Miniaturized Silicon Photodetectors

Silicon (Si) technologies provide an excellent platform for the design of microsystems where photonic and microelectronic functionalities are monolithically integrated on the same substrate. In recent years, a variety of passive and active Si photonic devices have been developed, and among them, photodetectors have attracted particular interest from the scientific community. Si photodiodes are typically designed to operate at visible wavelengths, but, unfortunately, their employment in the infrared (IR) range is limited due to the neglectable Si absorption over 1100 nm, even though the use of germanium (Ge) grown on Si has historically allowed operations to be extended up to 1550 nm. In recent years, significant progress has been achieved both by improving the performance of Si-based photodetectors in the visible range and by extending their operation to infrared wavelengths. Near-infrared (NIR) SiGe photodetectors have been demonstrated to have a “zero change” CMOS process flow, while the investigation of new effects and structures has shown that an all-Si approach could be a viable option to construct devices comparable with Ge technology. In addition, the capability to integrate new emerging 2D and 3D materials with Si, together with the capability of manufacturing devices at the nanometric scale, has led to the development of new device families with unexpected performance. Accordingly, this Special Issue of Micromachines seeks to showcase research papers, short communications, and review articles that show the most recent advances in the field of silicon photodetectors and their respective applications

Design and Characterization of CMOS/SOI Image Sensors

The design, operation, and characterization of CMOS imagers implemented using: 1) regular CMOS wafers with a 0.5-mum CMOS analog process; 2) regular CMOS wafers with a 0.35-mum CMOS analog process; and 3) silicon-on-insulator (SOI) wafers in conjunction with a 0.35-mum CMOS analog process, are discussed in this paper. The performances of the studied imagers are compared in terms of quantum efficiency, dark current, and optical bandwidth. It is found that there is strong dependence of quantum efficiency of the photodiodes on the architecture of the image sensor. The results of this paper are useful for designing and modeling CMOS/SOI image sensor

A 0.0016 mm(2) 0.64 nJ leakage-based CMOS temperature sensor

This paper presents a CMOS temperature sensor based on the thermal dependencies of the leakage currents targeting the 65 nm node. To compensate for the effect of process fluctuations, the proposed sensor realizes the ratio of two measures of the time it takes a capacitor to discharge through a transistor in the subthreshold regime. Furthermore, a novel charging mechanism for the capacitor is proposed to further increase the robustness against fabrication variability. The sensor, including digitization and interfacing, occupies 0.0016 mm2 and has an energy consumption of 47.7–633 pJ per sample. The resolution of the sensor is 0.28 °C, and the 3σ inaccuracy over the range 40–110 °C is 1.17 °C

CMOS Integrated Circuits for RF-powered Wireless Temperature Sensor

This dissertation presents original research contributions in the form of twelve scientific publications that represent advances related to RF-to-DC converters, reference circuits (voltage, current and frequency) and temperature sensors. The primary focus of this research was to design efficient and low power CMOS-based circuit components, which are useful in various blocks of an RF-powered wireless sensor node.  The RF-to-DC converter or rectifier converts RF energy into DC energy, which is utilized by the sensor node. In the implementation of a CMOS-based RF-to-DC converter, the threshold voltage of MOS transistors mainly affects the conversion efficiency. Hence, for the first part of this research, different threshold voltage compensation schemes were developed for the rectifiers. These schemes were divided into two parts; first, the use of the MOSFET body terminal biasing technique and second, the use of an auxiliary circuit to obtain threshold voltage compensation. In addition to these schemes, the use of an alternate signaling scheme for voltage multiplier configuration of differential input RF-harvesters has also been investigated.  A known absolute value of voltage or current is the most useful for an integrated circuit. Thus, the circuit which generates the absolute value of voltage or current is cited as the voltage or current reference circuit respectively. Hence, in the second part of the research, simple, low power and moderately accurate, voltage and current reference circuits were developed for the power management unit of the sensor node. Besides voltage and current reference circuits, a frequency reference circuit was also designed. The use of the frequency reference circuit is in the digital processing and timing functions of the sensor node.  In the final part of the research, temperature sensing was selected as an application for the sensor node. Here, voltage and current based sensor cores were developed to sense the temperature. A smart temperature sensor was designed by using the voltage cores to obtain temperature information in terms of the duty-cycle. Similarly, the temperature equivalent current was converted into the frequency to obtain a temperature equivalent output signal.  All these implementations were done by using two integrated circuits which were fabricated during the year 2013-14.