Non-volatile hybrid optical phase shifter driven by a ferroelectric transistor

Optical phase shifters are essential elements in photonic integrated circuits (PICs) and function as a direct interface to program the PIC. Non-volatile phase shifters, which can retain information without a power supply, are highly desirable for low-power static operations. Here a non-volatile optical phase shifter is demonstrated by driving a III-V/Si hybrid metal-oxide-semiconductor (MOS) phase shifter with a ferroelectric field-effect transistor (FeFET) operating in the source follower mode. Owing to the various polarization states in the FeFET, multistate non-volatile phase shifts up to 1.25{\pi} are obtained with CMOS-compatible operation voltages and low switching energy up to 3.3 nJ. Furthermore, a crossbar array architecture is proposed to simplify the control of non-volatile phase shifters in large-scale PICs and its feasibility is verified by confirming the selective write-in operation of a targeted FeFET with a negligible disturbance to the others. This work paves the way for realizing large-scale non-volatile programmable PICs for emerging computing applications such as deep learning and quantum computing

Mixed Tunnel-FET/MOSFET Level Shifters: A New Proposal to Extend the Tunnel-FET Application Domain

In this paper, we identify the level shifter (LS) for voltage up-conversion from the ultralow-voltage regime as a key application domain of tunnel FETs (TFETs).We propose a mixed TFET\u2013MOSFET LS design methodology, which exploits the complementary characteristics of TFET and MOSFET devices. Simulation results show that the hybrid LS exhibits superior dynamic performance at the same static power consumption compared with the conventional MOSFET and pure TFET solutions. The advantage of the mixed design with respect to the conventional MOSFET approach is emphasized when lower voltage signals have to be up-converted, reaching an improvement of the energy-delay product up to three decades. When compared with the full MOSFET design, the mixed TFET\u2013MOSFET solution appears to be less sensitive toward threshold voltage variations in terms of dynamic figures of merit, at the expense of higher leakage variability. Similar results are obtained for four different LS topologies, thus indicating that the hybrid TFET\u2013MOSFET approach offers intrinsic advantages in the design of LS for voltage up-conversion from the ultralow-voltage regime compared with the conventional MOSFET and pure TFET solutions

An Ultralow Power Multirate FSK Demodulator With Digital-Assisted Calibrated Delay-Line Based Phase Shifter for High-Speed Biomedical Zero-IF Receivers

[[abstract]]頻率鍵移接收解調電路可廣泛應用於穿戴式或植入式生理訊號感測器與各種環境監測之成測器上，其其有超低功率消耗與抗干擾能力強之優點，因此可大幅增加成測器之使用壽命並提供可靠與穩定之資料傳輸品質。本論文提出一高速、可變傳輸速率與超低功耗之頻率鍵移接收解調電路設計。突破先前頻率鍵移解調電路最高解調速度為10 Mb/s 之限制，傳輸速率可達40 Mb/s 以上，因此可大幅降低接收每位元資料所需之能源消耗，提高能源效率。此電路架構可根據使用需求調整其傳輸速率範園1 Mb/s-40 Mb/s，以達到功耗與傳輸速率最佳化之目的。[[notice]]補正完畢[[incitationindex]]SCI[[booktype]]紙

Silicon-Organic Hybrid (SOH) and Plasmonic-Organic Hybrid (POH) integration

Silicon photonics offers tremendous potential for inexpensive high-yield photonic-electronic integration. Besides conventional dielectric waveguides, plasmonic structures can also be efficiently realized on the silicon photonic platform, reducing device footprint by more than an order of magnitude. However, nei-ther silicon nor metals exhibit appreciable second-order optical nonlinearities, thereby making efficient electro-optic modulators challenging to realize. These deficiencies can be overcome by the concepts of silicon-organic hybrid (SOH) and plasmonic-organic hybrid integration, which combine SOI waveguides and plasmonic nanostructures with organic electro-optic cladding materials

Low-power, 10-Gbps 1.5-Vpp differential CMOS driver for a silicon electro-optic ring modulator

We present a novel driver circuit enabling electro-optic modulation with high extinction ratio from a co-designed silicon ring modulator. The driver circuit provides an asymmetric differential output at 10Gbps with a voltage swing up to 1.5V(pp) from a single 1.0V supply, maximizing the resonance-wavelength shift of depletion-type ring modulators while avoiding carrier injection. A test chip containing 4 reconfigurable driver circuits was fabricated in 40nm CMOS technology. The measured energy consumption for driving a 100fF capacitive load at 10Gbps was as low as 125fJ/bit and 220fJ/bit at 1V(pp) and 1.5V(pp) respectively. After flip-chip integration with ring modulators on a silicon-photonics chip, the power consumption was measured to be 210fJ/bit and 350fJ/bit respectively

The Integration of nearthreshold and subthreshold CMOS logic for energy minimization

With the rapid growth in the use of portable electronic devices, more emphasis has recently been placed on low-energy circuit design. Digital subthreshold complementary metal-oxide-semiconductor (CMOS) circuit design is one area of study that offers significant energy reduction by operating at a supply voltage substantially lower than the threshold voltage of the transistor. However, these energy savings come at a critical cost to performance, restricting its use to severely energy-constrained applications such as microsensor nodes. In an effort to mitigate this performance degradation in low-energy designs, nearthreshold circuit design has been proposed and implemented in digital circuits such as Intel\u27s energy-efficient hardware accelerator. The application spectrum of nearthreshold and subthreshold design could be broadened by integrating these cells into high-performance designs. This research focuses on the integration of characterized nearthreshold and subthreshold standard cells into high-performance functional modules. Within these functional modules, energy minimization is achieved while satisfying performance constraints by replacing non-critical path logic with nearthreshold and subthreshold logic cells. Specifically, the critical path method is used to bind the timing and energy constraints of the design. The design methodology was verified and tested with several benchmark circuits, including a cryptographic hash function, Skein. An average energy savings of 41.15% was observed at a circuit performance degradation factor of 10. The energy overhead of the level shifters accounted for at least 8.5% of the energy consumption of the optimized circuit, with an average energy overhead of 26.76%. A heuristic approach is developed for estimating the energy savings of the optimized design

Digital and analog TFET circuits: Design and benchmark

In this work, we investigate by means of simulations the performance of basic digital, analog, and mixed-signal circuits employing tunnel-FETs (TFETs). The analysis reviews and complements our previous papers on these topics. By considering the same devices for all the analysis, we are able to draw consistent conclusions for a wide variety of circuits. A virtual complementary TFET technology consisting of III-V heterojunction nanowires is considered. Technology Computer Aided Design (TCAD) models are calibrated against the results of advanced full-quantum simulation tools and then used to generate look-up-tables suited for circuit simulations. The virtual complementary TFET technology is benchmarked against predictive technology models (PTM) of complementary silicon FinFETs for the 10 nm node over a wide range of supply voltages (VDD) in the sub-threshold voltage domain considering the same footprint between the vertical TFETs and the lateral FinFETs and the same static power. In spite of the asymmetry between p- and n-type transistors, the results show clear advantages of TFET technology over FinFET for VDDlower than 0.4 V. Moreover, we highlight how differences in the I-V characteristics of FinFETs and TFETs suggest to adapt the circuit topologies used to implement basic digital and analog blocks with respect to the most common CMOS solutions

Digital and analog TFET circuits: Design and benchmark

In this work, we investigate by means of simulations the performance of basic digital, analog, and mixed-signal circuits employing tunnel-FETs (TFETs). The analysis reviews and complements our previous papers on these topics. By considering the same devices for all the analysis, we are able to draw consistent conclusions for a wide variety of circuits. A virtual complementary TFET technology consisting of III-V heterojunction nanowires is considered. Technology Computer Aided Design (TCAD) models are calibrated against the results of advanced full-quantum simulation tools and then used to generate look-up-tables suited for circuit simulations. The virtual complementary TFET technology is benchmarked against predictive technology models (PTM) of complementary silicon FinFETs for the 10 nm node over a wide range of supply voltages (VDD) in the sub-threshold voltage domain considering the same footprint between the vertical TFETs and the lateral FinFETs and the same static power. In spite of the asymmetry between p- and n-type transistors, the results show clear advantages of TFET technology over FinFET for VDDlower than 0.4 V. Moreover, we highlight how differences in the I-V characteristics of FinFETs and TFETs suggest to adapt the circuit topologies used to implement basic digital and analog blocks with respect to the most common CMOS solutions

Design of Low Leakage Multi Threshold (Vth) CMOS Level Shifter

In this paper, a low leakage multi Vth level shifter is designed for robust voltage shifting from sub threshold to above threshold domain using MTCMOS technique and sleepy keeper. MTCMOS is an effective circuit level technique that improves the performance and design by utilizing both low and high threshold voltage transistors. Leakage power dissipation has become an overriding concern for VLSI circuit designers. In this a “sleepy keeper” approach is preferred which reduces the leakage current while saving exact logic state. The new  low-power level shifter using sleepy keeper is compared with the previous work for different values of the lower supply voltage. When the circuits are individually analyzed for power consumption at 45nm CMOS technology, the new level shifter offer significant power savings up to 37% as compared to the previous work. Alternatively, when the circuits are individually analyzed for minimum propagation delay, speed is enhanced by up to 48% with  our approach to the circuit. All the simulation results are based on 45nm CMOS technology and  simulated in cadence tool.DOI:http://dx.doi.org/10.11591/ijece.v3i5.316

Single chip photonic deep neural network with accelerated training

As deep neural networks (DNNs) revolutionize machine learning, energy consumption and throughput are emerging as fundamental limitations of CMOS electronics. This has motivated a search for new hardware architectures optimized for artificial intelligence, such as electronic systolic arrays, memristor crossbar arrays, and optical accelerators. Optical systems can perform linear matrix operations at exceptionally high rate and efficiency, motivating recent demonstrations of low latency linear algebra and optical energy consumption below a photon per multiply-accumulate operation. However, demonstrating systems that co-integrate both linear and nonlinear processing units in a single chip remains a central challenge. Here we introduce such a system in a scalable photonic integrated circuit (PIC), enabled by several key advances: (i) high-bandwidth and low-power programmable nonlinear optical function units (NOFUs); (ii) coherent matrix multiplication units (CMXUs); and (iii) in situ training with optical acceleration. We experimentally demonstrate this fully-integrated coherent optical neural network (FICONN) architecture for a 3-layer DNN comprising 12 NOFUs and three CMXUs operating in the telecom C-band. Using in situ training on a vowel classification task, the FICONN achieves 92.7% accuracy on a test set, which is identical to the accuracy obtained on a digital computer with the same number of weights. This work lends experimental evidence to theoretical proposals for in situ training, unlocking orders of magnitude improvements in the throughput of training data. Moreover, the FICONN opens the path to inference at nanosecond latency and femtojoule per operation energy efficiency.Comment: 21 pages, 10 figures. Comments welcom