4 research outputs found
A RISC-V based medical implantable SOC for high voltage a current tissue stimulus
A RISC-V based System on Chip (SoC) for high voltage and current tissue stimulus, targeting implantable medical devices, is presented. The circuit is designed in a 0.18μm HV-CMOS process, including the RISC-V 32RVI based microcontroller core, called Siwa —which includes SPI, UART and GPIO interfaces, a packet-based bus and memory controller, and 8kB SRAM—, combined with several biological tissue stimulus and sensing circuits. The complete test chip (analog+RISC-V) occupies a 5mm2 area but only 0.82mm2 correspond to the RISCV micro-controller, which operates up to 20MHz, with average energy needs of less than 48 pJ/cycle (3pJ STD), and for which several reliability and safety issues were considered.Agencia Nacional de Investigación e Innovació
Advances in Solid State Circuit Technologies
This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields
Advanced modelling and design considerations for interconnects in ultra- low power digital system
PhD ThesisAs Very Large Scale Integration (VLSI) is progressing in very Deep
submicron (DSM) regime without decreasing chip area, the importance
of global interconnects increases but at the cost of
performance and power consumption for advanced System-on-
Chip (SoC)s. However, the growing complexity of interconnects
behaviour presents a challenge for their adequate modelling,
whereby conventional circuit theoretic approaches cannot provide
sufficient accuracy. During the last decades, fractional differential
calculus has been successfully applied to modelling
certain classes of dynamical systems while keeping complexity
of the models under acceptable bounds. For example, fractional
calculus can help capturing inherent physical effects in electrical
networks in a compact form, without following conventional
assumptions about linearization of non-linear interconnect components.
This thesis tackles the problem of interconnect modelling in
its generality to simulate a wide range of interconnection configurations,
its capacity to emulate irregular circuit elements
and its simplicity in the form of responsible approximation. This
includes modelling and analysing interconnections considering
their irregular components to add more flexibility and freedom
for design. The aim is to achieve the simplest adaptable model
with the highest possible accuracy. Thus, the proposed model
can be used for fast computer simulation of interconnection
behaviour. In addition, this thesis proposes a low power circuit
for driving a global interconnect at voltages close to the noise
level. As a result, the proposed circuit demonstrates a promising
solution to address the energy and performance issues related
to scaling effects on interconnects along with soft errors that
can be caused by neutron particles.
The major contributions of this thesis are twofold. Firstly, in
order to address Ultra-Low Power (ULP) design limitations, a novel
driver scheme has been configured. This scheme uses a bootstrap
circuitry which boosts the driver’s ability to drive a long
interconnect with an important feedback feature in it. Hence,
this approach achieves two objectives: improving performance
and mitigating power consumption. Those achievements are essential
in designing ULP circuits along with occupying a smaller
footprint and being immune to noise, observed in this design as
well. These have been verified by comparing the proposed design
to the previous and traditional circuits using a simulation tool.
Additionally, the boosting based approach has been shown beneficial
in mitigating the effects of single event upset (SEU)s, which
are known to affect DSM circuits working under low voltages.
Secondly, the CMOS circuit driving a distributed RLC load has
been brought in its analysis into the fractional order domain. This
model will make the on-chip interconnect structure easy to adjust
by including the effect of fractional orders on the interconnect
timing, which has not been considered before. A second-order
model for the transfer functions of the proposed general structure
is derived, keeping the complexity associated with second-order
models for this class of circuits at a minimum. The approach
here attaches an important trait of robustness to the circuit
design procedure; namely, by simply adjusting the fractional
order we can avoid modifying the circuit components. This can
also be used to optimise the estimation of the system’s delay
for a broad range of frequencies, particularly at the beginning
of the design flow, when computational speed is of paramount
importance.Iraqi Ministry of Higher Education
and Scientific Researc