Digitally-Enhanced Software-Defined Radio Receiver Robust to Out-of-Band Interference

A software-defined radio (SDR) receiver with improved robustness to out-of-band interference (OBI) is presented. Two main challenges are identified for an OBI-robust SDR receiver: out-of-band nonlinearity and harmonic mixing. Voltage gain at RF is avoided, and instead realized at baseband in combination with low-pass filtering to mitigate blockers and improve out-of-band IIP3. Two alternative “iterative” harmonic-rejection (HR) techniques are presented to achieve high HR robust to mismatch: a) an analog two-stage polyphase HR concept, which enhances the HR to more than 60 dB; b) a digital adaptive interference cancelling (AIC) technique, which can suppress one dominating harmonic by at least 80 dB. An accurate multiphase clock generator is presented for a mismatch-robust HR. A proof-of-concept receiver is implemented in 65 nm CMOS. Measurements show 34 dB gain, 4 dB NF, and 3.5 dBm in-band IIP3 while the out-of-band IIP3 is + 16 dBm without fine tuning. The measured RF bandwidth is up to 6 GHz and the 8-phase LO works up to 0.9 GHz (master clock up to 7.2 GHz). At 0.8 GHz LO, the analog two-stage polyphase HR achieves a second to sixth order HR > dB over 40 chips, while the digital AIC technique achieves HR > 80 dB for the dominating harmonic. The total power consumption is 50 mA from a 1.2 V supply

Per-Core DVFS with Switched-Capacitor Converters for Energy Efficiency in Manycore Processors

Integrating multiple power converters on-chip improves energy efficiency of manycore architectures. Switched-capacitor (SC) dc-dc converters are compatible with conventional CMOS processes, but traditional implementations suffer from limited conversion efficiency. We propose a dynamic voltage and frequency scaling scheme with SC converters that achieves high converter efficiency by allowing the output voltage to ripple and having the processor core frequency track the ripple. Minimum core energy is achieved by hopping between different converter modes and tuning body-bias voltages. A multicore processor model based on a 28-nm technology shows conversion efficiencies of 90% along with over 25% improvement in the overall chip energy efficiency

STUDY OF FULLY-INTEGRATED LOW-DROPOUT REGULATORS

Department of Electrical EngineeringThis thesis focuses on the introduction of fully-integrated low-dropout regulators (LDOs). Recently, for the mobile and internet-of-things applications, the level of integration is getting higher. LDOs get popular in integrated circuit design including functions such as reducing switching ripples from high-efficiency regulators, cancelling spurs from other loads, and giving different supply voltages to loads. In accordance with load applications, choosing proper LDOs is important. LDOs can be classified by the types of power MOSEFT, the topologies of error amplifier, and the locations of dominant pole. Analog loads such as voltage-controlled oscillators and analog-to-digital converters need LDOs that have high power-supply-rejection-ratio (PSRR), high accuracy, and low noise. Digital loads such as DRAM and CPU need fast transient response, a wide range of load current providable LDOs. As an example, we present the design procedure of a fully-integrated LDO that obtains the desired PSRR. In analog LDOs, we discuss advanced techniques such as local positive feedback loop and zero path that can improve stability and PSRR performance. In digital LDOs, the techniques to improve transient response are introduced. In analog-digital hybrid LDOs, to achieve both fast transient and high PSRR performance in a fully-integrated chip, how to optimally combine analog and digital LDOs is considered based on the characteristics of each LDO type. The future work is extracted from the considerations and limitations of conventional techniques.clos

Combined Time and Information Redundancy for SEU-Tolerance in Energy-Efficient Real-Time Systems

Recently the trade-off between energy consumption and fault-tolerance in real-time systems has been highlighted. These works have focused on dynamic voltage scaling (DVS) to reduce dynamic energy dissipation and on time redundancy to achieve transient-fault tolerance. While the time redundancy technique exploits the available slack time to increase the fault-tolerance by performing recovery executions, DVS exploits slack time to save energy. Therefore we believe there is a resource conflict between the time-redundancy technique and DVS. The first aim of this paper is to propose the usage of information redundancy to solve this problem. We demonstrate through analytical and experimental studies that it is possible to achieve both higher transient fault-tolerance (tolerance to single event upsets (SEU)) and less energy using a combination of information and time redundancy when compared with using time redundancy alone. The second aim of this paper is to analyze the interplay of transient-fault tolerance (SEU-tolerance) and adaptive body biasing (ABB) used to reduce static leakage energy, which has not been addressed in previous studies. We show that the same technique (i.e. the combination of time and information redundancy) is applicable to ABB-enabled systems and provides more advantages than time redundancy alone

Using MCD-DVS for dynamic thermal management performance improvement

With chip temperature being a major hurdle in microprocessor design, techniques to recover the performance loss due to thermal emergency mechanisms are crucial in order to sustain performance growth. Many techniques for power reduction in the past and some on thermal management more recently have contributed to alleviate this problem. Probably the most important thermal control technique is dynamic voltage and frequency scaling (DVS) which allows for almost cubic reduction in power with worst-case performance penalty only linear. So far, DVS techniques for temperature control have been studied at the chip level. Finer grain DVS is feasible if a globally-asynchronous locally-synchronous (GALS) design style is employed. GALS, also known as multiple-clock domain (MCD), allows for an independent voltage and frequency control for each one of the clock domains that are part of the chip. There are several studies on DVS for GALS that aim to improve energy and power efficiency but not temperature. This paper proposes and analyses the usage of DVS at the domain level to control temperature in a clustered MCD microarchitecture with the goal of improving the performance of applications that do not meet the thermal constraints imposed by the designers.Peer ReviewedPostprint (published version

DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

A 1.6 Gb/s, 3 mW CMOS receiver for optical communication

A 1.6 Gb/s receiver for optical communication has been designed and fabricated in a 0.25-μm CMOS process. This receiver has no transimpedance amplifier and uses the parasitic capacitor of the flip-chip bonded photodetector as an integrating element and resolves the data with a double-sampling technique. A simple feedback loop adjusts a bias current to the average optical signal, which essentially "AC couples" the input. The resulting receiver resolves an 11 μA input, dissipates 3 mW of power, occupies 80 μm x 50 μm of area and operates at over 1.6 Gb/s