1,777 research outputs found
High Input/output Density Optoelectronic Probe Card For Wafer-level Test Of Electrical And Optical Interconnect Components, Methods Of Fabrication, And Methods Of Use
Optoelectronic probe cards, methods of fabrication, and methods of use, are disclosed. Briefly described, one exemplary embodiment includes an optoelectronic probe card adapted to test an electrical quality and an optical quality of an optoelectronic structure under test having electrical and optical components.Georgia Tech Research Corporatio
Devices Having Compliant Wafer-level Input/output Interconnections And Packages Using Pillars And Methods Of Fabrication Thereof
Devices having one or more of the following: an input/output (I/O) interconnect system, an optical I/O interconnect, an electrical I/O interconnect, a radio frequency I/O interconnect, are disclosed. A representative I/O interconnect system includes a first substrate and a second substrate. The first substrate includes a compliant pillar vertically extending from the first substrate. The compliant pillar is constructed of a first material. The second substrate includes a compliant socket adapted to receive the compliant pillar. The compliant socket is constructed of a second material.Georgia Tech Research Corporatio
Fully embedded optical and electrical interconnections in flexible foils
This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 μ m) VCSEL's and Photodiodes in layers of optical transparent material. These layers are sandwiched in between two Polyimide layers to get a flexible foil with a final stack thickness of 150 μ m. Optical waveguides are structured by photolithography in the optical layers and pluggable mirror components couple the light from the embedded opto-electronics in and out of the waveguides. Besides optical links and optoelectronic components, electrical circuitry is also embedded by means of embedded copper tracks and thinned down Integrated Circuits (20 μ m). Optical connection towards the outer world is realized by U-groove passive alignment coupling of optical fibers with the embedded waveguides
Optoelectronic devices and packaging for information photonics
This thesis studies optoelectronic devices and the integration of these components onto
optoelectronic multi chip modules (OE-MCMs) using a combination of packaging
techniques. For this project, (1×12) array photodetectors were developed using PIN
diodes with a GaAs/AlGaAs strained layer structure. The devices had a pitch of 250μm,
operated at a wavelength of 850nm. Optical characterisation experiments of two types
of detector arrays (shoe and ring) were successfully performed. Overall, the shoe
devices achieved more consistent results in comparison with ring diodes, i.e. lower dark
current and series resistance values. A decision was made to choose the shoe design for
implementation into the high speed systems demonstrator. The (1x12) VCSEL array
devices were the optical sources used in my research. This was an identical array at
250μm pitch configuration used in order to match the photodetector array. These
devices had a wavelength of 850nm. Optoelectronic testing of the VCSEL was
successfully conducted, which provided good beam profile analysis and I-V-P
measurements of the VCSEL array. This was then implemented into a simple
demonstrator system, where eye diagrams examined the systems performance and
characteristics of the full system and showed positive results.
An explanation was given of the following optoelectronic bonding techniques: Wire
bonding and flip chip bonding with its associated technologies, i.e. Solder, gold stud
bump and ACF. Also, technologies, such as ultrasonic flip chip bonding and gold
micro-post technology were looked into and discussed. Experimental work
implementing these methods on packaging the optoelectronic devices was successfully
conducted and described in detail. Packaging of the optoelectronic devices onto the OEMCM
was successfully performed. Electrical tests were successfully carried out on the
flip chip bonded VCSEL and Photodetector arrays. These results verified that the
devices attached on the MCM achieved good electrical performance and reliable
bonding. Finally, preliminary testing was conducted on the fully assembled OE-MCMs.
The aim was to initially power up the mixed signal chip (VCSEL driver), and then
observe the VCSEL output
Monolithic optical integrated control circuitry for GaAs MMIC-based phased arrays
Gallium arsenide (GaAs) monolithic microwave integrated circuits (MMIC's) show promise in phased-array antenna applications for future space communications systems. Their efficient usage will depend on the control of amplitude and phase signals for each MMIC element in the phased array and in the low-loss radiofrequency feed. For a phased array contining several MMIC elements a complex system is required to control and feed each element. The characteristics of GaAs MMIC's for 20/30-GHz phased-array systems are discussed. The optical/MMIC interface and the desired characteristics of optical integrated circuits (OIC's) for such an interface are described. Anticipated fabrication considerations for eventual full monolithic integration of optical integrated circuits with MMIC's on a GaAs substrate are presented
The Beginnings of Optoelectronic Integrated Circuits -— A Personal Perspective
The early work (1960s, 1970s) on Integrated Optics at the Bell Telephone Laboratories and at the California Institute of Technology (Caltech), with which the author was involved, is described from a personal perspective
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