Shape and deformation measurement using heterodyne range imaging technology

Range imaging is emerging as a promising alternative technology for applications that require non-contact visual inspection of object deformation and shape. Previously, we presented a solid-state full-field heterodyne range imaging device capable of capturing three-dimensional images with sub-millimetre range resolution. Using a heterodyne indirect time-of-flight configuration, this system simultaneously measures distance (and intensity), for each pixel in a cameras field of view. In this paper we briefly describe our range imaging system, and its principle of operation. By performing measurements on several metal objects, we demonstrate the potential capabilities of this technology for surface profiling and deformation measurement. In addition to verifying system performance, the reported examples highlight some important system limitations. With these in mind we subsequently discuss the further developments required to enable the use of this device as a robust and practical tool in non-destructive testing and measurement applications

Service Knowledge Capture and Reuse

The keynote will start with the need for service knowledge capture and reuse for industrial product-service systems. A novel approach to capture the service damage knowledge about individual component will be presented with experimental results. The technique uses active thermography and image processing approaches for the assessment. The paper will also give an overview of other non-destructive inspection techniques for service damage assessment. A robotic system will be described to automate the damage image capture. The keynote will then propose ways to reuse the knowledge to predict remaining life of the component and feedback to design and manufacturing

Automated Optical Inspection and Image Analysis of Superconducting Radio-Frequency Cavities

The inner surface of superconducting cavities plays a crucial role to achieve highest accelerating fields and low losses. For an investigation of this inner surface of more than 100 cavities within the cavity fabrication for the European XFEL and the ILC HiGrade Research Project, an optical inspection robot OBACHT was constructed. To analyze up to 2325 images per cavity, an image processing and analysis code was developed and new variables to describe the cavity surface were obtained. The accuracy of this code is up to 97% and the PPV 99% within the resolution of 15.63 $\mu \mathrm{m}$. The optical obtained surface roughness is in agreement with standard profilometric methods. The image analysis algorithm identified and quantified vendor specific fabrication properties as the electron beam welding speed and the different surface roughness due to the different chemical treatments. In addition, a correlation of $\rho = -0.93$ with a significance of $6\,\sigma$ between an obtained surface variable and the maximal accelerating field was found

Index to 1981 NASA Tech Briefs, volume 6, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1981 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Index to 1984 NASA Tech Briefs, volume 9, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1984 Tech B Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Quality control for the first large areas of triple-GEM chambers for the CMS endcaps

The CMS Collaboration plans to equip the very forward muon system with triple-GEM detectors that can withstand the environment of the High-Luminosity LHC.This project is at the final stages of R&D and moving to production. A large area of several 100 m 2 are to be instrumented with GEM detectors which will be produced in six different sites around the world. A common construction and quality control procedure is required to ensure the performance of each detector.The quality control steps will include optical inspection,cleaning and baking of all materials and parts used to build the detector,leakage current tests of the GEM foils,high voltage tests,gas leak tests of the chambers and monitoring pressures time,gain calibration to know the optimal operation region of the detector,gain uniformity tests, and studying the efficiency,noise and tracking performance of the detectors in a cosmic stand using scintillator

The NASA SBIR product catalog

The purpose of this catalog is to assist small business firms in making the community aware of products emerging from their efforts in the Small Business Innovation Research (SBIR) program. It contains descriptions of some products that have advanced into Phase 3 and others that are identified as prospective products. Both lists of products in this catalog are based on information supplied by NASA SBIR contractors in responding to an invitation to be represented in this document. Generally, all products suggested by the small firms were included in order to meet the goals of information exchange for SBIR results. Of the 444 SBIR contractors NASA queried, 137 provided information on 219 products. The catalog presents the product information in the technology areas listed in the table of contents. Within each area, the products are listed in alphabetical order by product name and are given identifying numbers. Also included is an alphabetical listing of the companies that have products described. This listing cross-references the product list and provides information on the business activity of each firm. In addition, there are three indexes: one a list of firms by states, one that lists the products according to NASA Centers that managed the SBIR projects, and one that lists the products by the relevant Technical Topics utilized in NASA's annual program solicitation under which each SBIR project was selected

Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector

The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive between readout chips and circuit board is a silver epoxy glue as was used in the current ATLAS SemiConductor Tracker (SCT). This glue has several disadvantages, which motivated the search for an alternative. This paper presents a study concerning the use of six ultra-violet (UV) cure glues and a glue pad for use in the assembly of silicon strip detector modules for the ATLAS upgrade. Trials were carried out to determine the ease of use, the thermal conduction and shear strength, thermal cycling, radiation hardness, corrosion resistance and shear strength tests. These investigations led to the exclusion of three UV cure glues as well as the glue pad. Three UV cure glues were found to be possible better alternatives. Results from electrical tests of first prototype modules constructed using these glues are presented.Comment: 23 pages, to be published in Journal of Instrumentatio

Automated Eddy Current Inspection on Space Shuttle Hardware

Over the life time of the Space Shuttle program, metal parts used for the Reusable Solid Rocket Motors (RSRMs) have been nondestructively inspected for cracks and surface breaking discontinuities using magnetic particle (steel) and penetrant methods. Although these inspections adequately screened for critical sized cracks in most regions of the hardware, it became apparent after detection of several sub-critical flaws that the processes were very dependent on operator attentiveness and training. Throughout the 1990's, eddy current inspections were added to areas that had either limited visual access or were more fracture critical. In the late 1990's. a project was initiated to upgrade NDE inspections with the overall objective of improving inspection reliability and control. An automated eddy current inspection system was installed in 2001. A figure shows one of the inspection bays with the robotic axis of the system highlighted. The system was programmed to inspect the various case, nozzle, and igniter metal components that make up an RSRM. both steel and aluminum. For the past few years, the automated inspection system has been a part of the baseline inspection process for steel components. Although the majority of the RSRM metal part inventory ts free of detectable surface flaws, a few small, sub-critical manufacturing defects have been detected with the automated system. This paper will summarize the benefits that have been realized with the current automated eddy current system, as well as the flaws that have been detected