16,353 research outputs found
Synthetic biology and microdevices : a powerful combination
Recent developments demonstrate that the combination of microbiology with micro-and nanoelectronics is a successful approach to develop new miniaturized sensing devices and other technologies. In the last decade, there has been a shift from the optimization of the abiotic components, for example, the chip, to the improvement of the processing capabilities of cells through genetic engineering. The synthetic biology approach will not only give rise to systems with new functionalities, but will also improve the robustness and speed of their response towards applied signals. To this end, the development of new genetic circuits has to be guided by computational design methods that enable to tune and optimize the circuit response. As the successful design of genetic circuits is highly dependent on the quality and reliability of its composing elements, intense characterization of standard biological parts will be crucial for an efficient rational design process in the development of new genetic circuits. Microengineered devices can thereby offer a new analytical approach for the study of complex biological parts and systems. By summarizing the recent techniques in creating new synthetic circuits and in integrating biology with microdevices, this review aims at emphasizing the power of combining synthetic biology with microfluidics and microelectronics
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Automatic synthesis of analog layout : a survey
A review of recent research in the automatic synthesis of physical geometry for analog integrated circuits is presented. On introduction, an explanation of the difficulties involved in analog layout as opposed to digital layout is covered. Review of the literature then follows. Emphasis is placed on the exposition of general methods for addressing problems specific to analog layout, with the details of specific systems only being given when they surve to illustrate these methods well. The conclusion discusses problems remaining and offers a prediction as to how technology will evolve to solve them. It is argued that although progress has been and will continue to be made in the automation of analog IC layout, due to fundamental differences in the nature of analog IC design as opposed to digital design, it should not be expected that the level of automation of the former will reach that of the latter any time soon
A Reuse-based framework for the design of analog and mixed-signal ICs
Despite the spectacular breakthroughs of the semiconductor industry, the ability to design integrated circuits (ICs) under stringent time-to-market (TTM) requirements is lagging behind integration capacity, so far keeping pace with still valid Moore's Law. The resulting gap is threatening with slowing down such a phenomenal growth. The design community believes that it is only by means of powerful CAD tools and design methodologies -and, possibly, a design paradigm shift-that this design gap can be bridged. In this sense, reuse-based design is seen as a promising solution, and concepts such as IP Block, Virtual Component, and Design Reuse have become commonplace thanks to the significant advances in the digital arena. Unfortunately, the very nature of analog and mixed-signal (AMS) design has hindered a similar level of consensus and development. This paper presents a framework for the reuse-based design of AMS circuits. The framework is founded on three key elements: (1) a CAD-supported hierarchical design flow that facilitates the incorporation of AMS reusable blocks, reduces the overall design time, and expedites the management of increasing AMS design complexity; (2) a complete, clear definition of the AMS reusable block, structured into three separate facets or views: the behavioral, structural, and layout facets, the two first for top-down electrical synthesis and bottom-up verification, the latter used during bottom-up physical synthesis; (3) the design for reusability set of tools, methods, and guidelines that, relying on intensive parameterization as well as on design knowledge capture and encapsulation, allows to produce fully reusable AMS blocks. A case study and a functional silicon prototype demonstrate the validity of the paper's proposals.Ministerio de Educación y Ciencia TEC2004-0175
Tensor Computation: A New Framework for High-Dimensional Problems in EDA
Many critical EDA problems suffer from the curse of dimensionality, i.e. the
very fast-scaling computational burden produced by large number of parameters
and/or unknown variables. This phenomenon may be caused by multiple spatial or
temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit
simulation), nonlinearity of devices and circuits, large number of design or
optimization parameters (e.g. full-chip routing/placement and circuit sizing),
or extensive process variations (e.g. variability/reliability analysis and
design for manufacturability). The computational challenges generated by such
high dimensional problems are generally hard to handle efficiently with
traditional EDA core algorithms that are based on matrix and vector
computation. This paper presents "tensor computation" as an alternative general
framework for the development of efficient EDA algorithms and tools. A tensor
is a high-dimensional generalization of a matrix and a vector, and is a natural
choice for both storing and solving efficiently high-dimensional EDA problems.
This paper gives a basic tutorial on tensors, demonstrates some recent examples
of EDA applications (e.g., nonlinear circuit modeling and high-dimensional
uncertainty quantification), and suggests further open EDA problems where the
use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and
System
Modeling of CMOS devices and circuits on flexible ultrathin chips
The field of flexible electronics is rapidly evolving. The ultrathin chips are being used to address the high-performance requirements of many applications. However, simulation and prediction of changes in response of device/circuit due to bending induced stress remains a challenge as of lack of suitable compact models. This makes circuit designing for bendable electronics a difficult task. This paper presents advances in this direction, through compressive and tensile stress studies on transistors and simple circuits such as inverters with different channel lengths and orientations of transistors on ultrathin chips. Different designs of devices and circuits in a standard CMOS 0.18-μm technology were fabricated in two separated chips. The two fabricated chips were thinned down to 20 μm using standard dicing-before-grinding technique steps followed by post-CMOS processing to obtain sufficient bendability (20-mm bending radius, or 0.05% nominal strain). Electrical characterization was performed by packaging the thinned chip on a flexible substrate. Experimental results show change of carrier mobilities in respective transistors, and switching threshold voltage of the inverters during different bending conditions (maximum percentage change of 2% for compressive and 4% for tensile stress). To simulate these changes, a compact model, which is a combination of mathematical equations and extracted parameters from BSIM4, has been developed in Verilog-A and compiled into Cadence Virtuoso environment. The proposed model predicts the mobility variations and threshold voltage in compressive and tensile bending stress conditions and orientations, and shows an agreement with the experimental measurements (1% for compressive and 0.6% for tensile stress mismatch)
Limits on Fundamental Limits to Computation
An indispensable part of our lives, computing has also become essential to
industries and governments. Steady improvements in computer hardware have been
supported by periodic doubling of transistor densities in integrated circuits
over the last fifty years. Such Moore scaling now requires increasingly heroic
efforts, stimulating research in alternative hardware and stirring controversy.
To help evaluate emerging technologies and enrich our understanding of
integrated-circuit scaling, we review fundamental limits to computation: in
manufacturing, energy, physical space, design and verification effort, and
algorithms. To outline what is achievable in principle and in practice, we
recall how some limits were circumvented, compare loose and tight limits. We
also point out that engineering difficulties encountered by emerging
technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl
Mathematical Estimation of Logical Masking Capability of Majority/Minority Gates Used in Nanoelectronic Circuits
In nanoelectronic circuit synthesis, the majority gate and the inverter form
the basic combinational logic primitives. This paper deduces the mathematical
formulae to estimate the logical masking capability of majority gates, which
are used extensively in nanoelectronic digital circuit synthesis. The
mathematical formulae derived to evaluate the logical masking capability of
majority gates holds well for minority gates, and a comparison with the logical
masking capability of conventional gates such as NOT, AND/NAND, OR/NOR, and
XOR/XNOR is provided. It is inferred from this research work that the logical
masking capability of majority/minority gates is similar to that of XOR/XNOR
gates, and with an increase of fan-in the logical masking capability of
majority/minority gates also increases
Innovative teaching of IC design and manufacture using the Superchip platform
In this paper we describe how an intelligent chip architecture has allowed a large cohort of undergraduate students to be given effective practical insight into IC design by designing and manufacturing their own ICs. To achieve this, an efficient chip architecture, the “Superchip”, has been developed, which allows multiple student designs to be fabricated on a single IC, and encapsulated in a standard package without excessive cost in terms of time or resources. We demonstrate how the practical process has been tightly coupled with theoretical aspects of the degree course and how transferable skills are incorporated into the design exercise. Furthermore, the students are introduced at an early stage to the key concepts of team working, exposure to real deadlines and collaborative report writing. This paper provides details of the teaching rationale, design exercise overview, design process, chip architecture and test regime
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