Development and Simulation Assessment of Semiconductor Production System Enhancements for Fast Cycle Times

Long cycle times in semiconductor manufacturing represent an increasing challenge for the industry and lead to a growing need of break-through approaches to reduce it. Small lot sizes and the conversion of batch processes to mini-batch or single-wafer processes are widely regarded as a promising means for a step-wise cycle time reduction. Our analysis with discrete-event simulation and queueing theory shows that small lot size and the replacement of batch tools with mini-batch or single wafer tools are beneficial but lot size reduction lacks persuasive effectiveness if reduced by more than half. Because the results are not completely convincing, we develop a new semiconductor tool type that further reduces cycle time by lot streaming leveraging the lot size reduction efforts. We show that this combined approach can lead to a cycle time reduction of more than 80%

Entwicklung und Einführung von Produktionssteuerungsverbesserungen für die kundenorientierte Halbleiterfertigung

Production control in a semiconductor production facility is a very complex and timeconsuming task. Different demands regarding facility performance parameters are defined by customer and facility management. These requirements are usually opponents, and an efficient strategy is not simple to define. In semiconductor manufacturing, the available production control systems often use priorities to define the importance of each production lot. The production lots are ranked according to the defined priorities. This process is called dispatching. The priority allocation is carried out by special algorithms. In literature, a huge variety of different strategies and rules is available. For the semiconductor foundry business, there is a need for a very flexible and adaptable policy taking the facility state and the defined requirements into account. At our case the production processes are characterized by a low-volume high-mix product portfolio. This portfolio causes additional stability problems and performance lags. The unstable characteristic increases the influence of reasonable production control logic. This thesis offers a very flexible and adaptable production control policy. This policy is based on a detailed facility model with real-life production data. The data is extracted from a real high-mix low-volume semiconductor facility. The dispatching strategy combines several dispatching rules. Different requirements like line balance, throughput optimization and on-time delivery targets can be taken into account. An automated detailed facility model calculates a semi-optimal combination of the different dispatching rules under a defined objective function. The objective function includes different demands from the management and the customer. The optimization is realized by a genetic heuristic for a fast and efficient finding of a close-to-optimal solution. The strategy is evaluated with real-life production data. The analysis with the detailed facility model of this fab shows an average improvement of 5% to 8% for several facility performance parameters like cycle time per mask layer. Finally the approach is realized and applied at a typical high-mix low-volume semiconductor facility. The system realization bases on a JAVA implementation. This implementation includes common state-of-the-art technologies such as web services. The system replaces the older production control solution. Besides the dispatching algorithm, the production policy includes the possibility to skip several metrology operations under defined boundary conditions. In a real-life production process, not all metrology operations are necessary for each lot. The thesis evaluates the influence of the sampling mechanism to the production process. The solution is included into the system implementation as a framework to assign different sampling rules to different metrology operations. Evaluations show greater improvements at bottleneck situations. After the productive introduction and usage of both systems, the practical results are evaluated. The staff survey offers good acceptance and response to the system. Furthermore positive effects on the performance measures are visible. The implemented system became part of the daily tools of a real semiconductor facility.Produktionssteuerung im Bereich der kundenorientierten Halbleiterfertigung ist heutzutage eine sehr komplexe und zeitintensive Aufgabe. Verschiedene Anforderungen bezüglich der Fabrikperformance werden seitens der Kunden als auch des Fabrikmanagements definiert. Diese Anforderungen stehen oftmals in Konkurrenz. Dadurch ist eine effiziente Strategie zur Kompromissfindung nicht einfach zu definieren. Heutige Halbleiterfabriken mit ihren verfügbaren Produktionssteuerungssystemen nutzen oft prioritätsbasierte Lösungen zur Definition der Wichtigkeit eines jeden Produktionsloses. Anhand dieser Prioritäten werden die Produktionslose sortiert und bearbeitet. In der Literatur existiert eine große Bandbreite verschiedener Algorithmen. Im Bereich der kundenorientierten Halbleiterfertigung wird eine sehr flexible und anpassbare Strategie benötigt, die auch den aktuellen Fabrikzustand als auch die wechselnden Kundenanforderungen berücksichtigt. Dies gilt insbesondere für den hochvariablen geringvolumigen Produktionsfall. Diese Arbeit behandelt eine flexible Strategie für den hochvariablen Produktionsfall einer solchen Produktionsstätte. Der Algorithmus basiert auf einem detaillierten Fabriksimulationsmodell mit Rückgriff auf Realdaten. Neben synthetischen Testdaten wurde der Algorithmus auch anhand einer realen Fertigungsumgebung geprüft. Verschiedene Steuerungsregeln werden hierbei sinnvoll kombiniert und gewichtet. Wechselnde Anforderungen wie Linienbalance, Durchsatz oder Liefertermintreue können adressiert und optimiert werden. Mittels einer definierten Zielfunktion erlaubt die automatische Modellgenerierung eine Optimierung anhand des aktuellen Fabrikzustandes. Die Optimierung basiert auf einen genetischen Algorithmus für eine flexible und effiziente Lösungssuche. Die Strategie wurde mit Realdaten aus der Fertigung einer typischen hochvariablen geringvolumigen Halbleiterfertigung geprüft und analysiert. Die Analyse zeigt ein Verbesserungspotential von 5% bis 8% für die bekannten Performancekriterien wie Cycletime im Vergleich zu gewöhnlichen statischen Steuerungspolitiken. Eine prototypische Implementierung realisiert diesen Ansatz zur Nutzung in der realen Fabrikumgebung. Die Implementierung basiert auf der JAVA-Programmiersprache. Aktuelle Implementierungsmethoden erlauben den flexiblen Einsatz in der Produktionsumgebung. Neben der Fabriksteuerung wurde die Möglichkeit der Reduktion von Messoperationszeit (auch bekannt unter Sampling) unter gegebenen Randbedingungen einer hochvariablen geringvolumigen Fertigung untersucht und geprüft. Oftmals ist aufgrund stabiler Prozesse in der Fertigung die Messung aller Lose an einem bestimmten Produktionsschritt nicht notwendig. Diese Arbeit untersucht den Einfluss dieses gängigen Verfahrens aus der Massenfertigung für die spezielle geringvolumige Produktionsumgebung. Die Analysen zeigen insbesondere in Ausnahmesituationen wie Anlagenausfällen und Kapazitätsengpässe einen positiven Effekt, während der Einfluss unter normalen Produktionsbedingungen aufgrund der hohen Produktvariabilität als gering angesehen werden kann. Nach produktiver Einführung in einem typischen Vertreter dieser Halbleiterfabriken zeigten sich schnell positive Effekte auf die Fabrikperformance als auch eine breite Nutzerakzeptanz. Das implementierte System wurde Bestandteil der täglichen genutzten Werkzeuglandschaft an diesem Standort

Analysis of production control methods for semiconductor research and development fabs using simulation

The importance of semiconductor device fabrication has been rising steadily over many years. Integrated circuit technology and innovation depends on successful research and development (R&D). R&D establishes the direction for prevailing technology in electronics and computers. To be a leader in the semiconductor industry, a company must bring technology to the market as soon as its application is deemed feasible. Using suitable production control methods for wafer fabrication in R&D fabs ensures reduction in cycle times and planned inventories, which in turn help to more quickly, transfer the new technology to the production fabs, where products are made on a commercial scale. This helps to minimize the time to market. The complex behavior of research fabs produces varying results when conventional production control methodologies are applied. Simulation modeling allows the study of the behavior of the research fab by providing statistical reports on performance measures. The goal of this research is to investigate production control methods in semiconductor R&D fabs. A representative R&D fab is modeled, where an appropriate production load is applied to the fab by using a representative product load. Simulation models are run with different levels of production volume, lot priorities, primary and secondary dispatching strategies and due date tightness as treatment combinations in a formally designed experiment. Fab performance is evaluated based on four performance measures, which include percent on time delivery, average cycle time, standard deviation of cycle time and average work-in-process. Statistical analyses are used to determine the best performing dispatching rules for given fab operating scenarios. Results indicate that the optimal combination of dispatching rules is dependent on specific fab characteristics. However, several dispatching rules are found to be robust across performance measures. A simulation study of the Semiconductor & Microsystems Fabrication Laboratory (SMFL) at the Rochester Institute of Technology (RIT) is used to verify the results

Production Scheduling

Generally speaking, scheduling is the procedure of mapping a set of tasks or jobs (studied objects) to a set of target resources efficiently. More specifically, as a part of a larger planning and scheduling process, production scheduling is essential for the proper functioning of a manufacturing enterprise. This book presents ten chapters divided into five sections. Section 1 discusses rescheduling strategies, policies, and methods for production scheduling. Section 2 presents two chapters about flow shop scheduling. Section 3 describes heuristic and metaheuristic methods for treating the scheduling problem in an efficient manner. In addition, two test cases are presented in Section 4. The first uses simulation, while the second shows a real implementation of a production scheduling system. Finally, Section 5 presents some modeling strategies for building production scheduling systems. This book will be of interest to those working in the decision-making branches of production, in various operational research areas, as well as computational methods design. People from a diverse background ranging from academia and research to those working in industry, can take advantage of this volume

Intelligent shop scheduling for semiconductor manufacturing

Semiconductor market sales have expanded massively to more than 200 billion dollars annually accompanied by increased pressure on the manufacturers to provide higher quality products at lower cost to remain competitive. Scheduling of semiconductor manufacturing is one of the keys to increasing productivity, however the complexity of manufacturing high capacity semiconductor devices and the cost considerations mean that it is impossible to experiment within the facility. There is an immense need for effective decision support models, characterizing and analyzing the manufacturing process, allowing the effect of changes in the production environment to be predicted in order to increase utilization and enhance system performance. Although many simulation models have been developed within semiconductor manufacturing very little research on the simulation of the photolithography process has been reported even though semiconductor manufacturers have recognized that the scheduling of photolithography is one of the most important and challenging tasks due to complex nature of the process. Traditional scheduling techniques and existing approaches show some benefits for solving small and medium sized, straightforward scheduling problems. However, they have had limited success in solving complex scheduling problems with stochastic elements in an economic timeframe. This thesis presents a new methodology combining advanced solution approaches such as simulation, artificial intelligence, system modeling and Taguchi methods, to schedule a photolithography toolset. A new structured approach was developed to effectively support building the simulation models. A single tool and complete toolset model were developed using this approach and shown to have less than 4% deviation from actual production values. The use of an intelligent scheduling agent for the toolset model shows an average of 15% improvement in simulated throughput time and is currently in use for scheduling the photolithography toolset in a manufacturing plant

Design and Management of Manufacturing Systems

Although the design and management of manufacturing systems have been explored in the literature for many years now, they still remain topical problems in the current scientific research. The changing market trends, globalization, the constant pressure to reduce production costs, and technical and technological progress make it necessary to search for new manufacturing methods and ways of organizing them, and to modify manufacturing system design paradigms. This book presents current research in different areas connected with the design and management of manufacturing systems and covers such subject areas as: methods supporting the design of manufacturing systems, methods of improving maintenance processes in companies, the design and improvement of manufacturing processes, the control of production processes in modern manufacturing systems production methods and techniques used in modern manufacturing systems and environmental aspects of production and their impact on the design and management of manufacturing systems. The wide range of research findings reported in this book confirms that the design of manufacturing systems is a complex problem and that the achievement of goals set for modern manufacturing systems requires interdisciplinary knowledge and the simultaneous design of the product, process and system, as well as the knowledge of modern manufacturing and organizational methods and techniques

Increasing experiment velocity in a production environment

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; and, (S.M.)--Massachusetts Institute of Technology, Sloan School of Management, June 1999."May 1999."Includes bibliographical references (p. 49).by Shafali Rastogi.S.M

Virtual metrology for plasma etch processes.

Plasma processes can present dicult control challenges due to time-varying dynamics and a lack of relevant and/or regular measurements. Virtual metrology (VM) is the use of mathematical models with accessible measurements from an operating process to estimate variables of interest. This thesis addresses the challenge of virtual metrology for plasma processes, with a particular focus on semiconductor plasma etch. Introductory material covering the essentials of plasma physics, plasma etching, plasma measurement techniques, and black-box modelling techniques is rst presented for readers not familiar with these subjects. A comprehensive literature review is then completed to detail the state of the art in modelling and VM research for plasma etch processes. To demonstrate the versatility of VM, a temperature monitoring system utilising a state-space model and Luenberger observer is designed for the variable specic impulse magnetoplasma rocket (VASIMR) engine, a plasma-based space propulsion system. The temperature monitoring system uses optical emission spectroscopy (OES) measurements from the VASIMR engine plasma to correct temperature estimates in the presence of modelling error and inaccurate initial conditions. Temperature estimates within 2% of the real values are achieved using this scheme. An extensive examination of the implementation of a wafer-to-wafer VM scheme to estimate plasma etch rate for an industrial plasma etch process is presented. The VM models estimate etch rate using measurements from the processing tool and a plasma impedance monitor (PIM). A selection of modelling techniques are considered for VM modelling, and Gaussian process regression (GPR) is applied for the rst time for VM of plasma etch rate. Models with global and local scope are compared, and modelling schemes that attempt to cater for the etch process dynamics are proposed. GPR-based windowed models produce the most accurate estimates, achieving mean absolute percentage errors (MAPEs) of approximately 1:15%. The consistency of the results presented suggests that this level of accuracy represents the best accuracy achievable for the plasma etch system at the current frequency of metrology. Finally, a real-time VM and model predictive control (MPC) scheme for control of plasma electron density in an industrial etch chamber is designed and tested. The VM scheme uses PIM measurements to estimate electron density in real time. A predictive functional control (PFC) scheme is implemented to cater for a time delay in the VM system. The controller achieves time constants of less than one second, no overshoot, and excellent disturbance rejection properties. The PFC scheme is further expanded by adapting the internal model in the controller in real time in response to changes in the process operating point

Virtual metrology for plasma etch processes.

Plasma processes can present dicult control challenges due to time-varying dynamics and a lack of relevant and/or regular measurements. Virtual metrology (VM) is the use of mathematical models with accessible measurements from an operating process to estimate variables of interest. This thesis addresses the challenge of virtual metrology for plasma processes, with a particular focus on semiconductor plasma etch. Introductory material covering the essentials of plasma physics, plasma etching, plasma measurement techniques, and black-box modelling techniques is rst presented for readers not familiar with these subjects. A comprehensive literature review is then completed to detail the state of the art in modelling and VM research for plasma etch processes. To demonstrate the versatility of VM, a temperature monitoring system utilising a state-space model and Luenberger observer is designed for the variable specic impulse magnetoplasma rocket (VASIMR) engine, a plasma-based space propulsion system. The temperature monitoring system uses optical emission spectroscopy (OES) measurements from the VASIMR engine plasma to correct temperature estimates in the presence of modelling error and inaccurate initial conditions. Temperature estimates within 2% of the real values are achieved using this scheme. An extensive examination of the implementation of a wafer-to-wafer VM scheme to estimate plasma etch rate for an industrial plasma etch process is presented. The VM models estimate etch rate using measurements from the processing tool and a plasma impedance monitor (PIM). A selection of modelling techniques are considered for VM modelling, and Gaussian process regression (GPR) is applied for the rst time for VM of plasma etch rate. Models with global and local scope are compared, and modelling schemes that attempt to cater for the etch process dynamics are proposed. GPR-based windowed models produce the most accurate estimates, achieving mean absolute percentage errors (MAPEs) of approximately 1:15%. The consistency of the results presented suggests that this level of accuracy represents the best accuracy achievable for the plasma etch system at the current frequency of metrology. Finally, a real-time VM and model predictive control (MPC) scheme for control of plasma electron density in an industrial etch chamber is designed and tested. The VM scheme uses PIM measurements to estimate electron density in real time. A predictive functional control (PFC) scheme is implemented to cater for a time delay in the VM system. The controller achieves time constants of less than one second, no overshoot, and excellent disturbance rejection properties. The PFC scheme is further expanded by adapting the internal model in the controller in real time in response to changes in the process operating point

Online Simulation in Semiconductor Manufacturing

In semiconductor manufacturing discrete event simulation systems are quite established to support multiple planning decisions. During the recent years, the productivity is increasing by using simulation methods. The motivation for this thesis is to use online simulation not only for planning decisions, but also for a wide range of operational decisions. Therefore an integrated online simulation system for short term forecasting has been developed. The production environment is a mature high mix logic wafer fab. It has been selected because of its vast potential for performance improvement. In this thesis several aspects of online simulation will be addressed: The first aspect is the implementation of an online simulation system in semiconductor manufacturing. The general problem is to achieve a high speed, a high level of detail, and a high forecast accuracy. To resolve these problems, an online simulation system has been created. The simulation model has a high level of detail. It is created automatically from underling fab data. To create such a simulation model from fab data, additional problems related to the underlying data arise. The major parts are the data access, the data integration, and the data quality. These problems have been solved by using an integrated data model with several data extraction, data transformation, and data cleaning steps. The second aspect is related to the accuracy of online simulation. The overall problem is to increase the forecast horizon, increase the level of detail of the forecast and reduce the forecast error. To provide useful forecast results, the simulation model contains a high level of modeling details and a proper initialization. The influences on the forecast quality will be analyzed. The results show that the simulation forecast accuracy achieves good quality to predict future fab performance. The last aspect is to find ways to use simulation forecast results to improve the fab performance. Numerous applications have been identified. For each application a description is available. It contains the requirements of such a forecast, the decision variables, and background information. An application example shows, where a performance problem exists and how online simulation is able to resolve it. To further enhance the real time capability of online simulation, a major part is to investigate new ways to connect the simulation model with the wafer fab. For fab driven simulation, the simulation model and the real wafer fab run concurrently. The wafer fab provides several events to update the simulation during runtime. So the model is always synchronized with the real fab. It becomes possible to start a simulation run in real time. There is no further delay for data extraction, data transformation and model creation. A prototype for a single work center has been implemented to show the feasibility