A Flexible BCH decoder for Flash Memory Systems using Cascaded BCH codes

NAND ash memories are widely used in consumer electronics, such as tablets, personal computers, smartphones, and gaming systems. However, unlike other standard storage devices, these ash memories suffer from various random errors. In order to address these reliability issues, various error correction codes (ECC) are employed. Bose-Chaudhuri Hocquenghem (BCH) code is the most common ECC used to address the errors in modern ash memories. Because of the limitation of the realization of the BCH codes for more extensive error correction, the modern ash memory devices use Low-density parity-check (LDPC) codes for error correction scheme. The realization of the LDPC decoders have greater complexity than BCH decoders, so these ECC decoders are implemented within the ash memory device. This thesis analyzes the limitation imposed by the state of the art implementation of BCH decoders and proposes a cascaded BCH code to address these limitations. In order to support a variety of ash memory devices, there are three main challenges to be addressed for BCH decoders. First, the latency of the BCH decoders, in the case of no error scenario, should be less than 100us. Second, there should be flexibility in supporting different ECC block size; more precisely, the solution should be able to support 256, 512, 1024, and 2048 bytes of ECC block. Third, there should be flexibility in supporting different bit errors. A recent development with Graphical Processing Units (GPUs) has attracted many researchers to use GPUs for non-graphical implementation. These GPUs are used in many consumer electronics as part of the system on chip (SOC) configuration. In this thesis we studied the limitation imposed by different implementations (VLSI, GPU, and CPU) of BCH decoders, and we propose a cascaded BCH code implemented using a hybrid approach to overcome the limitations of the BCH codes. By splitting the implementation across VLSI and GPUs, we have shown in this thesis that this method can provide flexibility over the block size and the bit error to be corrected

Dependability Assessment of NAND Flash-memory for Mission-critical Applications

It is a matter of fact that NAND flash memory devices are well established in consumer market. However, it is not true that the same architectures adopted in the consumer market are suitable for mission critical applications like space. In fact, USB flash drives, digital cameras, MP3 players are usually adopted to store "less significant" data which are not changing frequently (e.g., MP3s, pictures, etc.). Therefore, in spite of NAND flash's drawbacks, a modest complexity is usually needed in the logic of commercial flash drives. On the other hand, mission critical applications have different reliability requirements from commercial scenarios. Moreover, they are usually playing in a hostile environment (e.g., the space) which contributes to worsen all the issues. We aim at providing practical valuable guidelines, comparisons and tradeoffs among the huge number of dimensions of fault tolerant methodologies for NAND flash applied to critical environments. We hope that such guidelines will be useful for our ongoing research and for all the interested reader

Proposal of an Adaptive Fault Tolerance Mechanism to Tolerate Intermittent Faults in RAM

[EN] Due to transistor shrinking, intermittent faults are a major concern in current digital systems. This work presents an adaptive fault tolerance mechanism based on error correction codes (ECC), able to modify its behavior when the error conditions change without increasing the redundancy. As a case example, we have designed a mechanism that can detect intermittent faults and swap from an initial generic ECC to a specific ECC capable of tolerating one intermittent fault. We have inserted the mechanism in the memory system of a 32-bit RISC processor and validated it by using VHDL simulation-based fault injection. We have used two (39, 32) codes: a single error correction-double error detection (SEC-DED) and a code developed by our research group, called EPB3932, capable of correcting single errors and double and triple adjacent errors that include a bit previously tagged as error-prone. The results of injecting transient, intermittent, and combinations of intermittent and transient faults show that the proposed mechanism works properly. As an example, the percentage of failures and latent errors is 0% when injecting a triple adjacent fault after an intermittent stuck-at fault. We have synthesized the adaptive fault tolerance mechanism proposed in two types of FPGAs: non-reconfigurable and partially reconfigurable. In both cases, the overhead introduced is affordable in terms of hardware, time and power consumption.This research was supported in part by the Spanish Government, project TIN2016-81,075-R, and by Primeros Proyectos de Investigacion (PAID-06-18), Vicerrectorado de Investigacion, Innovacion y Transferencia de la Universitat Politecnica de Valencia (UPV), project 20190032.Baraza Calvo, JC.; Gracia-Morán, J.; Saiz-Adalid, L.; Gil Tomás, DA.; Gil, P. (2020). Proposal of an Adaptive Fault Tolerance Mechanism to Tolerate Intermittent Faults in RAM. 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Dependability Assessment of NAND Flash-memory for Mission-critical Applications

It is a matter of fact that NAND flash memory devices are well established in consumer market. However, it is not true that the same architectures adopted in the consumer market are suitable for mission critical applications like space. In fact, USB flash drives, digital cameras, MP3 players are usually adopted to store "less significant" data which are not changing frequently (e.g., MP3s, pictures, etc.). Therefore, in spite of NAND flash’s drawbacks, a modest complexity is usually needed in the logic of commercial flash drives. On the other hand, mission critical applications have different reliability requirements from commercial scenarios. Moreover, they are usually playing in a hostile environment (e.g., the space) which contributes to worsen all the issues. We aim at providing practical valuable guidelines, comparisons and tradeoffs among the huge number of dimensions of fault tolerant methodologies for NAND flash applied to critical environments. We hope that such guidelines will be useful for our ongoing research and for all the interested readers

High-Performance Energy-Efficient and Reliable Design of Spin-Transfer Torque Magnetic Memory

In this dissertation new computing paradigms, architectures and design philosophy are proposed and evaluated for adopting the STT-MRAM technology as highly reliable, energy efficient and fast memory. For this purpose, a novel cross-layer framework from the cell-level all the way up to the system- and application-level has been developed. In these framework, the reliability issues are modeled accurately with appropriate fault models at different abstraction levels in order to analyze the overall failure rates of the entire memory and its Mean Time To Failure (MTTF) along with considering the temperature and process variation effects. Design-time, compile-time and run-time solutions have been provided to address the challenges associated with STT-MRAM. The effectiveness of the proposed solutions is demonstrated in extensive experiments that show significant improvements in comparison to state-of-the-art solutions, i.e. lower-power, higher-performance and more reliable STT-MRAM design

Flash Memory Devices

Flash memory devices have represented a breakthrough in storage since their inception in the mid-1980s, and innovation is still ongoing. The peculiarity of such technology is an inherent flexibility in terms of performance and integration density according to the architecture devised for integration. The NOR Flash technology is still the workhorse of many code storage applications in the embedded world, ranging from microcontrollers for automotive environment to IoT smart devices. Their usage is also forecasted to be fundamental in emerging AI edge scenario. On the contrary, when massive data storage is required, NAND Flash memories are necessary to have in a system. You can find NAND Flash in USB sticks, cards, but most of all in Solid-State Drives (SSDs). Since SSDs are extremely demanding in terms of storage capacity, they fueled a new wave of innovation, namely the 3D architecture. Today “3D” means that multiple layers of memory cells are manufactured within the same piece of silicon, easily reaching a terabit capacity. So far, Flash architectures have always been based on "floating gate," where the information is stored by injecting electrons in a piece of polysilicon surrounded by oxide. On the contrary, emerging concepts are based on "charge trap" cells. In summary, flash memory devices represent the largest landscape of storage devices, and we expect more advancements in the coming years. This will require a lot of innovation in process technology, materials, circuit design, flash management algorithms, Error Correction Code and, finally, system co-design for new applications such as AI and security enforcement