저 잡음 디지털 위상동기루프의 합성

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2014. 2. 정덕균.As a device scaling proceeds, Charge Pump PLL has been confronted by many design challenges. Especially, a leakage current in loop filter and reduced dynamic range due to a lower operating voltage make it difficult to adopt a conventional analog PLL architecture for a highly scaled technology. To solve these issues, All Digital PLL (ADPLL) has been widely studied recently. ADPLL mitigates a filter leakage and a reduced dynamic range issues by replacing the analog circuits with digital ones. However, it is still difficult to get a low jitter under low supply voltage. In this thesis, we propose a dual loop architecture to achieve a low jitter even with a low supply voltage. And bottom-up based multi-step TDC and DCO are proposed to meet both fine resolution and wide operation range. In the aspect of design methodology, ADPLL has relied on a full custom design method although ADPLL is fully described in HDL (Hardware Description Language). We propose a new cell based layout technique to automatically synthesize the whole circuit and layout. The test chip has no linearity degradation although it is fully synthesized using a commercially available auto P&R tool. We has implemented an all digital pixel clock generator using the proposed dual loop architecture and the cell based layout technique. The entire circuit is automatically synthesized using 28nm CMOS technology. And s-domain linear model is utilized to optimize the jitter of the dual-loop PLL. Test chip occupies 0.032mm2, and achieves a 15ps_rms integrated jitter although it has extremely low input reference clock of 100 kHz. The whole circuit operates at 1.0V and consumes only 3.1mW.Abstract i Lists of Figures vii Lists of Tables xiii 1. Introduction 1 1.1 Thesis Motivation and Organization 1 1.1.1 Motivation 1 1.1.2 Thesis Organization 2 1.2 PLL Design Issues in Scaled CMOS Technology 3 1.2.1 Low Supply Voltage 4 1.2.2 High Leakage Current 6 1.2.3 Device Reliability: NBTI, HCI, TDDB, EM 8 1.2.4 Mismatch due to Proximity Effects: WPE, STI 11 1.3 Overview of Clock Synthesizers 14 1.3.1 Dual Voltage Charge Pump PLL 14 1.3.2 DLL Based Edge Combining Clock Multiplier 16 1.3.3 Recirculation DLL 17 1.3.4 Reference Injected PLL 18 1.3.5 All Digital PLL 19 1.3.6 Flying Adder Clock Synthesizer 20 1.3.7 Dual Loop Hybrid PLL 21 1.3.8 Comparisons 23 2. Tutorial of ADPLL Design 25 2.1 Introduction 25 2.1.1 Motivation for a pure digital 25 2.1.2 Conversion to digital domain 26 2.2 Functional Blocks 26 2.2.1 TDC, and PFD/Charge Pump 26 2.2.2 Digital Loop Filter and Analog R/C Loop Filter 29 2.2.3 DCO and VCO 34 2.2.4 S-domain Model of the Whole Loop 34 2.2.5 ADPLL Loop Design Flow 36 2.3 S-domain Noise Model 41 2.3.1 Noise Transfer Functions 41 2.3.2 Quantization Noise due to Limited TDC Resolution 45 2.3.3 Quantization Noise due to Divider ΔΣ Noise 46 2.3.4 Quantization Noise due to Limited DCO Resolution 47 2.3.5 Quantization Noise due to DCO ΔΣ Dithering 48 2.3.6 Random Noise of DCO and Input Clock 50 2.3.7 Over-all Phase Noise 50 3. Synthesizable All Digital Pixel Clock PLL Design 53 3.1 Overview 53 3.1.1 Introduction of Pixel Clock PLL 53 3.1.1 Design Specifications 55 3.2 Proposed Architecture 60 3.2.1 All Digital Dual Loop PLL 60 3.2.2 2-step controlled TDC 61 3.2.3 3-step controlled DCO 64 3.2.4 Digital Loop Filter 76 3.3 S-domain Noise Model 78 3.4 Loop Parameter Optimization Based on the s-domain Model 85 3.5 RTL and Gate Level Circuit Design 88 3.5.1 Overview of the design flow 88 3.5.2 Behavioral Simulation and Gate level synthesis 89 3.5.1 Preventing a meta-stability 90 3.5.1 Reusable Coding Style 92 3.6 Layout Synthesis 94 3.6.1 Auto P&R 94 3.6.2 Design of Unit Cells 97 3.6.3 Linearity Degradation in Synthesized TDC 98 3.6.4 Linearity Degradation in Synthesized DCO 106 3.7 Experiment Results 109 3.7.1 DCO measurement 109 3.7.2 PLL measurement 113 3.8 Conclusions 117 A. Device Technology Scaling Trends 118 A.1. Motivation for Technology Scaling 118 A.2. Constant Field Scaling 120 A.3. Quasi Constant Voltage Scaling 123 A.4. Device Technology Trends in Real World 124 B. Spice Simulation Tip for a DCO 137 C. Phase Noise to Jitter Conversion 141 Bibliography 144 초록 151Docto

Towards Very Large Scale Analog (VLSA): Synthesizable Frequency Generation Circuits.

Driven by advancement in integrated circuit design and fabrication technologies, electronic systems have become ubiquitous. This has been enabled powerful digital design tools that continue to shrink the design cost, time-to-market, and the size of digital circuits. Similarly, the manufacturing cost has been constantly declining for the last four decades due to CMOS scaling. However, analog systems have struggled to keep up with the unprecedented scaling of digital circuits. Even today, the majority of the analog circuit blocks are custom designed, do not scale well, and require long design cycles. This thesis analyzes the factors responsible for the slow scaling of analog blocks, and presents a new design methodology that bridges the gap between traditional custom analog design and the modern digital design. The proposed methodology is utilized in implementation of the frequency generation circuits – traditionally considered analog systems. Prototypes covering two different applications were implemented. The first synthesized all-digital phase-locked loop was designed for 400-460 MHz MedRadio applications and was fabricated in a 65 nm CMOS process. The second prototype is an ultra-low power, near-threshold 187-500 kHz clock generator for energy harvesting/autonomous applications. Finally, a digitally-controlled oscillator frequency resolution enhancement technique is presented which allows reduction of quantization noise in ADPLLs without introducing spurs.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/109027/1/mufaisal_1.pd

Design of electronic systems for automotive sensor conditioning

This thesis deals with the development of sensor systems for automotive, mainly targeting the exploitation of the new generation of Micro Electro-Mechanical Sensors (MEMS), which achieve a dramatic reduction of area and power consumption but at the same time require more complexity in the sensor conditioning interface. Several issues concerning the development of automotive ASICs are presented, together with an overview of automotive electronics market and its main sensor applications. The state of the art for sensor interfaces design (the generic sensor interface concept), consists in sharing the same electronics among similar sensor applications, thus saving cost and time-to-market but also implementing a sub-optimal system with area and power overheads. A Platform Based Design methodology is proposed to overcome the limitations of generic sensor interfaces, by keeping the platform generality at the highest design layers and pursuing the maximum optimization and performances in the platform customization for a specific sensor. A complete design flow is presented (up to the ASIC implementation for gyro sensor conditioning), together with examples regarding IP development for reuse and low power optimization of third party designs. A further evolution of Platform Based Design has been achieved by means of implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform. ISIF is a highly programmable mixed-signal chip which allows a substantial reduction of design space exploration time, as it can implement in a short time a wide class of sensor conditioning architectures. Thus it lets the designers evaluate directly on silicon the impact of different architectural choices, as well as perform feasibility studies, sensor evaluations and accurate estimation of the resulting dedicated ASIC performances. Several case studies regarding fast prototyping possibilities with ISIF are presented: a magneto-resistive position sensor, a biosensor (which produces pA currents in presence of surface chemical reactions) and two capacitive inertial sensors, a gyro and a low-g YZ accelerometer. The accelerometer interface has also been implemented in miniboards of about 3 cm2 (with ISIF and sensor dies bonded together) and a series of automatic trimming and characterization procedures have been developed in order to evaluate sensor and interface behaviour over the automotive temperature range, providing a valuable feedback for the implementation of a dedicated accelerometer interface

Digital Centric Multi-Gigabit SerDes Design and Verification

Advances in semiconductor manufacturing still lead to ever decreasing feature sizes and constantly allow higher degrees of integration in application specific integrated circuits (ASICs). Therefore the bandwidth requirements on the external interfaces of such systems on chips (SoC) are steadily growing. Yet, as the number of pins on these ASICs is not increasing in the same pace - known as pin limitation - the bandwidth per pin has to be increased. SerDes (Serializer/Deserializer) technology, which allows to transfer data serially at very high data rates of 25Gbps and more is a key technology to overcome pin limitation and exploit the computing power that can be achieved in todays SoCs. As such SerDes blocks together with the digital logic interfacing them form complex mixed signal systems, verification of performance and functional correctness is very challenging. In this thesis a novel mixed-signal design methodology is proposed, which tightly couples model and implementation in order to ensure consistency throughout the design cycles and hereby accelerate the overall implementation flow. A tool flow that has been developed is presented, which integrates well into state of the art electronic design automation (EDA) environments and enables the usage of this methodology in practice. Further, the design space of todays high-speed serial links is analyzed and an architecture is proposed, which pushes complexity into the digital domain in order to achieve robustness, portability between manufacturing processes and scaling with advanced node technologies. The all digital phase locked loop (PLL) and clock data recovery (CDR), which have been developed are described in detail. The developed design flow was used for the implementation of the SerDes architecture in a 28nm silicon process and proved to be indispensable for future projects

A Low-Power Silicon-Photomultiplier Readout ASIC for the CALICE Analog Hadronic Calorimeter

The future e + e − collider experiments, such as the international linear collider, provide precise measurements of the heavy bosons and serve as excellent tests of the underlying fundamental physics. To reconstruct these bosons with an unprecedented resolution from their multi-jet final states, a detector system employing the particle flow approach has been proposed, requesting calorimeters with imaging capabilities. The analog hadron calorimeter based on the SiPM-on-tile technology is one of the highly granular candidates of the imaging calorimeters. To achieve the compactness, the silicon-photomultiplier (SiPM) readout electronics require a low-power monolithic solution. This thesis presents the design of such an application-specific integrated circuit (ASIC) for the charge and timing readout of the SiPMs. The ASIC provides precise charge measurement over a large dynamic range with auto-triggering and local zero-suppression functionalities. The charge and timing information are digitized using channel-wise analog-to-digital and time-to-digital converters, providing a fully integrated solution for the SiPM readout. Dedicated to the analog hadron calorimeter, the power-pulsing technique is applied to the full chip to meet the stringent power consumption requirement. This work also initializes the commissioning of the calorimeter layer with the use of the designed ASIC. An automatic calibration procedure has been developed to optimized the configuration settings for the chip. The new calorimeter base unit with the designed ASIC has been produced and its functionality has been tested

Fully Automated Radiation Hardened by Design Circuit Construction

abstract: A fully automated logic design methodology for radiation hardened by design (RHBD) high speed logic using fine grained triple modular redundancy (TMR) is presented. The hardening techniques used in the cell library are described and evaluated, with a focus on both layout techniques that mitigate total ionizing dose (TID) and latchup issues and flip-flop designs that mitigate single event transient (SET) and single event upset (SEU) issues. The base TMR self-correcting master-slave flip-flop is described and compared to more traditional hardening techniques. Additional refinements are presented, including testability features that disable the self-correction to allow detection of manufacturing defects. The circuit approach is validated for hardness using both heavy ion and proton broad beam testing. For synthesis and auto place and route, the methodology and circuits leverage commercial logic design automation tools. These tools are glued together with custom CAD tools designed to enable easy conversion of standard single redundant hardware description language (HDL) files into hardened TMR circuitry. The flow allows hardening of any synthesizable logic at clock frequencies comparable to unhardened designs and supports standard low-power techniques, e.g. clock gating and supply voltage scaling.Dissertation/ThesisPh.D. Electrical Engineering 201

Applications in Electronics Pervading Industry, Environment and Society

This book features the manuscripts accepted for the Special Issue “Applications in Electronics Pervading Industry, Environment and Society—Sensing Systems and Pervasive Intelligence” of the MDPI journal Sensors. Most of the papers come from a selection of the best papers of the 2019 edition of the “Applications in Electronics Pervading Industry, Environment and Society” (APPLEPIES) Conference, which was held in November 2019. All these papers have been significantly enhanced with novel experimental results. The papers give an overview of the trends in research and development activities concerning the pervasive application of electronics in industry, the environment, and society. The focus of these papers is on cyber physical systems (CPS), with research proposals for new sensor acquisition and ADC (analog to digital converter) methods, high-speed communication systems, cybersecurity, big data management, and data processing including emerging machine learning techniques. Physical implementation aspects are discussed as well as the trade-off found between functional performance and hardware/system costs

Toward Brain Area Sensor Wireless Network

RÉSUMÉ De nouvelles approches d'interfaçage neuronal de haute performance sont requises pour les interfaces cerveau-machine (BMI) actuelles. Cela nécessite des capacités d'enregistrement/stimulation performantes en termes de vitesse, qualité et quantité, c’est à dire une bande passante à fréquence plus élevée, une résolution spatiale, un signal sur bruit et une zone plus large pour l'interface avec le cortex cérébral. Dans ce mémoire, nous parlons de l'idée générale proposant une méthode d'interfaçage neuronal qui, en comparaison avec l'électroencéphalographie (EEG), l'électrocorticographie (ECoG) et les méthodes d'interfaçage intracortical conventionnelles à une seule unité, offre de meilleures caractéristiques pour implémenter des IMC plus performants. Les avantages de la nouvelle approche sont 1) une résolution spatiale plus élevée - en dessous dumillimètre, et une qualité de signal plus élevée - en termes de rapport signal sur bruit et de contenu fréquentiel - comparé aux méthodes EEG et ECoG; 2) un caractère moins invasif que l'ECoG où l'enlèvement du crâne sous une opération d'enregistrement / stimulation est nécessaire; 3) une plus grande faisabilité de la libre circulation du patient à l'étude - par rapport aux deux méthodes EEG et ECoG où de nombreux fils sont connectés au patient en cours d'opération; 4) une utilisation à long terme puisque l'interface implantable est sans fil - par rapport aux deux méthodes EEG et ECoG qui offrent des temps limités de fonctionnement. Nous présentons l'architecture d'un réseau sans fil de microsystèmes implantables, que nous appelons Brain Area Sensor NETwork (Brain-ASNET). Il y a deux défis principaux dans la réalisation du projet Brain-ASNET. 1) la conception et la mise en oeuvre d'un émetteur-récepteur RF de faible consommation compatible avec la puce de capteurs de réseau implantable, et, 2) la conception d'un protocole de réseau de capteurs sans fil (WSN) ad-hoc économe en énergie. Dans ce mémoire, nous présentons un protocole de réseau ad-hoc économe en énergie pour le réseau désiré, ainsi qu'un procédé pour surmonter le problème de la longueur de paquet variable causé par le processus de remplissage de bit dans le protocole HDLC standard. Le protocole adhoc proposé conçu pour Brain-ASNET présente une meilleure efficacité énergétique par rapport aux protocoles standards tels que ZigBee, Bluetooth et Wi-Fi ainsi que des protocoles ad-hoc de pointe. Le protocole a été conçu et testé par MATLAB et Simulink.----------ABSTRACT New high-performance neural interfacing approaches are demanded for today’s Brain-Machine Interfaces (BMI). This requires high-performance recording/stimulation capabilities in terms of speed, quality, and quantity, i.e. higher frequency bandwidth, spatial resolution, signal-to-noise, and wider area to interface with the cerebral cortex. In this thesis, we talk about the general proposed idea of a neural interfacing method which in comparison with Electroencephalography (EEG), Electrocorticography (ECoG), and, conventional Single-Unit Intracortical neural interfacing methods offers better features to implement higher-performance BMIs. The new approach advantages are 1) higher spatial resolution – down to sub-millimeter, and higher signal quality − in terms of signal-to-noise ratio and frequency content − compared to both EEG and ECoG methods. 2) being less invasive than ECoG where skull removal Under recording/stimulation surgery is required. 3) higher feasibility of freely movement of patient under study − compared to both EEG and ECoG methods where lots of wires are connected to the patient under operation. 4) long-term usage as the implantable interface is wireless − compared to both EEG and ECoG methods where it is practical for only a limited time under operation. We present the architecture of a wireless network of implantable microsystems, which we call it Brain Area Sensor NETwork (Brain-ASNET). There are two main challenges in realization of the proposed Brain-ASNET. 1) design and implementation of power-hungry RF transceiver of the implantable network sensors' chip, and, 2) design of an energy-efficient ad-hoc Wireless Sensor Network (WSN) protocol. In this thesis, we introduce an energy-efficient ad-hoc network protocol for the desired network, along with a method to overcome the issue of variable packet length caused by bit stuffing process in standard HDLC protocol. The proposed ad-hoc protocol designed for Brain-ASNET shows better energy-efficiency compared to standard protocols like ZigBee, Bluetooth, and Wi-Fi as well as state-of-the-art ad-hoc protocols. The protocol was designed and tested by MATLAB and Simulink