Construction and commissioning of a technological prototype of a high-granularity semi-digital hadronic calorimeter

A large prototype of 1.3m3 was designed and built as a demonstrator of the semi-digital hadronic calorimeter (SDHCAL) concept proposed for the future ILC experiments. The prototype is a sampling hadronic calorimeter of 48 units. Each unit is built of an active layer made of 1m2 Glass Resistive Plate Chamber(GRPC) detector placed inside a cassette whose walls are made of stainless steel. The cassette contains also the electronics used to read out the GRPC detector. The lateral granularity of the active layer is provided by the electronics pick-up pads of 1cm2 each. The cassettes are inserted into a self-supporting mechanical structure built also of stainless steel plates which, with the cassettes walls, play the role of the absorber. The prototype was designed to be very compact and important efforts were made to minimize the number of services cables to optimize the efficiency of the Particle Flow Algorithm techniques to be used in the future ILC experiments. The different components of the SDHCAL prototype were studied individually and strict criteria were applied for the final selection of these components. Basic calibration procedures were performed after the prototype assembling. The prototype is the first of a series of new-generation detectors equipped with a power-pulsing mode intended to reduce the power consumption of this highly granular detector. A dedicated acquisition system was developed to deal with the output of more than 440000 electronics channels in both trigger and triggerless modes. After its completion in 2011, the prototype was commissioned using cosmic rays and particles beams at CERN.Comment: 49 pages, 41 figure

CMOS array design automation techniques

A low cost, quick turnaround technique for generating custom metal oxide semiconductor arrays using the standard cell approach was developed, implemented, tested and validated. Basic cell design topology and guidelines are defined based on an extensive analysis that includes circuit, layout, process, array topology and required performance considerations particularly high circuit speed

ATLAS liquid argon calorimeter front end electronics

The ATLAS detector has been designed for operation at CERN's Large Hadron Collider. ATLAS includes a complex system of liquid argon calorimeters. This paper describes the architecture and implementation of the system of custom front end electronics developed for the readout of the ATLAS liquid argon calorimeters

Physical Characteristics, Sensors and Applications of 2D/3DIntegrated CMOS Photodiodes

Two-dimensional photodiodes are reversely biased at a reasonable voltage whereas 3D photodiodes are likely operated at the Geiger mode. How to design integrated 2D and 3D photodiodes is investigated in terms of quantum efficiency, dark current, crosstalk, response time and so on. Beyond photodiodes, a charge supply mechanism provides a proper charge for a high dynamic range of 2D sensing, and a feedback pull-down mechanism expedites the response time of 3D sensing for time-of-flight applications. Particularly, rapid parallel reading at a 3D mode is developed by a bus-sharing mechanism. Using the TSMC 0.35μm 2P4M technology, a 2D/3D-integrated image sensor including P-diffusion_N-well_P-substrate photodiodes, pixel circuits, correlated double sampling circuits, sense amplifiers, a multi-channel time-to-digital converter, column/row decoders, bus-sharing connections/decoders, readout circuits and so on was implemented with a die size of 12mm×12mm. The proposed 2D/3D-integrated image sensor can perceive a 352×288-pixel 2D image and an 88×72-pixel 3D image with a dynamic range up to 100dB and a depth resolution of around 4cm, respectively. Therefore, our image sensor can effectively capture gray-level and depth information of a scene at the same location without additional alignment and post-processing. Finally, the currently available 2D and 3D image sensors are discussed and presented

A Scalable Correlator Architecture Based on Modular FPGA Hardware, Reuseable Gateware, and Data Packetization

A new generation of radio telescopes is achieving unprecedented levels of sensitivity and resolution, as well as increased agility and field-of-view, by employing high-performance digital signal processing hardware to phase and correlate large numbers of antennas. The computational demands of these imaging systems scale in proportion to BMN^2, where B is the signal bandwidth, M is the number of independent beams, and N is the number of antennas. The specifications of many new arrays lead to demands in excess of tens of PetaOps per second. To meet this challenge, we have developed a general purpose correlator architecture using standard 10-Gbit Ethernet switches to pass data between flexible hardware modules containing Field Programmable Gate Array (FPGA) chips. These chips are programmed using open-source signal processing libraries we have developed to be flexible, scalable, and chip-independent. This work reduces the time and cost of implementing a wide range of signal processing systems, with correlators foremost among them,and facilitates upgrading to new generations of processing technology. We present several correlator deployments, including a 16-antenna, 200-MHz bandwidth, 4-bit, full Stokes parameter application deployed on the Precision Array for Probing the Epoch of Reionization.Comment: Accepted to Publications of the Astronomy Society of the Pacific. 31 pages. v2: corrected typo, v3: corrected Fig. 1

High Peformance and Low Power On-Die Interconnect Fabrics.

Increasing power density with technology scaling has caused stagnation in operating frequency of modern day microprocessors. This has led designers to prefer multicore architectures over complex monolithic processors to keep up with the demand for rising computing throughput. Although processing units are getting smaller and simpler, the dramatic rise of their count on a single die has made the fabric that connects these processing units increasingly complex. These interconnect fabrics have become a bottleneck in improving overall system effciency. As a result, the design paradigm for multi-core chips is gradually shifting from a core-centric architecture towards an interconnect-centric architecture, where system efficiency is limited by the fabric rather than the processing ability of any individual core. This dissertation introduces three novel and synergistic circuit techniques to improve scalability of switch fabrics to make on-die integration of hundreds to thousands of cores feasible. 1) A matrix topology is proposed for designing a fully connected switch fabric that re-uses output buses for programming, and stores shue congurations at cross points. This significantly reduces routing congestion, lowers area/power, and improves per- formance. Silicon measurements demonstrate 47% energy savings in a 64-lane SIMD processor fabricated in 65nm CMOS over a conventional implementation. 2) A novel approach to handle high radix arbitration along with data routing is proposed. It optimally uses existing cross-bar interconnect resources without requiring any additional overhead. Bandwidth exceeding 2Tb/s is recorded in a test prototype fabricated in 65nm. 3) Building on the later, a new circuit topology to manage and update priority adaptively within the switch fabric without incurring additional delay or area is then proposed. Several assist circuit techniques, such as a thyristor based sense amplifier and self regenerating bi-directional repeaters are proposed for high speed energy efficient signaling to and from the switch fabric to improve overall routing efficiency. Using these techniques a 64 x 64 switch fabric with 128b data bus fabricated in 45nm achieves a throughput of 4.5Tb/s at single cycle latency while operating at 559MHz.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91506/1/sudhirks_1.pd

Low-swing signaling for energy efficient on-chip networks

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p. 65-69).On-chip networks have emerged as a scalable and high-bandwidth communication fabric in many-core processor chips. However, the energy consumption of these networks is becoming comparable to that of computation cores, making further scaling of core counts difficult. This thesis makes several contributions to low-swing signaling circuit design for the energy efficient on-chip networks in two separate projects: on-chip networks optimized for one-to-many multicasts and broadcasts, and link designs that allow on-chip networks to approach an ideal interconnection fabric. A low-swing crossbar switch, which is based on tri-state Reduced-Swing Drivers (RSDs), is presented for the first project. Measurement results of its test chip fabricated in 45nm SOI CMOS show that the tri-state RSD-based crossbar enables 55% power savings as compared to an equivalent full-swing crossbar and link. Also, the measurement results show that the proposed crossbar allows the broadcast-optimized on-chip networks using a single pipeline stage for physical data transmission to operate at 21% higher data rate, when compared with the full-swing networks. For the second project, two clockless low-swing repeaters, a Self-Resetting Logic Repeater (SRLR) and a Voltage-Locked Repeater (VLR), have been proposed and analyzed in simulation only. They both require no reference clock, differential signaling, and bias current. Such digital-intensive properties enable them to approach energy and delay performance of a point-to-point interconnect of variable lengths. Simulated in 45nm SOI CMOS, the 10mm SRLR featured with high energy efficiency consumes 338fJ/b at 5.4Gb/s/ch while the 10mm VLR raises its data rate up to 16.OGb/s/ch with 427fJ/b.by Sunghyun Park.S.M