Frequency Multipliers in SiGe BiCMOS for Local Oscillator Generation in D-band Wireless Transceivers

Communications at millimeter-wave (mm-Wave) have drawn a lot of attention in recent years due to the wide available bandwidth which translates directly to higher data transmission capacity. Generation of the transceivers local oscillation (LO) is critical because many contrasting requirements, i.e. tuning range (TR), phase noise (PN), output power, and level of spurious tones, affect the system performance. Differently from what is commonly pursued at Radio Frequency, LO generation with a PLL embedding a VCO at the desired output frequency is not viable at mm-wave. A more promising approach consists of a PLL in the 10-20GHz range, where silicon VCOs feature the best figure of merit, followed by a frequency multiplier. In this thesis, a frequency multiplication chain is investigated to up-convert an LO signal from X-band to D-band by a multiplication factor of 12. The multiplication is done in steps of 3, 2, and 2. A sextupler chip comprises the tripler and the first doubler and the last doubler stage which upconverts the LO signal from E- to D-band is realized in a separate chip, all in a 55nm SiGe BiCMOS technology. The frequency tripler circuit is based on a novel circuit topology which yields a remarkable improvement on the suppression of the driving signal frequency at the output, compared to conventional designs exploiting transistors in class-C. The active core of the circuit approximates the transfer characteristic of a third-order polynomial that ideally produces only a third-harmonic of the input signal. Implemented in a separate break-out chip and consuming 23mW of DC power, the tripler demonstrates ~40dB suppression of the input signal and its 5th harmonic over 16% fractional bandwidth and robustness to power variation of the driving signal over a 15dB range. Including the E-band doubler, the sextupler chip achieves a peak output power of 1.7dBm at 74.4GHz and remains within 2dB variation from 70GHz to 82GHz, corresponding to 16% fractional BW. In this frequency range, the leakages of all harmonics are suppressed by more than 40dBc. The design of the D-band doubler was aimed at delivering high output power with high efficiency and high conversion gain. Toward this end, the efficiency of a push-push pair was improved by a stacked Colpitts oscillator to boost the power conversion gain by 10dB. Moreover, the common-collector configuration keeps separate the oscillator tank from the load, allowing independent optimization of the harmonic conversion efficiency and the load impedance for maximum power delivery. The measured performance of the test chip demonstrated Pout up to 8dBm at 130GHz with 13dB conversion gain and 6.3% Power Added Efficiency

X-band solid state signal source special report

X-band solid state signal source microwave apparatu

Ka band solid state transmitter/driver Final report

Design, development, and testing of Ka band solid state transmitte

CMOS Signal Synthesizers for Emerging RF-to-Optical Applications

The need for clean and powerful signal generation is ubiquitous, with applications spanning the spectrum from RF to mm-Wave, to into and beyond the terahertz-gap. RF applications including mobile telephony and microprocessors have effectively harnessed mixed-signal integration in CMOS to realize robust on-chip signal sources calibrated against adverse ambient conditions. Combined with low cost and high yield, the CMOS component of hand-held devices costs a few cents per part per million parts. This low cost, and integrated digital processing, make CMOS an attractive option for applications like high-resolution imaging and ranging, and the emerging 5-G communication space. RADAR techniques when expanded to optical frequencies can enable micrometers of resolution for 3D imaging. These applications, however, impose upto 100x more exacting specifications on power and spectral purity at much higher frequencies than conventional RF synthesizers. This generation of applications will present unconventional challenges for transistor technologies - whether it is to squeeze performance in the conventionally used spectrum, already wrung dry, or signal generation and system design in the relatively emptier mm-Wave to sub-mmWave spectrum, much of the latter falling in the ``Terahertz Gap". Indeed, transistor scaling and innovative device physics leading to new transistor topologies have yielded higher cut-off frequencies in CMOS, though still lagging well behind SiGe and III-V semiconductors. To avoid multimodule solutions with functionality partitioned across different technologies, CMOS must be pushed out of its comfort zone, and technology scaling has to have accompanying breakthroughs in design approaches not only at the system but also at the block level. In this thesis, while not targeting a specific application, we seek to formulate the obstacles in synthesizing high frequency, high power and low noise signals in CMOS and construct a coherent design methodology to address them. Based on this, three novel prototypes to overcome the limiting factors in each case are presented. The first half of this thesis deals with high frequency signal synthesis and power generation in CMOS. Outside the range of frequencies where the transistor has gain, frequency generation necessitates harmonic extraction either as harmonic oscillators or as frequency multipliers. We augment the traditional maximum oscillation frequency metric (fmax), which only accounts for transistor losses, with passive component loss to derive an effective fmax metric. We then present a methodology for building oscillators at this fmax, the Maximum Gain Ring Oscillator. Next, we explore generating large signals beyond fmax through harmonic extraction in multipliers. Applying concepts of waveform shaping, we demonstrate a Power Mixer that engineers transistor nonlinearity by manipulating the amplitudes and relative phase shifts of different device nodes to maximize performance at a specific harmonic beyond device cut-off. The second half proposes a new architecture for an ultra-low noise phase-locked loop (PLL), the Reference-Sampling PLL. In conventional PLLs, a noisy buffer converts the slow, low-noise sine-wave reference signal to a jittery square-wave clock against which the phase of a noisy voltage-controlled oscillator (VCO) is corrected. We eliminate this reference buffer, and measure phase error by sampling the reference sine-wave with the 50x faster VCO waveform already available on chip, and selecting the relevant sample with voltage proportional to phase error. By avoiding the N-squared multiplication of the high-power reference buffer noise, and directly using voltage-mode phase error to control the VCO, we eliminate several noisy components in the controlling loop for ultra-low integrated jitter for a given power consumption. Further, isolation of the VCO tank from any varying load, unlike other contemporary divider-less PLL architectures, results in an architecture with record performance in the low-noise and low-spur space. We conclude with work that brings together concepts developed for clean, high-power signal generation towards a hybrid CMOS-Optical approach to Frequency-Modulated Continuous-Wave (FMCW) Light-Detection-And-Ranging (LIDAR). Cost-effective tunable lasers are temperature-sensitive and have nonlinear tuning profiles, rendering precise frequency modulations or 'chirps' untenable. Locking them to an electronic reference through an electro-optic PLL, and electronically calibrating the control signal for nonlinearity and ambient sensitivity, can make such chirps possible. Approaches that build on the body of advances in electrical PLLs to control the performance, and ease the specification on the design of optical systems are proposed. Eventually, we seek to leverage the twin advantages of silicon-intensive integration and low-cost high-yield towards developing a single-chip solution that uses on-chip signal processing and phased arrays to generate precise and robust chirps for an electronically-steerable fine LIDAR beam

SiGe-based broadband and high suppression frequency doubler ICs for wireless communications

制度:新 ; 報告番号:甲3419号 ; 学位の種類:博士(工学) ; 授与年月日:2011/9/15 ; 早大学位記番号:新574

Kompetensi guru dalam pengajaran amali reka bentuk dan teknologi di Sekolah Rendah Daerah Batu Pahat

Kompetensi bermaksud kemampuan atau kecekapan seseorang individu dalam melakukan sesuatu tugasan. Kompetensi juga merujuk kepada kemampuan seseorang dalam melaksanakan sesuatu yang diperolehi melalui pendidikan dan juga merujuk kepada prestasi dan perbuatan yang rasional untuk memenuhi spesifikasi tertentu di dalam pelaksanaan tugas-tugas pendidikan. Objektif kajian ini dijalankan adalah untuk mengenalpasti tahap kompetensi guru terhadap pengajaran amali Reka Bentuk dan Teknologi di Sekolah Rendah Daerah Batu Pahat. Kajian ini berbentuk tinjauan deskriptif yang menggunakan borang soal selidik sebagai instrumen kajian. Borang soal selidik yang dibina adalah berdasarkan kepada tiga elemen iaitu elemen pengetahuan, kemahiran dan sikap. Seramai 118 orang guru yang mengajar mata pelajaran ini telah terlibat sebagai responden. Data yang dikumpulkan telah dianalisis dengan menggunakan perisian Statistical Package for Social Science (SPSS) versi 19 yang melibatkan statistik skor min dan ujian-T tidak bersandar. Hasil dapatan kajian yang diperolehi menunjukkan guru-guru Reka Bentuk dan Teknoogi mempunyai tahap kompetensi yang tinggi terhadap proses pengajaran amali iaitu skor min yang diperolehi pada elemen pengetahuan adalah 4.23, elemen kemahiran adalah 4.30, dan elemen sikap adalah 4.47. Dapatan kajian juga menunjukkan tidak terdapat perbezaan yang signifikan terhadap tahap kompetensi berdasarkan jantina guru lelaki dan guru perempuan dengan nilai sigifikan melebihi 0.05 iaitu sebanyak 0.059. Beberapa cadangan untuk penambahbaikan juga dikemukan dalam kajian ini. Hasil dari dapatan kajian ini dapat digunakan sebagai cadangan garis panduan kepada guru-guru Reka Bentuk dan Teknologi untuk mencapai Standard Kompetensi Guru

Terahertz local oscillator sources: performance and capabilities

Frequency multiplier circuits based on planar GaAs Schottky diodes have advanced significantly in the last decade. Useful power in the >1 THz range has now been demonstrated from a complete solid-state chain. This paper will review some of the technologies that have led to this achievement along with a brief look at future challenges

The 30 GHz communications satellite low noise receiver

A Ka-band low noise front end in proof of concept (POC) model form for ultimate spaceborne communications receiver deployment was developed. The low noise receiver consists of a 27.5 to 30.0 GHz image enhanced mixer integrated with a 3.7 to 6.2 GHz FET low noise IF amplifier and driven by a self contained 23.8 GHz phase locked local oscillator source. The measured level of receiver performance over the 27.3 to 30.0 GHz RF/3.7 to 6.2 GHz IF band includes 5.5 to 6.5 dB (typ) SSB noise figure, 20.5 + or - 1.5 dB conversion gain and +23 dBm minimum third order two tone intermodulation output intercept point

Design and Analysis of Low-power Millimeter-Wave SiGe BiCMOS Circuits with Application to Network Measurement Systems

Interest in millimeter (mm-) wave frequencies covering the spectrum of 30-300 GHz has been steadily increasing. Advantages such as larger absolute bandwidth and smaller form-factor have made this frequency region attractive for numerous applications, including high-speed wireless communication, sensing, material science, health, automotive radar, and space exploration. Continuous development of silicon-germanium heterojunction bipolar transistor (SiGe HBT) and associated BiCMOS technology has achieved transistors with fT/fmax of 505/720 GHz and integration with 55 nm CMOS. Such accomplishment and predictions of beyond THz performance have made SiGe BiCMOS technology the most competitive candidate for addressing the aforementioned applications. Especially for mobile applications, a critical demand for future mm-wave applications will be low DC power consumption (Pdc), which requires a substantial reduction of supply voltage and current. Conventionally, reducing the supply voltage will lead to HBTs operating close to or in the saturation region, which is typically avoided in mm-wave circuits due to expectated performance degradation and often inaccurate models. However, due to only moderate speed reduction at the forward-biased base-collector voltage (VBC) up to 0.5 V and the accuracy of the compact model HICUM/L2 also in saturation, low-power mm-wave circuits with SiGe HBTs operating in saturation offer intriguing benefits, which have been explored in this thesis based on 130 nm SiGe BiCMOS technologies: • Different low-power mm-wave circuit blocks are discussed in detail, including low-noise amplifiers (LNAs), down-conversion mixers, and various frequency multipliers covering a wide frequency range from V-band (50-75 GHz) to G-band (140-220 GHz). • Aiming at realizing a better trade-off between Pdc and RF performance, a drastic decrease in supply voltage is realized with forward-biased VBC, forcing transistors of the circuits to operate in saturation. • Discussions contain the theoretical analysis of the key figure of merits (FoMs), topology and bias selection, device sizing, and performance enhancement techniques. • A 173-207 GHz low-power amplifier with 23 dB gain and 3.2 mW Pdc, and a 72-108 GHz low-power tunable amplifier with 10-23 dB gain and 4-21 mW Pdc were designed. • A 97 GHz low-power down-conversion mixer was presented with 9.6 dB conversion gain (CG) and 12 mW Pdc. • For multipliers, a 56-66 GHz low-power frequency quadrupler with -3.6 dB peak CG and 12 mW Pdc, and a 172-201 GHz low-power frequency tripler with -4 dB peak CG and 10.5 mW Pdc were realized. By cascading these two circuits, also a 176-193 GHz low-power ×12 multiplier was designed, achieving -11 dBm output power with only 26 mW Pdc. • An integrated 190 GHz low-power receiver was designed as one receiving channel of a G-band frequency extender specifically for a VNA-based measurement system. Another goal of this receiver is to explore the lowest possible Pdc while keeping its highly competitive RF performance for general applications requiring a wide LO tuning range. Apart from the low-power design method of circuit blocks, the careful analysis and distribution of the receiver FoMs are also applied for further reduction of the overall Pdc. Along this line, this receiver achieved a peak CG of 49 dB with a 14 dB tunning range, consuming only 29 mW static Pdc for the core part and 171 mW overall Pdc, including the LO chain. • All designs presented in this thesis were fabricated and characterized on-wafer. Thanks to the accurate compact model HICUM/L2, first-pass access was achieved for all circuits, and simulation results show excellent agreement with measurements. • Compared with recently published work, most of the designs in this thesis show extremely low Pdc with highly competitive key FoMs regarding gain, bandwidth, and noise figure. • The observed excellent measurement-simulation agreement enables the sensitivity analysis of each design for obtaining a deeper insight into the impact of transistor-related physical effects on critical circuit performance parameters. Such studies provide meaningful feedback for process improvement and modeling development.:Table of Contents Kurzfassung . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iv Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii 1 Introduction 1 1.1 Motivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 Objectives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of symbols and acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Technology 7 2.1 Fabrication Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1.1 SiGe HBT performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1.2 B11HFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1.3 SG13G2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1.4 SG13D7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.2 Commonly Used Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2.1 Grounded-sidewall-shielded microstrip line . . . . . . . . . . . . . . . . . . 12 2.2.2 Zero-impedance Transmission Line . . . . . . . . . . . . . . . . . . . . . . 15 2.2.3 Balun . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.2.3.1 Active Balun . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.2.3.2 Passive Balun . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3 Low-power Low-noise Amplifiers 25 3.1 173-207 GHz Ultra-low-power Amplifier . . . . . . . . . . . . . . . . . . . . . . . 25 3.1.1 Topology Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.1.2 Bias Dependency of the Small-signal Performance . . . . . . . . . . . . . 27 3.1.2.1 Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.1.2.2 Bias vs Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.1.2.3 Bias vs Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.1.2.4 Bias vs Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.1.3 Bias selection and Device sizing . . . . . . . . . . . . . . . . . . . . . . . . 36 3.1.3.1 Bias Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 3.1.3.2 Device Sizing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 3.1.4 Performance Enhancement Technologies . . . . . . . . . . . . . . . . . . . 41 3.1.4.1 Gm-boosting Inductors . . . . . . . . . . . . . . . . . . . . . . . 41 3.1.4.2 Stability Enhancement . . . . . . . . . . . . . . . . . . . . . . . 43 3.1.4.3 Noise Improvement . . . . . . . . . . . . . . . . . . . . . . . . . 45 3.1.5 Circuit Realization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.1.5.1 Layout Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3.1.5.2 Inductors Design . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.1.5.3 Dual-band Matching Network . . . . . . . . . . . . . . . . . . . 48 3.1.5.4 Circuit Implementation . . . . . . . . . . . . . . . . . . . . . . . 50 3.1.6 Results and Discussions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 3.1.6.1 Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . 51 3.1.6.2 Measurement Results . . . . . . . . . . . . . . . . . . . . . . . . 51 3.1.6.3 Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 3.2 72-108 GHz Low-Power Tunable Amplifier . . . . . . . . . . . . . . . . . . . . . . 55 3.2.1 Configuration, Sizing, and Bias Tuning Range . . . . . . . . . . . . . . . . 55 3.2.2 Regional Matching Network . . . . . . . . . . . . . . . . . . . . . . . . . . 57 3.2.2.1 Impedance Variation . . . . . . . . . . . . . . . . . . . . . . . . . 57 3.2.2.2 Regional Matching Network Design . . . . . . . . . . . . . . . . 60 3.2.3 Circuit Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 3.2.4 Results and Discussion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 3.2.4.1 Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 3.2.4.2 Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 3.3 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 4 Low-power Down-conversion Mixers 73 4.1 97 GHz Low-power Down-conversion Mixer . . . . . . . . . . . . . . . . . . . . . 74 4.1.1 Mixer Design and Implementation . . . . . . . . . . . . . . . . . . . . . . 74 4.1.1.1 Mixer Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 4.1.1.2 Bias Selection and Device Sizing . . . . . . . . . . . . . . . . . . 77 4.1.1.3 Mixer Implementation . . . . . . . . . . . . . . . . . . . . . . . . 79 4.1.2 Results and Discussion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 4.1.2.1 Measurement Results . . . . . . . . . . . . . . . . . . . . . . . . 80 4.1.2.2 Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 4.2 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 5 Low-power Multipliers 87 5.1 General Design Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 5.2 56-66 GHz Low-power Frequency Quadrupler . . . . . . . . . . . . . . . . . . . . 89 5.3 172-201 GHz Low-power Frequency Tripler . . . . . . . . . . . . . . . . . . . . . 93 5.4 176-193 GHz Low-power ×12 Frequency Multiplier . . . . . . . . . . . . . . . . . 96 5.5 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 6 Low-power Receivers 101 6.1 Receiver Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 6.2 LO Chain (×12) Integrated 190 GHz Low-Power Receiver . . . . . . . . . . . . . 104 6.2.1 Receiver Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 6.2.2 Low-power Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 6.2.3 Building Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 6.2.3.1 LNA and LO DA . . . . . . . . . . . . . . . . . . . . . . . . . . 108 6.2.3.2 Tunable Mixer and IF BA . . . . . . . . . . . . . . . . . . . . . 111 6.2.3.3 65 GHz (V-band) Quadrupler . . . . . . . . . . . . . . . . . . . 116 6.2.3.4 G-band Tripler . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 6.2.4 Receiver Results and Discussion . . . . . . . . . . . . . . . . . . . . . . . 123 6.2.5 Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 6.2.6 Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 6.3 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 7 Conclusions 133 7.1 Summaries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 7.2 Outlook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 Bibliography 135 List of Figures 149 List of Tables 157 A Derivation of the Gm 159 A.1 Gm of standard cascode stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 A.2 Gm of cascode stage with Lcas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 A.3 Gm of cascode stage with Lb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 B Derivation of Yin in the stability analysis 163 C Derivation of Zin and Zout 165 C.1 Zin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 C.2 Zout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 D Derivation of the cascaded oP1dB 169 E Table of element values for the designed circuits 17