Accurately Modeling a Photonic NoC in a Detailed CMP Simulation Framework

© 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Photonic interconnects are a promising solution for the so-called communication bottleneck in current Chip Multiprocessor (CMPs) architectures. This technology presents an inherent low-latency and power consumption almost independent of communication distance, which are really desirable features in future Networks on Chip for next CMPs generations. However, since nanophotonic technology is still growing and therefore in an immature state, current simulators of detailed systems may not provide accurate models of photonic components. In this context, non-representative results are obtained when unaccurate photonic models are assumed. This paper summarizes all of the components that conform a fully operative photonic NoC and presents their current state of the art. Moreover, we evaluate a realistic photonic network that consists of two photonic rings and a token-based arbitration mechanism and compare it against a non-realistic model. In addition, both realistic and non-realistic schemes are valuated under different configurations varying the number of wavelengths that photonic waveguides employ. The experimental results show that the non-realistic NoC presents up 6× network latency deviation with respect to the accurate model. This deviation is translated into a performance deviation higher than 10% in several applications studied, which demonstrates the importance of accurate models when simulating current technologies under development like nanophotonics. Finally, a power consumption model of the realistic photonic network is presented. The results show that the overall photonic network power consumption grows with the number of wavelengths per waveguide since the number of required modulators and receivers becomes higher. In this way, the proposed realistic photonic network, which employs only two wavelengths for arbitration and destination selection tasks, increases its power consumption up to 3%, so network designs with more complex arbitration mechanisms must take into account the impact of the number of wavelengths on the power consumption.This work was supported by the Spanish Ministerio de Economía y Competitividad (MINECO) and by Plan E funds under Grant TIN2015-66972-C5-1-R and the ExaNest project, funded by the European Union’s Horizon 2020 research andinnovation programme under grant agreement No 671553.Puche Lara, J.; Lechago Buendía, S.; Petit Martí, SV.; Gómez Requena, ME.; Sahuquillo Borrás, J. (2016). Accurately Modeling a Photonic NoC in a Detailed CMP Simulation Framework. IEEE. https://doi.org/10.1109/HPCSim.2016.756836

Novel Cache Hierarchies with Photonic Interconnects for Chip Multiprocessors

[ES] Los procesadores multinúcleo actuales cuentan con recursos compartidos entre los diferentes núcleos. Dos de estos recursos compartidos, la cache de último nivel y el ancho de banda de memoria principal, pueden convertirse en cuellos de botella para el rendimiento. Además, con el crecimiento del número de núcleos que implementan los diseños más recientes, la red dentro del chip también se convierte en un cuello de botella que puede afectar negativamente al rendimiento, ya que las redes tradicionales pueden encontrar limitaciones a su escalabilidad en el futuro cercano. Prácticamente la totalidad de los diseños actuales implementan jerarquías de memoria que se comunican mediante rápidas redes de interconexión. Esta organización es eficaz dado que permite reducir el número de accesos que se realizan a memoria principal y la latencia media de acceso a memoria. Las caches, la red de interconexión y la memoria principal, conjuntamente con otras técnicas conocidas como la prebúsqueda, permiten reducir las enormes latencias de acceso a memoria principal, limitando así el impacto negativo ocasionado por la diferencia de rendimiento existente entre los núcleos de cómputo y la memoria. Sin embargo, compartir los recursos mencionados es fuente de diferentes problemas y retos, siendo uno de los principales el manejo de la interferencia entre aplicaciones. Hacer un uso eficiente de la jerarquía de memoria y las caches, así como contar con una red de interconexión apropiada, es necesario para sostener el crecimiento del rendimiento en los diseños tanto actuales como futuros. Esta tesis analiza y estudia los principales problemas e inconvenientes observados en estos dos recursos: la cache de último nivel y la red dentro del chip. En primer lugar, se estudia la escalabilidad de las tradicionales redes dentro del chip con topología de malla, así como esta puede verse comprometida en próximos diseños que cuenten con mayor número de núcleos. Los resultados de este estudio muestran que, a mayor número de núcleos, el impacto negativo de la distancia entre núcleos en la latencia puede afectar seriamente al rendimiento del procesador. Como solución a este problema, en esta tesis proponemos una de red de interconexión óptica modelada en un entorno de simulación detallado, que supone una solución viable a los problemas de escalabilidad observados en los diseños tradicionales. A continuación, esta tesis dedica un esfuerzo importante a identificar y proponer soluciones a los principales problemas de diseño de las jerarquías de memoria actuales como son, por ejemplo, el sobredimensionado del espacio de cache privado, la existencia de réplicas de datos y rigidez e incapacidad de adaptación de las estructuras de cache. Aunque bien conocidos, estos problemas y sus efectos adversos en el rendimiento pueden ser evitados en procesadores de alto rendimiento gracias a la enorme capacidad de la cache de último nivel que este tipo de procesadores típicamente implementan. Sin embargo, en procesadores de bajo consumo, no existe la posibilidad de contar con tales capacidades y hacer un uso eficiente del espacio disponible es crítico para mantener el rendimiento. Como solución a estos problemas en procesadores de bajo consumo, proponemos una novedosa organización de jerarquía de dos niveles cache que utiliza una red de interconexión óptica. Los resultados obtenidos muestran que, comparado con diseños convencionales, el consumo de energía estática en la arquitectura propuesta es un 60% menor, pese a que los resultados de rendimiento presentan valores similares. Por último, hemos extendido la arquitectura propuesta para dar soporte tanto a aplicaciones paralelas como secuenciales. Los resultados obtenidos con la esta nueva arquitectura muestran un ahorro de hasta el 78 % de energía estática en la ejecución de aplicaciones paralelas.[CA] Els processadors multinucli actuals compten amb recursos compartits entre els diferents nuclis. Dos d'aquests recursos compartits, la memòria d’últim nivell i l'ample de banda de memòria principal, poden convertir-se en colls d'ampolla per al rendiment. A mes, amb el creixement del nombre de nuclis que implementen els dissenys mes recents, la xarxa dins del xip també es converteix en un coll d'ampolla que pot afectar negativament el rendiment, ja que les xarxes tradicionals poden trobar limitacions a la seva escalabilitat en el futur proper. Pràcticament la totalitat dels dissenys actuals implementen jerarquies de memòria que es comuniquen mitjançant rapides xarxes d’interconnexió. Aquesta organització es eficaç ates que permet reduir el nombre d'accessos que es realitzen a memòria principal i la latència mitjana d’accés a memòria. Les caches, la xarxa d’interconnexió i la memòria principal, conjuntament amb altres tècniques conegudes com la prebúsqueda, permeten reduir les enormes latències d’accés a memòria principal, limitant així l'impacte negatiu ocasionat per la diferencia de rendiment existent entre els nuclis de còmput i la memòria. No obstant això, compartir els recursos esmentats és font de diversos problemes i reptes, sent un dels principals la gestió de la interferència entre aplicacions. Fer un us eficient de la jerarquia de memòria i les caches, així com comptar amb una xarxa d’interconnexió apropiada, es necessari per sostenir el creixement del rendiment en els dissenys tant actuals com futurs. Aquesta tesi analitza i estudia els principals problemes i inconvenients observats en aquests dos recursos: la memòria cache d’últim nivell i la xarxa dins del xip. En primer lloc, s'estudia l'escalabilitat de les xarxes tradicionals dins del xip amb topologia de malla, així com aquesta es pot veure compromesa en propers dissenys que compten amb major nombre de nuclis. Els resultats d'aquest estudi mostren que, a major nombre de nuclis, l'impacte negatiu de la distància entre nuclis en la latència pot afectar seriosament al rendiment del processador. Com a solució' a aquest problema, en aquesta tesi proposem una xarxa d’interconnexió' òptica modelada en un entorn de simulació detallat, que suposa una solució viable als problemes d'escalabilitat observats en els dissenys tradicionals. A continuació, aquesta tesi dedica un esforç important a identificar i proposar solucions als principals problemes de disseny de les jerarquies de memòria actuals com son, per exemple, el sobredimensionat de l'espai de memòria cache privat, l’existència de repliques de dades i la rigidesa i incapacitat d’adaptació' de les estructures de memòria cache. Encara que ben coneguts, aquests problemes i els seus efectes adversos en el rendiment poden ser evitats en processadors d'alt rendiment gracies a l'enorme capacitat de la memòria cache d’últim nivell que aquest tipus de processadors típicament implementen. No obstant això, en processadors de baix consum, no hi ha la possibilitat de comptar amb aquestes capacitats, i fer un us eficient de l'espai disponible es torna crític per mantenir el rendiment. Com a solució a aquests problemes en processadors de baix consum, proposem una nova organització de jerarquia de dos nivells de memòria cache que utilitza una xarxa d’interconnexió òptica. Els resultats obtinguts mostren que, comparat amb dissenys convencionals, el consum d'energia estàtica en l'arquitectura proposada és un 60% menor, malgrat que els resultats de rendiment presenten valors similars. Per últim, hem estes l'arquitectura proposada per donar suport tant a aplicacions paral·leles com seqüencials. Els resultats obtinguts amb aquesta nova arquitectura mostren un estalvi de fins al 78 % d'energia estàtica en l’execució d'aplicacions paral·leles.[EN] Current multicores face the challenge of sharing resources among the different processor cores. Two main shared resources act as major performance bottlenecks in current designs: the off-chip main memory bandwidth and the last level cache. Additionally, as the core count grows, the network on-chip is also becoming a potential performance bottleneck, since traditional designs may find scalability issues in the near future. Memory hierarchies communicated through fast interconnects are implemented in almost every current design as they reduce the number of off-chip accesses and the overall latency, respectively. Main memory, caches, and interconnection resources, together with other widely-used techniques like prefetching, help alleviate the huge memory access latencies and limit the impact of the core-memory speed gap. However, sharing these resources brings several concerns, being one of the most challenging the management of the inter-application interference. Since almost every running application needs to access to main memory, all of them are exposed to interference from other co-runners in their way to the memory controller. For this reason, making an efficient use of the available cache space, together with achieving fast and scalable interconnects, is critical to sustain the performance in current and future designs. This dissertation analyzes and addresses the most important shortcomings of two major shared resources: the Last Level Cache (LLC) and the Network on Chip (NoC). First, we study the scalability of both electrical and optical NoCs for future multicoresand many-cores. To perform this study, we model optical interconnects in a cycle-accurate multicore simulation framework. A proper model is required; otherwise, important performance deviations may be observed otherwise in the evaluation results. The study reveals that, as the core count grows, the effect of distance on the end-to-end latency can negatively impact on the processor performance. In contrast, the study also shows that silicon nanophotonics are a viable solution to solve the mentioned latency problems. This dissertation is also motivated by important design concerns related to current memory hierarchies, like the oversizing of private cache space, data replication overheads, and lack of flexibility regarding sharing of cache structures. These issues, which can be overcome in high performance processors by virtue of huge LLCs, can compromise performance in low power processors. To address these issues we propose a more efficient cache hierarchy organization that leverages optical interconnects. The proposed architecture is conceived as an optically interconnected two-level cache hierarchy composed of multiple cache modules that can be dynamically turned on and off independently. Experimental results show that, compared to conventional designs, static energy consumption is improved by up to 60% while achieving similar performance results. Finally, we extend the proposal to support both sequential and parallel applications. This extension is required since the proposal adapts to the dynamic cache space needs of the running applications, and multithreaded applications's behaviors widely differ from those of single threaded programs. In addition, coherence management is also addressed, which is challenging since each cache module can be assigned to any core at a given time in the proposed approach. For parallel applications, the evaluation shows that the proposal achieves up to 78% static energy savings. In summary, this thesis tackles major challenges originated by the sharing of on-chip caches and communication resources in current multicores, and proposes new cache hierarchy organizations leveraging optical interconnects to address them. The proposed organizations reduce both static and dynamic energy consumption compared to conventional approaches while achieving similar performance; which results in better energy efficiency.Puche Lara, J. (2021). Novel Cache Hierarchies with Photonic Interconnects for Chip Multiprocessors [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/165254TESI

DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling

With the advent of many-core chips that place substantial demand on the NoC, photonics has been investigated as a promising alternative to electrical NoCs. While numerous opto-electronic NoCs have been proposed, their evaluations tend to be based on fixed numbers for both photonic and electrical components, making it difficult to co-optimize. Through our own forays into opto-electronic NoC design, we observe that photonics and electronics are very much intertwined, reflecting a strong need for a NoC modeling tool that accurately models parameterized electronic and photonic components within a unified framework, capturing their interactions faithfully. In this paper, we present a tool, DSENT, for design space exploration of electrical and opto-electrical networks. We form a framework that constructs basic NoC building blocks from electrical and photonic technology parameters. To demonstrate potential use cases, we perform a network case study illustrating data-rate tradeoffs, a comparison with scaled electrical technology, and sensitivity to photonics parameters

An Artificial Neural Networks based Temperature Prediction Framework for Network-on-Chip based Multicore Platform

Continuous improvement in silicon process technologies has made possible the integration of hundreds of cores on a single chip. However, power and heat have become dominant constraints in designing these massive multicore chips causing issues with reliability, timing variations and reduced lifetime of the chips. Dynamic Thermal Management (DTM) is a solution to avoid high temperatures on the die. Typical DTM schemes only address core level thermal issues. However, the Network-on-chip (NoC) paradigm, which has emerged as an enabling methodology for integrating hundreds to thousands of cores on the same die can contribute significantly to the thermal issues. Moreover, the typical DTM is triggered reactively based on temperature measurements from on-chip thermal sensor requiring long reaction times whereas predictive DTM method estimates future temperature in advance, eliminating the chance of temperature overshoot. Artificial Neural Networks (ANNs) have been used in various domains for modeling and prediction with high accuracy due to its ability to learn and adapt. This thesis concentrates on designing an ANN prediction engine to predict the thermal profile of the cores and Network-on-Chip elements of the chip. This thermal profile of the chip is then used by the predictive DTM that combines both core level and network level DTM techniques. On-chip wireless interconnect which is recently envisioned to enable energy-efficient data exchange between cores in a multicore environment, will be used to provide a broadcast-capable medium to efficiently distribute thermal control messages to trigger and manage the DTM schemes

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Modeling a Photonic Network for Exascale Computing

Photonics technology has become a promising and viable alternative for both on-chip and off-chip computer networks of future Exascale systems. Nevertheless, this technology is not mature enough yet in this context, so research efforts focusing on photonic networks are still required to achieve realistic suitable network implementations. In this context, system-level photonic network simulators can help to guide designers to assess the multiple design choices. Most current research is done on electrical network simulators, whose components work widely different from photonics components. Moreover, photonics technology adds new components that are not present in electrical networks. This paper discusses how a photonics simulation tool can be built by extending an electrical simulation framework. We summarize and compare the working behavior of both technologies -electrical and photonics, and discuss the rationale behind the proposed extensions. Among others, the devised extensions model optical routers, wavelength-division multiplexing, circuit switching, and specific routing algorithms. This work is aimed to provide support to investigate off- chip optical networks in the context of the European Exascale System Interconnect and Storage project (ExaNeSt) project. The experiments presented in this paper study multiple realistic photonic networks configurations and have been performed with excerpts of real traces. Experimental results show that, compared to electrical networks, optical networks can reduce the execution time of the workload by several orders of magnitude. Our study reveals that future optical technologies presenting a 3.2 Tbps aggregate link bandwidth will not provide additional performance benefits over state-of-the-art 1.6 Tbps optical links across the studied workloads, but 1.6 Tbps network links are enough to achieve the highest optical performance on computer networks. Regarding the link configuration, the bandwidth per optical channel is the parameter with highest impact on the network delay and so on the execution time, while for a given optical bandwidth per channel the better strategy is to reduce the phit size.This work was supported by the ExaNest project, funded by the European Union’s Horizon 2020 research and innovation programme under grant agreement No 671553, and by the Spanish Ministerio de Economía y Competitividad (MINECO) and Plan E funds under Grant TIN2015-66972-C5-1-R.Duro Gómez, J.; Petit Martí, SV.; Sahuquillo Borrás, J.; Gómez Requena, ME. (2017). Modeling a Photonic Network for Exascale Computing. IEEE Computer Society. https://doi.org/10.1109/HPCS.2017.8

Temperature Evaluation of NoC Architectures and Dynamically Reconfigurable NoC

Advancements in the field of chip fabrication led to the integration of a large number of transistors in a small area, giving rise to the multi–core processor era. Massive multi–core processors facilitate innovation and research in the field of healthcare, defense, entertainment, meteorology and many others. Reduction in chip area and increase in the number of on–chip cores is accompanied by power and temperature issues. In high performance multi–core chips, power and heat are predominant constraints. High performance massive multicore systems suffer from thermal hotspots, exacerbating the problem of reliability in deep submicron technologies. High power consumption not only increases the chip temperature but also jeopardizes the integrity of the system. Hence, there is a need to explore holistic power and thermal optimization and management strategies for massive on–chip multi–core environments. In multi–core environments, the communication fabric plays a major role in deciding the efficiency of the system. In multi–core processor chips this communication infrastructure is predominantly a Network–on–Chip (NoC). Tradition NoC designs incorporate planar interconnects as a result these NoCs have long, multi–hop wireline links for data exchange. Due to the presence of multi–hop planar links such NoC architectures fall prey to high latency, significant power dissipation and temperature hotspots. Networks inspired from nature are envisioned as an enabling technology to achieve highly efficient and low power NoC designs. Adopting wireless technology in such architectures enhance their performance. Placement of wireless interconnects (WIs) alters the behavior of the network and hence a random deployment of WIs may not result in a thermally optimal solution. In such scenarios, the WIs being highly efficient would attract high traffic densities resulting in thermal hotspots. Hence, the location and utilization of the wireless links is a key factor in obtaining a thermal optimal highly efficient Network–on–chip. Optimization of the NoC framework alone is incapable of addressing the effects due to the runtime dynamics of the system. Minimal paths solely optimized for performance in the network may lead to excessive utilization of certain NoC components leading to thermal hotspots. Hence, architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance and energy–efficient multicore systems. This work contributes at exploring various wired and wireless NoC architectures that achieve best trade–offs between temperature, performance and energy–efficiency. It further proposes an adaptive routing scheme which factors in the thermal profile of the chip. The proposed routing mechanism dynamically reacts to the thermal profile of the chip and takes measures to avoid thermal hotspots, achieving a thermally efficient dynamically reconfigurable network on chip architecture

Overcoming the Challenges for Multichip Integration: A Wireless Interconnect Approach

The physical limitations in the area, power density, and yield restrict the scalability of the single-chip multicore system to a relatively small number of cores. Instead of having a large chip, aggregating multiple smaller chips can overcome these physical limitations. Combining multiple dies can be done either by stacking vertically or by placing side-by-side on the same substrate within a single package. However, in order to be widely accepted, both multichip integration techniques need to overcome significant challenges. In the horizontally integrated multichip system, traditional inter-chip I/O does not scale well with technology scaling due to limitations of the pitch. Moreover, to transfer data between cores or memory components from one chip to another, state-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the target chip over a wireline interconnect fabric. This multi-hop communication increases energy consumption while decreasing data bandwidth in a multichip system. On the other hand, in vertically integrated multichip system, the high power density resulting from the placement of computational components on top of each other aggravates the thermal issues of the chip leading to degraded performance and reduced reliability. Liquid cooling through microfluidic channels can provide cooling capabilities required for effective management of chip temperatures in vertical integration. However, to reduce the mechanical stresses and at the same time, to ensure temperature uniformity and adequate cooling competencies, the height and width of the microchannels need to be increased. This limits the area available to route Through-Silicon-Vias (TSVs) across the cooling layers and make the co-existence and co-design of TSVs and microchannels extreamly challenging. Research in recent years has demonstrated that on-chip and off-chip wireless interconnects are capable of establishing radio communications within as well as between multiple chips. The primary goal of this dissertation is to propose design principals targeting both horizontally and vertically integrated multichip system to provide high bandwidth, low latency, and energy efficient data communication by utilizing mm-wave wireless interconnects. The proposed solution has two parts: the first part proposes design methodology of a seamless hybrid wired and wireless interconnection network for the horizontally integrated multichip system to enable direct chip-to-chip communication between internal cores. Whereas the second part proposes a Wireless Network-on-Chip (WiNoC) architecture for the vertically integrated multichip system to realize data communication across interlayer microfluidic coolers eliminating the need to place and route signal TSVs through the cooling layers. The integration of wireless interconnect will significantly reduce the complexity of the co-design of TSV based interconnects and microchannel based interlayer cooling. Finally, this dissertation presents a combined trade-off evaluation of such wireless integration system in both horizontal and vertical sense and provides future directions for the design of the multichip system

Robust and Traffic Aware Medium Access Control Mechanisms for Energy-Efficient mm-Wave Wireless Network-on-Chip Architectures

To cater to the performance/watt needs, processors with multiple processing cores on the same chip have become the de-facto design choice. In such multicore systems, Network-on-Chip (NoC) serves as a communication infrastructure for data transfer among the cores on the chip. However, conventional metallic interconnect based NoCs are constrained by their long multi-hop latencies and high power consumption, limiting the performance gain in these systems. Among, different alternatives, due to the CMOS compatibility and energy-efficiency, low-latency wireless interconnect operating in the millimeter wave (mm-wave) band is nearer term solution to this multi-hop communication problem. This has led to the recent exploration of millimeter-wave (mm-wave) wireless technologies in wireless NoC architectures (WiNoC). To realize the mm-wave wireless interconnect in a WiNoC, a wireless interface (WI) equipped with on-chip antenna and transceiver circuit operating at 60GHz frequency range is integrated to the ports of some NoC switches. The WIs are also equipped with a medium access control (MAC) mechanism that ensures a collision free and energy-efficient communication among the WIs located at different parts on the chip. However, due to shrinking feature size and complex integration in CMOS technology, high-density chips like multicore systems are prone to manufacturing defects and dynamic faults during chip operation. Such failures can result in permanently broken wireless links or cause the MAC to malfunction in a WiNoC. Consequently, the energy-efficient communication through the wireless medium will be compromised. Furthermore, the energy efficiency in the wireless channel access is also dependent on the traffic pattern of the applications running on the multicore systems. Due to the bursty and self-similar nature of the NoC traffic patterns, the traffic demand of the WIs can vary both spatially and temporally. Ineffective management of such traffic variation of the WIs, limits the performance and energy benefits of the novel mm-wave interconnect technology. Hence, to utilize the full potential of the novel mm-wave interconnect technology in WiNoCs, design of a simple, fair, robust, and efficient MAC is of paramount importance. The main goal of this dissertation is to propose the design principles for robust and traffic-aware MAC mechanisms to provide high bandwidth, low latency, and energy-efficient data communication in mm-wave WiNoCs. The proposed solution has two parts. In the first part, we propose the cross-layer design methodology of robust WiNoC architecture that can minimize the effect of permanent failure of the wireless links and recover from transient failures caused by single event upsets (SEU). Then, in the second part, we present a traffic-aware MAC mechanism that can adjust the transmission slots of the WIs based on the traffic demand of the WIs. The proposed MAC is also robust against the failure of the wireless access mechanism. Finally, as future research directions, this idea of traffic awareness is extended throughout the whole NoC by enabling adaptiveness in both wired and wireless interconnection fabric

prediction Modeling for Design Space Exploration in Optical Network on Chip

In at least a decade chip multiprocessors (CMP) have been dominating new commercial releases due to computational advantages of parallel computing cores on a single chip. Network on Chip (NoC) has emerged as an interconnection network of CMPs. But significant bandwidth that is required for multicore chips is becoming a bottleneck in the traditional (electrical) network on chip, due to delays caused by long wires in the electric NoC. Integration of photonic links with traditional electronic interconnects proposes a promising solution for this challenge. Since there are numerous design parameters for opto-electrical network architectures, an accurate evaluation is needed to study the impact of each design parameter on network performance, and to provide the most suitable network for a given set of applications, a power or a performance goal. In this thesis, we present a prediction modeling technique for design space exploration of an opto-electrical network on chip. Our proposed model accurately predicts delay (includes network packet latency and network contention delay) and energy (includes static and dynamic energy consumption) of the network. Specifically, this work addresses the fundamental challenge of accurate estimation of desired metrics without having to incur high simulation cost of numerous configurations of the optical network on chip architecture. We reduce the number of required simulations by accurately selecting the parameters that have the most impact on the network. Furthermore, we sparsely and randomly sample the designs build using these parameters from an Optical Network on Chip (ONoC) design space, and simulate only the sampled designs. We validate our model with three different applications executing on a large set of network configurations in a large optical network on chip design space. We achieve average error rates (root relative squared error) as low as 5.5% for the delay and 3.05% for the energy consumption