Digital Offset Calibration of an OPAMP Towards Improving Static Parameters of 90 nm CMOS DAC

In this paper, an on-chip self-calibrated 8-bit R-2R digital-to-analog converter (DAC) based on digitally compensated input offset of the operational amplifier (OPAMP) is presented. To improve the overall DAC performance, a digital offset cancellation method was used to compensate deviations in the input offset voltage of the OPAMP caused by process variations. The whole DAC as well as offset compensation circuitry were designed in a standard 90 nm CMOS process. The achieved results show that after the self-calibration process, the improvement of 48% in the value of DAC offset error is achieved

Noise shaping Asynchronous SAR ADC based time to digital converter

Time-to-digital converters (TDCs) are key elements for the digitization of timing information in modern mixed-signal circuits such as digital PLLs, DLLs, ADCs, and on-chip jitter-monitoring circuits. Especially, high-resolution TDCs are increasingly employed in on-chip timing tests, such as jitter and clock skew measurements, as advanced fabrication technologies allow fine on-chip time resolutions. Its main purpose is to quantize the time interval of a pulse signal or the time interval between the rising edges of two clock signals. Similarly to ADCs, the performance of TDCs are also primarily characterized by Resolution, Sampling Rate, FOM, SNDR, Dynamic Range and DNL/INL. This work proposes and demonstrates 2nd order noise shaping Asynchronous SAR ADC based TDC architecture with highest resolution of 0.25 ps among current state of art designs with respect to post-layout simulation results. This circuit is a combination of low power/High Resolution 2nd Order Noise Shaped Asynchronous SAR ADC backend with simple Time to Amplitude converter (TAC) front-end and is implemented in 40nm CMOS technology. Additionally, special emphasis is given on the discussion on various current state of art TDC architectures.Electrical and Computer Engineerin

Design of Energy-Efficient A/D Converters with Partial Embedded Equalization for High-Speed Wireline Receiver Applications

As the data rates of wireline communication links increases, channel impairments such as skin effect, dielectric loss, fiber dispersion, reflections and cross-talk become more pronounced. This warrants more interest in analog-to-digital converter (ADC)-based serial link receivers, as they allow for more complex and flexible back-end digital signal processing (DSP) relative to binary or mixed-signal receivers. Utilizing this back-end DSP allows for complex digital equalization and more bandwidth-efficient modulation schemes, while also displaying reduced process/voltage/temperature (PVT) sensitivity. Furthermore, these architectures offer straightforward design translation and can directly leverage the area and power scaling offered by new CMOS technology nodes. However, the power consumption of the ADC front-end and subsequent digital signal processing is a major issue. Embedding partial equalization inside the front-end ADC can potentially result in lowering the complexity of back-end DSP and/or decreasing the ADC resolution requirement, which results in a more energy-effcient receiver. This dissertation presents efficient implementations for multi-GS/s time-interleaved ADCs with partial embedded equalization. First prototype details a 6b 1.6GS/s ADC with a novel embedded redundant-cycle 1-tap DFE structure in 90nm CMOS. The other two prototypes explain more complex 6b 10GS/s ADCs with efficiently embedded feed-forward equalization (FFE) and decision feedback equalization (DFE) in 65nm CMOS. Leveraging a time-interleaved successive approximation ADC architecture, new structures for embedded DFE and FFE are proposed with low power/area overhead. Measurement results over FR4 channels verify the effectiveness of proposed embedded equalization schemes. The comparison of fabricated prototypes against state-of-the-art general-purpose ADCs at similar speed/resolution range shows comparable performances, while the proposed architectures include embedded equalization as well

Design and Characterization of 64K Pixels Chips Working in Single Photon Processing Mode

Progress in CMOS technology and in fine pitch bump bonding has made possible the development of high granularity single photon counting detectors for X-ray imaging. This thesis studies the design and characterization of three pulse processing chips with 65536 square pixels of 55 µm x 55 µm designed in a commercial 0.25 µm 6-metal CMOS technology. The 3 chips share the same architecture and dimensions and are named Medipix2, Mpix2MXR20 and Timepix. The Medipix2 chip is a pixel detector readout chip consisting of 256 x 256 identical elements, each working in single photon counting mode for positive or negative input charge signals. The preamplifier feedback provides compensation for detector leakage current on a pixel by pixel basis. Two identical pulse height discriminators are used to define an energy window. Every event falling inside the energy window is counted with a 13 bit pseudo-random counter. The counter logic, based in a shift register, also behaves as the input/output register for the pixel. Each cell also has an 8-bit configuration register which allows masking, test-enabling and 3-bit individual threshold adjust for each discriminator. The chip can be configured in serial mode and readout either serially or in parallel. Measurements show an electronic noise ~160 e- rms with a gain of ~9 mV/ke-. The threshold spread after equalization of ~120 e- rms brings the full chip minimum detectable charge to ~1100 e-. The analog static power consumption is ~8 µW per pixel with Vdda=2.2 V. The Mpix2MXR20 is an upgraded version of the Medipix2. The main changes in the pixel consist of: an improved tolerance to radiation, improved pixel to pixel threshold uniformity, and a 14-bit counter with overflow control. The chip periphery includes new threshold DACs with smaller step size, improved linearity, and better temperature dependence. Timepix is an evolution of the Mpix2MXR20 which provides independently in each pixel information of arrival time, time-over-threshold or event counting. Timepix uses as a time reference an external clock (Ref_Clk) up to 100 MHz which is distributed all over the pixel matrix during acquisition mode. The preamplifier is improved and there is a single discriminator with 4-bit threshold adjustment in order to reduce the minimum detectable charge limit. Measurements show an electrical noise ~100 e- rms and a gain of ~16.5 mV/ke-. The threshold spread after equalization of ~35 e- rms brings the full chip minimum detectable charge either to ~650 e- with a naked chip (i.e. gas detectors) or ~750 e- when bump-bonded to a detector. The pixel static power consumption is ~13.5 µW per pixel with Vdda=2.2 V and Ref_Clk=80 MHz. This family of chips have been used for a wide variety of applications. During these studies a number of limitations have come to light. Among those are limited energy resolution and surface area. Future developments, such as Medipix3, will aim to address those limitations by carefully exploiting developments in microelectronics

Digital Background Self-Calibration Technique for Compensating Transition Offsets in Reference-less Flash ADCs

This Dissertation focusses on proving that background calibration using adaptive algorithms are low-cost, stable and effective methods for obtaining high accuracy in flash A/D converters. An integrated reference-less 3-bit flash ADC circuit has been successfully designed and taped out in UMC 180 nm CMOS technology in order to prove the efficiency of our proposed background calibration. References for ADC transitions have been virtually implemented built-in in the comparators dynamic-latch topology by a controlled mismatch added to each comparator input front-end. An external very simple DAC block (calibration bank) allows control the quantity of mismatch added in each comparator front-end and, therefore, compensate the offset of its effective transition with respect to the nominal value. In order to assist to the estimation of the offset of the prototype comparators, an auxiliary A/D converter with higher resolution and lower conversion speed than the flash ADC is used: a 6-bit capacitive-DAC SAR type. Special care in synchronization of analogue sampling instant in both ADCs has been taken into account. In this thesis, a criterion to identify the optimum parameters of the flash ADC design with adaptive background calibration has been set. With this criterion, the best choice for dynamic latch architecture, calibration bank resolution and flash ADC resolution are selected. The performance of the calibration algorithm have been tested, providing great programmability to the digital processor that implements the algorithm, allowing to choose the algorithm limits, accuracy and quantization errors in the arithmetic. Further, systematic controlled offset can be forced in the comparators of the flash ADC in order to have a more exhaustive test of calibration

Design Techniques for High-Performance SAR A/D Converters

The design of electronics needs to account for the non-ideal characteristics of the device technologies used to realize practical circuits. This is particularly important in mixed analog-digital design since the best device technologies are very different for digital compared to analog circuits. One solution for this problem is to use a calibration correction approach to remove the errors introduced by devices, but this adds complexity and power dissipation, as well as reducing operation speed, and so must be optimised. This thesis addresses such an approach to improve the performance of certain types of analog-to-digital converter (ADC) used in advanced telecommunications, where speed, accuracy and power dissipation currently limit applications. The thesis specifically focuses on the design of compensation circuits for use in successive approximation register (SAR) ADCs. ADCs are crucial building blocks in communication systems, in general, and for mobile networks, in particular. The recently launched fifth generation of mobile networks (5G) has required new ADC circuit techniques to meet the higher speed and lower power dissipation requirements for 5G technology. The SAR has become one of the most favoured architectures for designing high-performance ADCs, but the successive nature of the circuit operation makes it difficult to reach ∼GS/s sampling rates at reasonable power consumption. Here, two calibration techniques for high-performance SAR ADCs are presented. The first uses an on-chip stochastic-based mismatch calibration technique that is able to accurately compute and compensate for the mismatch of a capacitive DAC in a SAR ADC. The stochastic nature of the proposed calibration method enables determination of the mismatch of the CAPDAC with a resolution much better than that of the DAC. This allows the unit capacitor to scale down to as low as 280aF for a 9-bit DAC. Since the CAP-DAC causes a large part of the overall dynamic power consumption and directly determines both the sizes of the driving and sampling switches and the size of the input capacitive load of the ADC and the kT/C noise power, a small CAP-DAC helps the power efficiency. To validate the proposed calibration idea, a 10-bit asynchronous SAR ADC was fabricated in 28-nm CMOS. Measurement results show that the proposed stochastic calibration improves the ADC’s SFDR and SNDR by 14.9 dB, 11.5 dB, respectively. After calibration, the fabricated SAR ADC achieves an ENOB of 9.14 bit at a sampling rate of 85 MS/s, resulting in a Walden FoM of 10.9 fJ/c-s. The second calibration technique is a timing-skew calibration for a time-interleaved (TI) SAR ADC that calibrates/computes the inter-channel timing and offset mismatch simultaneously. Simulation results show the effectiveness of this calibration method. When used together, the proposed mismatch calibration technique and the timing-skew calibration technique enables a TI SAR ADC to be designed that can achieve a sampling rate of ∼GS/s with 10-bit resolution and a power consumption as low as ∼10mW; specifications that satisfy the requirements of 5G technology

A Robust 96.6-dB-SNDR 50-kHz-Bandwidth Switched-Capacitor Delta-Sigma Modulator for IR Imagers in Space Instrumentation

Infrared imaging technology, used both to study deep-space bodies' radiation and environmental changes on Earth, experienced constant improvements in the last few years, pushing data converter designers to face new challenges in terms of speed, power consumption and robustness against extremely harsh operating conditions. This paper presents a 96.6-dB-SNDR (Signal-to-Noise-plus-Distortion Ratio) 50-kHz-bandwidth fourth-order single-bit switched-capacitor delta-sigma modulator for ADC operating at 1.8 V and consuming 7.9 mW fit for space instrumentation. The circuit features novel Class-AB single-stage switched variable-mirror amplifiers (SVMAs) enabling low-power operation, as well as low sensitivity to both process and temperature deviations for the whole modulator. The physical implementation resulted in a 1.8-mm 2 chip integrated in a standard 0.18-μm 1-poly-6-metal (1P6M) CMOS technology, and it reaches a 164.6-dB Schreier figure of merit from experimental SNDR measurements without making use of any clock bootstrapping, analog calibration, nor digital compensation technique. When coupled to a IR imager, the current design allows more than 50 frames per minute with a resolution of 16 effective number of bits (ENOB) while consuming less than 300 mW

High speed – energy efficient successive approximation analog to digital converter using tri-level switching

This thesis reports issues and design methods used to achieve high-speed and high-resolution Successive Approximation Register analog to digital converters (SAR ADCs). A major drawback of this technique relates to the mismatch in the binary ratios of capacitors which causes nonlinearity. Another issue is the use of large capacitors due to nonlinear effect of parasitic capacitance. Nonlinear effect of capacitor mismatch is investigated in this thesis. Based on the analysis, a new Tri-level switching algorithm is proposed to reduce the matching requirement for capacitors in SAR ADCs. The integral non-linearity (INL) and the differential non-linearity (DNL) of the proposed scheme are reduced by factor of two over conventional SAR ADC, which is the lowest compared to the previously reported schemes. In addition, the switching energy of the proposed scheme is reduced by 98.02% compared with the conventional SAR architecture. A new correction method to solve metastability error of comparator based on a novel design approach is proposed which reduces the required settling time about 1.1τ for each conversion cycle. Based on the above proposed methods two SAR ADCs: an 8-bit SAR ADC with 50MS/sec sampling rate, and a 10-bit SAR split ADC with 70 MS/sec sampling rate have been designed in 0.18μm Silterra complementary metal oxide semiconductor (CMOS) technology process which works at 1.2V supply voltage and input voltage of 2.4Vp-p. The 8-bit ADC digitizes 25MHz input signal with 48.16dB signal to noise and distortion ratio (SNDR) and 52.41dB spurious free dynamic range (SFDR) while consuming about 589μW. The figure of merit (FOM) of this ADC is 56.65 fJ/conv-step. The post layout of the 10-bit ADC with 1MHz input frequency produces SNDR, SFDR and effective number of bits (ENOB) of 57.1dB, 64.05dB and 9.17Bit, respectively, while its DNL and INL are -0.9/+2.8 least significant bit (LSB) and -2.5/+2.7 LSB, respectively. The total power consumption, including digital, analog and reference power, is 1.6mW. The FOM is 71.75fJ/conv. step

High-speed Time-interleaved Digital-to-Analog Converter (TI-DAC) for Self-Interference Cancellation Applications

Nowadays, the need for higher data-rate is constantly growing to enhance the quality of the daily communication services. The full-duplex (FD) communication is exemplary method doubling the data-rate compared to half-duplex one. However, part of the strong output signal of the transmitter interferes to the receiver-side because they share the same antenna with limited attenuation and, as a result, the receiver’s performance is corrupted. Hence, it is critical to remove the leakage signal from the receiver’s path by designing another block called self-interference cancellation (SIC). The main goal of this dissertation is to develop the SIC block embedded in the current-mode FD receivers. To this end, the regenerated cancellation current signal is fed to the inputs of the base-band filter and after the mixer of a (direct-conversion) current-mode FD receiver. Since the pattern of the transmitter (the digital signal generated by DSP) is known, a high-speed digital-to-Analog converter (DAC) with medium-resolution can perfectly suppress main part of the leakage on the receiver path. A capacitive DAC (CDAC) is chosen among the available solutions because it is compatible with advanced CMOS technology for high-speed application and the medium-resolution designs. Although the main application of the design is to perform the cancellation, it can also be employed as a stand-alone DAC in the Analog (I/Q) transmitter. The SIC circuitry includes a trans-impedance amplifier (TIA), two DACs, high-speed digital circuits, and built-in-self-test section (BIST). According to the available specification for full-duplex communication system, the resolution and working frequency of the CDAC are calculated (designed) equal to 10-bit (3 binary+ 2 binary + 5 thermometric) and 1GHz, respectively. In order to relax the design of the TIA (settling time of the DAC), the CDAC implements using 2-way time-interleaved (TI) manner (the effective SIC frequency equals 2GHz) without using any calibration technique. The CDAC is also developed with the split-capacitor technique to lower the negative effects of the conventional binary-weighted DAC. By adding one extra capacitor on the left-side of the split-capacitor, LSB-side, the value of the split-capacitor can be chosen as an integer value of the unit capacitor. As a result, it largely enhances the linearity of the CADC and cancellation performance. If the block works as a stand-alone DAC with non-TI mode, the digital input code representing a Sinus waveform with an amplitude 1dB less than full-scale and output frequency around 10.74MHz, chosen by coherent sampling rule, then the ENOB, SINAD, SFDR, and output signal are 9.4-bit, 58.2 dB, 68.4dBc, and -9dBV. The simulated value of the |DNL| (static linearity) is also less than 0.7. The similar simulation was done in the SIC mode while the capacitive-array woks in the TI mode and cancellation current is set to the full-scale. Hence, the amount of cancelling the SI signal at the output of the TIA, SNDR, SFDR, SNDRequ. equals 51.3dB, 15.1 dB, 24dBc, 66.4 dB. The designed SIC cannot work as a closed-loop design. The layout was optimally drawn in order to minimize non-linearity, the power-consumption of the decoders, and reduce the complexity of the DAC. By distributing the thermometric cells across the array and using symmetrical switching scheme, the DAC is less subjected to the linear and gradient effect of the oxide. Based on the post-layout simulation results, the deviation of the design after drawing the layout is studied. To compare the results of the schematic and post-layout designs, the exact conditions of simulation above (schematic simulations) are used. When the block works as a stand-alone CDAC, the ENOB, SINAD, SFDR are 8.5-bit, 52.6 dB, 61.3 dBc. The simulated value of the |DNL| (static linearity) is also limited to 1.3. Likewise, the SI signal at the output of the TIA, SNDR, SFDR, SNDRequ. are equal to 44dB, 11.7 dB, 19 dBc, 55.7 dB