A Survey of Prediction and Classification Techniques in Multicore Processor Systems

In multicore processor systems, being able to accurately predict the future provides new optimization opportunities, which otherwise could not be exploited. For example, an oracle able to predict a certain application\u27s behavior running on a smart phone could direct the power manager to switch to appropriate dynamic voltage and frequency scaling modes that would guarantee minimum levels of desired performance while saving energy consumption and thereby prolonging battery life. Using predictions enables systems to become proactive rather than continue to operate in a reactive manner. This prediction-based proactive approach has become increasingly popular in the design and optimization of integrated circuits and of multicore processor systems. Prediction transforms from simple forecasting to sophisticated machine learning based prediction and classification that learns from existing data, employs data mining, and predicts future behavior. This can be exploited by novel optimization techniques that can span across all layers of the computing stack. In this survey paper, we present a discussion of the most popular techniques on prediction and classification in the general context of computing systems with emphasis on multicore processors. The paper is far from comprehensive, but, it will help the reader interested in employing prediction in optimization of multicore processor systems

Resource-aware scheduling for 2D/3D multi-/many-core processor-memory systems

This dissertation addresses the complexities of 2D/3D multi-/many-core processor-memory systems, focusing on two key areas: enhancing timing predictability in real-time multi-core processors and optimizing performance within thermal constraints. The integration of an increasing number of transistors into compact chip designs, while boosting computational capacity, presents challenges in resource contention and thermal management. The first part of the thesis improves timing predictability. We enhance shared cache interference analysis for set-associative caches, advancing the calculation of Worst-Case Execution Time (WCET). This development enables accurate assessment of cache interference and the effectiveness of partitioned schedulers in real-world scenarios. We introduce TCPS, a novel task and cache-aware partitioned scheduler that optimizes cache partitioning based on task-specific WCET sensitivity, leading to improved schedulability and predictability. Our research explores various cache and scheduling configurations, providing insights into their performance trade-offs. The second part focuses on thermal management in 2D/3D many-core systems. Recognizing the limitations of Dynamic Voltage and Frequency Scaling (DVFS) in S-NUCA many-core processors, we propose synchronous thread migrations as a thermal management strategy. This approach culminates in the HotPotato scheduler, which balances performance and thermal safety. We also introduce 3D-TTP, a transient temperature-aware power budgeting strategy for 3D-stacked systems, reducing the need for Dynamic Thermal Management (DTM) activation. Finally, we present 3QUTM, a novel method for 3D-stacked systems that combines core DVFS and memory bank Low Power Modes with a learning algorithm, optimizing response times within thermal limits. This research contributes significantly to enhancing performance and thermal management in advanced processor-memory systems

Memory-Aware Scheduling for Fixed Priority Hard Real-Time Computing Systems

As a major component of a computing system, memory has been a key performance and power consumption bottleneck in computer system design. While processor speeds have been kept rising dramatically, the overall computing performance improvement of the entire system is limited by how fast the memory can feed instructions/data to processing units (i.e. so-called memory wall problem). The increasing transistor density and surging access demands from a rapidly growing number of processing cores also significantly elevated the power consumption of the memory system. In addition, the interference of memory access from different applications and processing cores significantly degrade the computation predictability, which is essential to ensure timing specifications in real-time system design. The recent IC technologies (such as 3D-IC technology) and emerging data-intensive real-time applications (such as Virtual Reality/Augmented Reality, Artificial Intelligence, Internet of Things) further amplify these challenges. We believe that it is not simply desirable but necessary to adopt a joint CPU/Memory resource management framework to deal with these grave challenges. In this dissertation, we focus on studying how to schedule fixed-priority hard real-time tasks with memory impacts taken into considerations. We target on the fixed-priority real-time scheduling scheme since this is one of the most commonly used strategies for practical real-time applications. Specifically, we first develop an approach that takes into consideration not only the execution time variations with cache allocations but also the task period relationship, showing a significant improvement in the feasibility of the system. We further study the problem of how to guarantee timing constraints for hard real-time systems under CPU and memory thermal constraints. We first study the problem under an architecture model with a single core and its main memory individually packaged. We develop a thermal model that can capture the thermal interaction between the processor and memory, and incorporate the periodic resource sever model into our scheduling framework to guarantee both the timing and thermal constraints. We further extend our research to the multi-core architectures with processing cores and memory devices integrated into a single 3D platform. To our best knowledge, this is the first research that can guarantee hard deadline constraints for real-time tasks under temperature constraints for both processing cores and memory devices. Extensive simulation results demonstrate that our proposed scheduling can improve significantly the feasibility of hard real-time systems under thermal constraints

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5 D, and 3D Processor-Memory Systems

Processing cores and the accompanying main memory working in tandem enable the modern processors. Dissipating heat produced from computation, memory access remains a significant problem for processors. Therefore, processor thermal management continues to be an active research topic. Most thermal management research takes place using simulations, given the challenges of measuring temperature in real processors. Since core and memory are fabricated on separate packages in most existing processors, with the memory having lower power densities, thermal management research in processors has primarily focused on the cores. Memory bandwidth limitations associated with 2D processors lead to high-density 2.5D and 3D packaging technology. 2.5D packaging places cores and memory on the same package. 3D packaging technology takes it further by stacking layers of memory on the top of cores themselves. Such packagings significantly increase the power density, making processors prone to heating. Therefore, mitigating thermal issues in high-density processors (packaged with stacked memory) becomes an even more pressing problem. However, given the lack of thermal modeling for memories in existing interval thermal simulation toolchains, they are unsuitable for studying thermal management for high-density processors. To address this issue, we present CoMeT, the first integrated Core and Memory interval Thermal simulation toolchain. CoMeT comprehensively supports thermal simulation of high- and low-density processors corresponding to four different core-memory configurations - off-chip DDR memory, off-chip 3D memory, 2.5D, and 3D. CoMeT supports several novel features that facilitate overlying system research. Compared to an equivalent state-of-the-art core-only toolchain, CoMeT adds only a ~5% simulation-time overhead. The source code of CoMeT has been made open for public use under the MIT license.Comment: https://github.com/marg-tools/CoMe

Exploiting heterogeneity in Chip-Multiprocessor Design

In the past decade, semiconductor manufacturers are persistent in building faster and smaller transistors in order to boost the processor performance as projected by Moore’s Law. Recently, as we enter the deep submicron regime, continuing the same processor development pace becomes an increasingly difficult issue due to constraints on power, temperature, and the scalability of transistors. To overcome these challenges, researchers propose several innovations at both architecture and device levels that are able to partially solve the problems. These diversities in processor architecture and manufacturing materials provide solutions to continuing Moore’s Law by effectively exploiting the heterogeneity, however, they also introduce a set of unprecedented challenges that have been rarely addressed in prior works. In this dissertation, we present a series of in-depth studies to comprehensively investigate the design and optimization of future multi-core and many-core platforms through exploiting heteroge-neities. First, we explore a large design space of heterogeneous chip multiprocessors by exploiting the architectural- and device-level heterogeneities, aiming to identify the optimal design patterns leading to attractive energy- and cost-efficiencies in the pre-silicon stage. After this high-level study, we pay specific attention to the architectural asymmetry, aiming at developing a heterogeneity-aware task scheduler to optimize the energy-efficiency on a given single-ISA heterogeneous multi-processor. An advanced statistical tool is employed to facilitate the algorithm development. In the third study, we shift our concentration to the device-level heterogeneity and propose to effectively leverage the advantages provided by different materials to solve the increasingly important reliability issue for future processors

An Artificial Neural Networks based Temperature Prediction Framework for Network-on-Chip based Multicore Platform

Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing issues with reliability, timing variations and reduced lifetime of the chips. Dynamic Thermal Management (DTM) is a solution to avoid high temperatures on the die. Typical DTM schemes only address core level thermal issues. However, the Network-on-chip (NoC) paradigm, which has emerged as an enabling methodology for integrating hundreds to thousands of cores on the same die can contribute significantly to the thermal issues. Moreover, the typical DTM is triggered reactively based on temperature measurements from on-chip thermal sensor requiring long reaction times whereas predictive DTM method estimates future temperature in advance, eliminating the chance of temperature overshoot. Artificial Neural Networks (ANNs) have been used in various domains for modeling and prediction with high accuracy due to its ability to learn and adapt. This thesis concentrates on designing an ANN prediction engine to predict the thermal profile of the cores and Network-on-Chip elements of the chip. This thermal profile of the chip is then used by the predictive DTM that combines both core level and network level DTM techniques. On-chip wireless interconnect which is recently envisioned to enable energy-efficient data exchange between cores in a multicore environment, will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM schemes

Hardware/Software Co-design for Multicore Architectures

Siirretty Doriast

Dynamic Thermal Management for Microprocessors

In deep submicron era, thermal hot spots and large temperature gradients significantly impact system reliability, performance, cost and leakage power. Dynamic thermal management techniques are designed to tackle the problems and control the chip temperature as well as power consumption. They refer to those techniques which enable the chip to autonomously modify the task execution and power dissipation characteristics so that lower-cost cooling solutions could be adopted while still guaranteeing safe temperature regulation. As long as the temperature is regulated, the system reliability can be improved, leakage power can be reduced and cooling system lifetime can be extended significantly. Multimedia applications are expected to form the largest portion of workload in general purpose PC and portable devices. The ever-increasing computation intensity of multimedia applications elevates the processor temperature and consequently impairs the reliability and performance of the system. In this thesis, we propose to perform dynamic thermal management using reinforcement learning algorithm for multimedia applications. The presented learning model does not need any prior knowledge of the workload information or the system thermal and power characteristics. It learns the temperature change and workload switching patterns by observing the temperature sensor and event counters on the processor, and finds the management policy that provides good performance-thermal tradeoff during the runtime. As the system complexity increases, it is more and more difficult to perform thermal management in a centralized manner because of state explosion and the overhead of monitoring the entire chip. In this thesis, we present a framework for distributed thermal management in many-core systems where balanced thermal profile can be achieved by proactive task migration among neighboring cores. The framework has a low cost agent residing in each core that observes the local workload and temperature and communicates with its nearest neighbor for task migration and exchange. By choosing only those migration requests that will result in balanced workload without generating thermal emergency, the presented framework maintains workload balance across the system and avoids unnecessary migration. Experimental results show that, our distributed management policy achieves almost the same performance as a global management policy when the tasks are initially randomly distributed. Compared with existing proactive task migration technique, our approach generates less hotspot, less migration overhead with negligible performance overhead. Temperature affects the leakage power and cooling power. In this thesis, we address the impact of task allocation on a processor\u27s leakage power and cooling fan power. Although the leakage power is determined by the average die temperature and the fan power is determined by the peak temperature, our analysis shows that the overall power can be minimized if a task allocation with minimum peak temperature is adopted together with an intelligent fan speed adjustment technique that finds the optimal tradeoff between fan power and leakage power. We further present a multi-agent distributed task migration technique that searches for the best task allocation during runtime. By choosing only those migration requests that will result chip maximum temperature reduction, the presented framework achieves large fan power savings as well as overall power reduction

Parallel architectures and runtime systems co-design for task-based programming models

The increasing parallelism levels in modern computing systems has extolled the need for a holistic vision when designing multiprocessor architectures taking in account the needs of the programming models and applications. Nowadays, system design consists of several layers on top of each other from the architecture up to the application software. Although this design allows to do a separation of concerns where it is possible to independently change layers due to a well-known interface between them, it is hampering future systems design as the Law of Moore reaches to an end. Current performance improvements on computer architecture are driven by the shrinkage of the transistor channel width, allowing faster and more power efficient chips to be made. However, technology is reaching physical limitations were the transistor size will not be able to be reduced furthermore and requires a change of paradigm in systems design. This thesis proposes to break this layered design, and advocates for a system where the architecture and the programming model runtime system are able to exchange information towards a common goal, improve performance and reduce power consumption. By making the architecture aware of runtime information such as a Task Dependency Graph (TDG) in the case of dataflow task-based programming models, it is possible to improve power consumption by exploiting the critical path of the graph. Moreover, the architecture can provide hardware support to create such a graph in order to reduce the runtime overheads and making possible the execution of fine-grained tasks to increase the available parallelism. Finally, the current status of inter-node communication primitives can be exposed to the runtime system in order to perform a more efficient communication scheduling, and also creates new opportunities of computation and communication overlap that were not possible before. An evaluation of the proposals introduced in this thesis is provided and a methodology to simulate and characterize the application behavior is also presented.El aumento del paralelismo proporcionado por los sistemas de cómputo modernos ha provocado la necesidad de una visión holística en el diseño de arquitecturas multiprocesador que tome en cuenta las necesidades de los modelos de programación y las aplicaciones. Hoy en día el diseño de los computadores consiste en diferentes capas de abstracción con una interfaz bien definida entre ellas. Las limitaciones de esta aproximación junto con el fin de la ley de Moore limitan el potencial de los futuros computadores. La mayoría de las mejoras actuales en el diseño de los computadores provienen fundamentalmente de la reducción del tamaño del canal del transistor, lo cual permite chips más rápidos y con un consumo eficiente sin apenas cambios fundamentales en el diseño de la arquitectura. Sin embargo, la tecnología actual está alcanzando limitaciones físicas donde no será posible reducir el tamaño de los transistores motivando así un cambio de paradigma en la construcción de los computadores. Esta tesis propone romper este diseño en capas y abogar por un sistema donde la arquitectura y el sistema de tiempo de ejecución del modelo de programación sean capaces de intercambiar información para alcanzar una meta común: La mejora del rendimiento y la reducción del consumo energético. Haciendo que la arquitectura sea consciente de la información disponible en el modelo de programación, como puede ser el grafo de dependencias entre tareas en los modelos de programación dataflow, es posible reducir el consumo energético explotando el camino critico del grafo. Además, la arquitectura puede proveer de soporte hardware para crear este grafo con el objetivo de reducir el overhead de construir este grado cuando la granularidad de las tareas es demasiado fina. Finalmente, el estado de las comunicaciones entre nodos puede ser expuesto al sistema de tiempo de ejecución para realizar una mejor planificación de las comunicaciones y creando nuevas oportunidades de solapamiento entre cómputo y comunicación que no eran posibles anteriormente. Esta tesis aporta una evaluación de todas estas propuestas, así como una metodología para simular y caracterizar el comportamiento de las aplicacionesPostprint (published version