Spread spectrum communication link using surface wave devices

A fast lock-up, 8-MHz bandwidth 8,000 bit per second data rate spread spectrum communication link breadboard is described that is implemented using surface wave devices as the primary signal generators and signal processing elements. It uses surface wave tapped delay lines in the transmitter to generate the signals and in the receiver to detect them. The breadboard provides a measured processing gain for Gaussian noise of 31.5 dB which is within one dB of the theoretical optimum. This development demonstrates that spread spectrum receivers implemented with surface wave devices have sensitivities and complexities comparable to those of serial correlation receivers, but synchronization search times which are two to three orders of magnitude smaller

A 0.1–5.0 GHz flexible SDR receiver with digitally assisted calibration in 65 nm CMOS

© 2017 Elsevier Ltd. All rights reserved.A 0.1–5.0 GHz flexible software-defined radio (SDR) receiver with digitally assisted calibration is presented, employing a zero-IF/low-IF reconfigurable architecture for both wideband and narrowband applications. The receiver composes of a main-path based on a current-mode mixer for low noise, a high linearity sub-path based on a voltage-mode passive mixer for out-of-band rejection, and a harmonic rejection (HR) path with vector gain calibration. A dual feedback LNA with “8” shape nested inductor structure, a cascode inverter-based TCA with miller feedback compensation, and a class-AB full differential Op-Amp with Miller feed-forward compensation and QFG technique are proposed. Digitally assisted calibration methods for HR, IIP2 and image rejection (IR) are presented to maintain high performance over PVT variations. The presented receiver is implemented in 65 nm CMOS with 5.4 mm2 core area, consuming 9.6–47.4 mA current under 1.2 V supply. The receiver main path is measured with +5 dB m/+5dBm IB-IIP3/OB-IIP3 and +61dBm IIP2. The sub-path achieves +10 dB m/+18dBm IB-IIP3/OB-IIP3 and +62dBm IIP2, as well as 10 dB RF filtering rejection at 10 MHz offset. The HR-path reaches +13 dB m/+14dBm IB-IIP3/OB-IIP3 and 62/66 dB 3rd/5th-order harmonic rejection with 30–40 dB improvement by the calibration. The measured sensitivity satisfies the requirements of DVB-H, LTE, 802.11 g, and ZigBee.Peer reviewedFinal Accepted Versio

Special arod system studies seventh quarterly report

Phase lock loop advanced circuits, and technical summary for Airborne Range and Orbit Determination /AROD/ syste

Optimum and suboptimum frequency demodulation

Optimum and suboptimum linear demodulators for telemetry communication syste

A neural probe with up to 966 electrodes and up to 384 configurable channels in 0.13 μm SOI CMOS

In vivo recording of neural action-potential and local-field-potential signals requires the use of high-resolution penetrating probes. Several international initiatives to better understand the brain are driving technology efforts towards maximizing the number of recording sites while minimizing the neural probe dimensions. We designed and fabricated (0.13-μm SOI Al CMOS) a 384-channel configurable neural probe for large-scale in vivo recording of neural signals. Up to 966 selectable active electrodes were integrated along an implantable shank (70 μm wide, 10 mm long, 20 μm thick), achieving a crosstalk of −64.4 dB. The probe base (5 × 9 mm2) implements dual-band recording and a 1

Basics of RF electronics

RF electronics deals with the generation, acquisition and manipulation of high-frequency signals. In particle accelerators signals of this kind are abundant, especially in the RF and beam diagnostics systems. In modern machines the complexity of the electronics assemblies dedicated to RF manipulation, beam diagnostics, and feedbacks is continuously increasing, following the demands for improvement of accelerator performance. However, these systems, and in particular their front-ends and back-ends, still rely on well-established basic hardware components and techniques, while down-converted and acquired signals are digitally processed exploiting the rapidly growing computational capability offered by the available technology. This lecture reviews the operational principles of the basic building blocks used for the treatment of high-frequency signals. Devices such as mixers, phase and amplitude detectors, modulators, filters, switches, directional couplers, oscillators, amplifiers, attenuators, and others are described in terms of equivalent circuits, scattering matrices, transfer functions; typical performance of commercially available models is presented. Owing to the breadth of the subject, this review is necessarily synthetic and non-exhaustive. Readers interested in the architecture of complete systems making use of the described components and devoted to generation and manipulation of the signals driving RF power plants and cavities may refer to the CAS lectures on Low-Level RF.Comment: 36 pages, contribution to the CAS - CERN Accelerator School: Specialised Course on RF for Accelerators; 8 - 17 Jun 2010, Ebeltoft, Denmar

Hardware for digitally controlled scanned probe microscopes

The design and implementation of a flexible and modular digital control and data acquisition system for scanned probe microscopes (SPMs) is presented. The measured performance of the system shows it to be capable of 14-bit data acquisition at a 100-kHz rate and a full 18-bit output resolution resulting in less than 0.02-Å rms position noise while maintaining a scan range in excess of 1 µm in both the X and Y dimensions. This level of performance achieves the goal of making the noise of the microscope control system an insignificant factor for most experiments. The adaptation of the system to various types of SPM experiments is discussed. Advances in audio electronics and digital signal processors have made the construction of such high performance systems possible at low cost

Analog IC Design at the University of Twente

This article describes some recent research results from the IC Design group of the University of Twente, located in Enschede, The Netherlands.\ud \ud Our research focuses on analog CMOS circuit design with emphasis on high frequency and broadband circuits. With the trend of system integration in mind, we try to develop new circuit techniques that enable the next steps in system integration in nanometer CMOS technology. Our research funding comes from industry, as well as from governmental organizations. We aim to find fundamental solutions for practical problems of integrated circuits realized in industrial Silicon technologies.\ud \ud CMOS IC technology is dictated by optimal cost and performance of digital circuits and is certainly not optimized for nice analog behavior. As analog designers, we do not have the illusion to be able to change the CMOS technology, so we have to "live with it" and solve the problems by design. In this article several examples will be shown, where problematic analog behavior, such as noise and distortion, can be tackled with new circuit design techniques. These circuit techniques are developed in such a way that they do benefit from the modern technology and thus enable further integration. This way we can improve various analog building blocks for wireless, wire-line and optical communication. Below some examples are given.\ud \u

A 90 nm CMOS 16 Gb/s Transceiver for Optical Interconnects

Interconnect architectures which leverage high-bandwidth optical channels offer a promising solution to address the increasing chip-to-chip I/O bandwidth demands. This paper describes a dense, high-speed, and low-power CMOS optical interconnect transceiver architecture. Vertical-cavity surface-emitting laser (VCSEL) data rate is extended for a given average current and corresponding reliability level with a four-tap current summing FIR transmitter. A low-voltage integrating and double-sampling optical receiver front-end provides adequate sensitivity in a power efficient manner by avoiding linear high-gain elements common in conventional transimpedance-amplifier (TIA) receivers. Clock recovery is performed with a dual-loop architecture which employs baud-rate phase detection and feedback interpolation to achieve reduced power consumption, while high-precision phase spacing is ensured at both the transmitter and receiver through adjustable delay clock buffers. A prototype chip fabricated in 1 V 90 nm CMOS achieves 16 Gb/s operation while consuming 129 mW and occupying 0.105 mm^2