2,912 research outputs found

    Thermal-Aware Networked Many-Core Systems

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    Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

    The Fifth NASA Symposium on VLSI Design

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    The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

    Efficient start-up of crystal oscillators

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    ASDTIC control and standardized interface circuits applied to buck, parallel and buck-boost dc to dc power converters

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    Versatile standardized pulse modulation nondissipatively regulated control signal processing circuits were applied to three most commonly used dc to dc power converter configurations: (1) the series switching buck-regulator, (2) the pulse modulated parallel inverter, and (3) the buck-boost converter. The unique control concept and the commonality of control functions for all switching regulators have resulted in improved static and dynamic performance and control circuit standardization. New power-circuit technology was also applied to enhance reliability and to achieve optimum weight and efficiency

    GaAs Implementation of FIR Filter

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    This thesis discusses the findings of the final year project involving Gallium Arsenide implementation of a triangular FIR filter to perform discrete wavelet transforms. The overall characteristics of Gallium Arsenide technology- its construction, behaviour and electrical charactersitics as they apply to VLSI technology - were investigated in this project. In depth understanding of its architecture is required to be able to understand the various design techniques employed. A comparison of Silicon and GaAs performance and other characteristics has also been made to fully justify the choice of this material for system implementation. A lot of research and active interest has gone into the field of image and video compression. Wavelet-based image transformation is one of the very efficient compression techniques used. An analysis of discrete wavelet transformations and the required triangular FIR filter was done to be able to produce a transform algorithm and the related filter architecture. Finally, the filter architecture was implemented as a VLSI design and layout. A variety of functional blocks required for the architecture were designed, tested and analysed. All these blocks were integrated to produce a model of a complete filter cell. The filter implementation was designed to be self-timed - without a system clock. Self-timed systems have considerable advantages over clocked architectures. Various design styles and handshaking mechanisms involved in designing a self-timed system were analysed and designed. There are many avenues still to explore. One of them is the VHDL analysis of filter architecture. Further development on this project would involve integration of higher-level logic and formation of a complete filter array

    Progress of analog-hybrid computation

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    Review of fast analog/hybrid computer systems, integrated operational amplifiers, electronic mode-control switches, digital attenuators, and packaging technique

    Computational structures for application specific VLSI processors

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    Delay-insensitive ternary logic (DITL)

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    This thesis focuses on development of a Single Rail Ternary Voltage Delay-Insensitive paradigm called Delay-Insensitive Ternary Logic (DITL), which is based on NULL Convention Logic (NCL). Single rail asynchronous logic has potential advantages over Dual-Rail logic such as reduction of Power and Interconnect as well as Logic Area. The DITL concept is developed in steps of individual circuit components. These components are designed at the transistor level and are connected together to form a registered pipeline system. Some variations in pipeline design are also investigated --Abstract, page iii
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