Parts, materials, and processes experience summary, volume 2

This summary provides the general engineering community with the accumulated experience from ALERT reports issued by NASA and the Government-Industry. Data Exchange Program, and related experience gained by Government and industry. It provides expanded information on selected topics by relating the problem area (failure) to the cause, the investigation and findings, the suggestions for avoidance (inspections, screening tests, proper part applications, requirements for manufacturer's plant facilities, etc.), and failure analysis procedures. Diodes, integrated circuits, and transistors are covered in this volume

Apollo experience report guidance and control systems: Primary guidance, navigation, and control system development

The primary guidance, navigation, and control systems for both the lunar module and the command module are described. Development of the Apollo primary guidance systems is traced from adaptation of the Polaris Mark II system through evolution from Block I to Block II configurations; the discussion includes design concepts used, test and qualification programs performed, and major problems encountered. The major subsystems (inertial, computer, and optical) are covered. Separate sections on the inertial components (gyroscopes and accelerometers) are presented because these components represent a major contribution to the success of the primary guidance, navigation, and control system

Index to NASA Tech Briefs, 1975

This index contains abstracts and four indexes--subject, personal author, originating Center, and Tech Brief number--for 1975 Tech Briefs

Nonterrestrial utilization of materials: Automated space manufacturing facility

Four areas related to the nonterrestrial use of materials are included: (1) material resources needed for feedstock in an orbital manufacturing facility, (2) required initial components of a nonterrestrial manufacturing facility, (3) growth and productive capability of such a facility, and (4) automation and robotics requirements of the facility

Continuous maintenance and the future – Foundations and technological challenges

High value and long life products require continuous maintenance throughout their life cycle to achieve required performance with optimum through-life cost. This paper presents foundations and technologies required to offer the maintenance service. Component and system level degradation science, assessment and modelling along with life cycle ‘big data’ analytics are the two most important knowledge and skill base required for the continuous maintenance. Advanced computing and visualisation technologies will improve efficiency of the maintenance and reduce through-life cost of the product. Future of continuous maintenance within the Industry 4.0 context also identifies the role of IoT, standards and cyber security

The Development of Novel Interconnection Technologies for 3D Packaging of Wire Bondless Silicon Carbide Power Modules

This dissertation advances the cause for the 3D packaging and integration of silicon carbide power modules. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were investigated, and the concept for a novel SiC power module was discussed. This highly-integrated SiC power module was assessed for feasibility, with a focus on achieving ultralow parasitic inductances in the critical switching loops. This will enable higher switching frequencies, leading to a reduction in the size of the passive devices in the system and resulting in systems with lower weight and volume. The proposed concept yielded an order-of-magnitude reduction in system parasitics, alongside the possibility of a compact system integration. The technological barriers to realizing these concepts were identified, and solutions for novel interconnection schemes were proposed and evaluated. A novel sintered silver preform was developed to facilitate flip-chip interconnections for a bare-die power device while operating in a high ambient temperature. The preform was demonstrated to have 3.75× more bonding strength than a conventional sintered silver bond and passed rigorous thermal shock tests. A chip-scale and flip-chip capable power device was also developed. The novel package combined the ease of assembly of a discrete device with a performance exceeding a wire bonded module. It occupied a 14× smaller footprint than a discrete device, and offered power loop inductances which were less than a third of a conventional wire bonded module. A detailed manufacturing process flow and qualification is included in this dissertation. These novel devices were implemented in various electrical systems—a discrete Schottky barrier diode package, a half-bridge module with external gate drive, and finally a half-bridge with integrated gate driver in-module. The results of these investigations have been reported and their benefits assessed. The wire bondless modules showed \u3c 5% overshoot under all test conditions. No observable detrimental effects due to dv/dt were observed for any of the modules even under aggressive voltage slew rates of 20-25 V/ns

The inspection quality to detect scratch using robot vision

Automated Robotic vision helps to prevent quality problems from occurring.In this research, the concept and operation of robot inspection in fabricating the integrated circuit (IC) is being discussed comprehensively.The results showed the advantages and disadvantages of using this technology to further improve the quality of IC fabricatio

Cumulative index to NASA Tech Briefs, 1986-1990, volumes 10-14

Tech Briefs are short announcements of new technology derived from the R&D activities of the National Aeronautics and Space Administration. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This cumulative index of Tech Briefs contains abstracts and four indexes (subject, personal author, originating center, and Tech Brief number) and covers the period 1986 to 1990. The abstract section is organized by the following subject categories: electronic components and circuits, electronic systems, physical sciences, materials, computer programs, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics

The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for ‘power-by-the-hour’ commercial aircraft operation business models. [Continues.