US Microelectronics Packaging Ecosystem: Challenges and Opportunities

The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.Comment: 22 pages, 8 figure

Addressing Manufacturing Challenges in NoC-based ULSI Designs

Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

Doctor of Philosophy in Computing

dissertationThe demand for main memory capacity has been increasing for many years and will continue to do so. In the past, Dynamic Random Access Memory (DRAM) process scaling has enabled this increase in memory capacity. Along with continued DRAM scaling, the emergence of new technologies like 3D-stacking, buffered Dual Inline Memory Modules (DIMMs), and crosspoint nonvolatile memory promise to continue this trend in the years ahead. However, these technologies will bring with them their own gamut of problems. In this dissertation, I look at the problems facing these technologies from a current delivery perspective. 3D-stacking increases memory capacity available per package, but the increased current requirement means that more pins on the package have to be now dedicated to provide Vdd/Vss, hence increasing cost. At the system level, using buffered DIMMs to increase the number of DRAM ranks increases the peak current requirements of the system if all the DRAM chips in the system are Refreshed simultaneously. Crosspoint memories promise to greatly increase bit densities but have long read latencies because of sneak currents in the cross-bar. In this dissertation, I provide architectural solutions to each of these problems. We observe that smart data placement by the architecture and the Operating System (OS) is a vital ingredient in all of these solutions. We thereby mitigate major bottlenecks in these technologies, hence enabling higher memory densities

R&D Paths of Pixel Detectors for Vertex Tracking and Radiation Imaging

This report reviews current trends in the R&D of semiconductor pixellated sensors for vertex tracking and radiation imaging. It identifies requirements of future HEP experiments at colliders, needed technological breakthroughs and highlights the relation to radiation detection and imaging applications in other fields of science.Comment: 17 pages, 2 figures, submitted to the European Strategy Preparatory Grou

Run-time management of many-core SoCs: A communication-centric approach

The single core performance hit the power and complexity limits in the beginning of this century, moving the industry towards the design of multi- and many-core system-on-chips (SoCs). The on-chip communication between the cores plays a criticalrole in the performance of these SoCs, with power dissipation, communication latency, scalability to many cores, and reliability against the transistor failures as the main design challenges. Accordingly, we dedicate this thesis to the communicationcentered management of the many-core SoCs, with the goal to advance the state-ofthe-art in addressing these challenges. To this end, we contribute to on-chip communication of many-core SoCs in three main directions. First, we start with a synthesizable SoC with full system simulation. We demonstrate the importance of the networking overhead in a practical system, and propose our sophisticated network interface (NI) that offloads the work from SW to HW. Our results show around 5x and up to 50x higher network performance, compared to previous works. As the second direction of this thesis, we study the significance of run-time application mapping. We demonstrate that contiguous application mapping not only improves the network latency (by 23%) and power dissipation (by 50%), but also improves the system throughput (by 3%) and quality-of-service (QoS) of soft real-time applications (up to 100x less deadline misses). Also our hierarchical run-time application mapping provides 99.41% successful mapping when up to 8 links are broken. As the final direction of the thesis, we propose a fault-tolerant routing algorithm, the maze-routing. It is the first-in-class algorithm that provides guaranteed delivery, a fully-distributed solution, low area overhead (by 16x), and instantaneous reconfiguration (vs. 40K cycles down time of previous works), all at the same time. Besides the individual goals of each contribution, when applicable, we ensure that our solutions scale to extreme network sizes like 12x12 and 16x16. This thesis concludes that the communication overhead and its optimization play a significant role in the performance of many-core SoC

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc