XNOR Neural Engine: a Hardware Accelerator IP for 21.6 fJ/op Binary Neural Network Inference

Binary Neural Networks (BNNs) are promising to deliver accuracy comparable to conventional deep neural networks at a fraction of the cost in terms of memory and energy. In this paper, we introduce the XNOR Neural Engine (XNE), a fully digital configurable hardware accelerator IP for BNNs, integrated within a microcontroller unit (MCU) equipped with an autonomous I/O subsystem and hybrid SRAM / standard cell memory. The XNE is able to fully compute convolutional and dense layers in autonomy or in cooperation with the core in the MCU to realize more complex behaviors. We show post-synthesis results in 65nm and 22nm technology for the XNE IP and post-layout results in 22nm for the full MCU indicating that this system can drop the energy cost per binary operation to 21.6fJ per operation at 0.4V, and at the same time is flexible and performant enough to execute state-of-the-art BNN topologies such as ResNet-34 in less than 2.2mJ per frame at 8.9 fps.Comment: 11 pages, 8 figures, 2 tables, 3 listings. Accepted for presentation at CODES'18 and for publication in IEEE Transactions on Computer-Aided Design of Circuits and Systems (TCAD) as part of the ESWEEK-TCAD special issu

Variation-aware high-level DSP circuit design optimisation framework for FPGAs

The constant technology shrinking and the increasing demand for systems that operate under different power profiles with the maximum performance, have motivated the work in this thesis. Modern design tools that target FPGA devices take a conservative approach in the estimation of the maximum performance that can be achieved by a design when it is placed on a device, accounting for any variability in the fabrication process of the device. The work presented here takes a new view on the performance improvement of DSP designs by pushing them into the error-prone regime, as defined by the synthesis tools, and by investigating methodologies that reduce the impact of timing errors at the output of the system. In this work two novel error reduction techniques are proposed to address this problem. One is based on reduced-precision redundancy and the other on an error optimisation framework that uses information from a prior characterisation of the device. The first one is a generic architecture that is appended to existing arithmetic operators. The second defines the high-level parameters of the algorithm without using extra resources. Both of these methods allow to achieve graceful degradation whilst variation increases. A comparison of the new methods is laid against the existing methodologies, and conclusions drawn on the tradeoffs between their cost, in terms of resources and errors, and their benefits in terms of throughput. In some cases it is possible to double the performance of the design while still producing valid results.Open Acces

DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

Modeling of a hardware VLSI placement system: Accelerating the Simulated Annealing algorithm

An essential step in the automation of electronic design is the placement of the physical components on the target semiconductor die. The placement step presents the opportunity to reduce costs in terms of wire length and performance degradation; however it is compute intensive and is NP-complete in terms of obtaining an optimal solution. As designs have grown in complexity and gate count, obtaining an optimal solution is not feasible due to time to market constraints or sheer compute effort required. Heuristic algorithms allow for efficient but sub-optimal designs to be produced with a reduction in processing time. A widely used algorithm is Simulated Annealing (SA). The goal of this work was to develop a model that would enable an analysis into the feasibility of developing a hardware accelerated placement system which uses SA at its core. The SA heuristic was analyzed for possible improvements in efficiency with focus given to targeting the system for hardware. A solution implementing parallel computing with specialized hardware configurations inside a field programmable gate array (FPGA) was investigated as having the possibility to improve the efficiency of the SA-based algorithm. All supporting subsystems were also described for a hardware accelerated model. A large speedup was analytically shown from both accelerating the critical path of the SA algorithm as well as novel methods of improving SA\u27s efficiency. As data throughput requirements were not included in this work, the results presented may be optimistic for an overall system speedup. However, the results clearly show that future work is warranted in studying the concept of a hardware accelerated placement system

Evaluating Architectural, Redundancy, and Implementation Strategies for Radiation Hardening of FinFET Integrated Circuits

In this article, authors explore radiation hardening techniques through the design of a test chip implemented in 16-nm FinFET technology, along with architectural and redundancy design space exploration of its modules. Nine variants of matrix multiplication were taped out and irradiated with neutrons. The results obtained from the neutron campaign revealed that the radiation-hardened variants present superior resiliency when either local or global triple modular redundancy (TMR) schemes are employed. Furthermore, simulation-based fault injection was utilized to validate the measurements and to explore the effects of different implementation strategies on failure rates. We further show that the interplay between these different implementation strategies is not trivial to capture and that synthesis optimizations can effectively break assumptions about the effectiveness of redundancy schemes