling of CMOS technology to enable the integration of many-cores. However, technology downscaling is in favour of the gate nodes over wires in terms of latency and power consumption. Consequently, this has led to the era of many-core processors where power consumption and performance are governed by inter-core communications rather than core computation. Therefore, NoCs need to evolve from being merely metalbased implementations which threaten to be a performance and power bottleneck for many-core efficiency and scalability. To overcome such intensified inter-core communication challenges, this thesis proposes a novel interconnect technology: the surface-wave interconnect (SWI). This new RF-based on-chip interconnect has notable characteristics compared to cutting-edge on-chip interconnects in terms of CMOS compatibility, high speed signal propagation, low power dissipation, and massive signal fan-out. Nonetheless, the realization of the SWI requires investigations at different levels of abstraction, such as the device integration and RF engineering levels. The aim of this thesis is to address the networking and system level challenges and highlight the potential of this interconnect. This should encourage further research at other levels of abstraction. Two specific system-level challenges crucial in future many-core systems are tackled in this study, which are cross-the-chip global communication and one-to-many communication. This thesis makes four major contributions towards this aim. The first is reducing the NoC average-hop count, which would otherwise increase packet-latency exponentially, by proposing a novel hybrid interconnect architecture. This hybrid architecture can not only utilize both regular metal-wire and SWI, but also exploits merits of both bus and NoC architectures in terms of connectivity compared to other general-purpose on-chip interconnect architectures. The second contribution addresses global communication issues by developing a distance-based weighted-round-robin arbitration (DWA) algorithm. This technique prioritizes global communication to be send via SWI short-cuts, which offer more efficient power dissipation and faster across-the-chip signal propagation. Results obtained using a cycleaccurate simulator demonstrate the effectiveness of the proposed system architecture in terms of significant power reduction, considervii able average delay reduction and higher throughput compared to a regular NoC. The third contribution is in handling multicast communications, which are normally associated with traffic overload, hotspots and deadlocks and therefore increase, by an order of magnitude the power consumption and latency. This has been achieved by proposing a novel routing and centralized arbitration schemes that exploits the SWI0s remarkable fan-out features. The evaluation demonstrates drastic improvements in the effectiveness of the proposed architecture in terms of power consumption ( 2-10x) and performance ( 22x) but with negligible hardware overheads ( 2%). The fourth contribution is to further explore multicast contention handling in a flexible decentralized manner, where original techniques such as stretch-multicast and ID-tagging flow control have been developed. A comparison of these techniques shows that the decentralized approach is superior to the centralized approach with low traffic loads, while the latter outperforms the former near and after NoC saturation

Source-synchronous I/O Links using Adaptive Interface Training for High Bandwidth Applications

Mobility is the key to the global business which requires people to be always connected to a central server. With the exponential increase in smart phones, tablets, laptops, mobile traffic will soon reach in the range of Exabytes per month by 2018. Applications like video streaming, on-demand-video, online gaming, social media applications will further increase the traffic load. Future application scenarios, such as Smart Cities, Industry 4.0, Machine-to-Machine (M2M) communications bring the concepts of Internet of Things (IoT) which requires high-speed low power communication infrastructures. Scientific applications, such as space exploration, oil exploration also require computing speed in the range of Exaflops/s by 2018 which means TB/s bandwidth at each memory node. To achieve such bandwidth, Input/Output (I/O) link speed between two devices needs to be increased to GB/s. The data at high speed between devices can be transferred serially using complex Clock-Data-Recovery (CDR) I/O links or parallely using simple source-synchronous I/O links. Even though CDR is more efficient than the source-synchronous method for single I/O link, but to achieve TB/s bandwidth from a single device, additional I/O links will be required and the source-synchronous method will be more advantageous in terms of area and power requirements as additional I/O links do not require extra hardware resources. At high speed, there are several non-idealities (Supply noise, crosstalk, Inter- Symbol-Interference (ISI), etc.) which create unwanted skew problem among parallel source-synchronous I/O links. To solve these problems, adaptive trainings are used in time domain to synchronize parallel source-synchronous I/O links irrespective of these non-idealities. In this thesis, two novel adaptive training architectures for source-synchronous I/O links are discussed which require significantly less silicon area and power in comparison to state-of-the-art architectures. First novel adaptive architecture is based on the unit delay concept to synchronize two parallel clocks by adjusting the phase of one clock in only one direction. Second novel adaptive architecture concept consists of Phase Interpolator (PI)-based Phase Locked Loop (PLL) which can adjust the phase in both direction and achieve faster synchronization at the expense of added complexity. With an increase in parallel I/O links, clock skew which is generated by the improper clock tree, also affects the timing margin. Incorrect duty cycle further reduces the timing margin mainly in Double Data Rate (DDR) systems which are generally used to increase the bandwidth of a high-speed communication system. To solve clock skew and duty cycle problems, a novel clock tree buffering algorithm and a novel duty cycle corrector are described which further reduce the power consumption of a source-synchronous system